Glass waveguide assemblies for OE-PCBs and methods of forming OE-PCBs

• US 10,459,160 B2
• Filed: 01/31/2017
• Issued: 10/29/2019
• Est. Priority Date: 01/31/2017
• Status: Active Grant

• Current Assignee: Corning Optical Communications LLC (Corning Incorporated)
• Original Assignee: Corning Optical Communications LLC (Corning Incorporated)
• Inventors: Brusberg, Lars Martin Otfried
• Primary Examiner(s): Lepisto, Ryan A
• Assistant Examiner(s): Chiem, Erin D
• Application Number:
  US15/420,549
• Publication Number:
  US 20180217326A1
• Time in Patent Office: 1,001 Days
• CPC Class Codes: G02B 2006/12038 Glass (SiO2 based materials)
• CPC Class Codes: G02B 2006/12102 Lens
• CPC Class Codes: G02B 2006/12183 Ion-exchange
• CPC Class Codes: G02B 6/122 Basic optical elements, e.g. light-guiding paths
• CPC Class Codes: G02B 6/1345 using ion exchange ion exchange in glass C03C21/00
• CPC Class Codes: G02B 6/30 for use between fibre and thin-film device
• CPC Class Codes: G02B 6/4204 the coupling comprising intermediate optical elements, e.g. lenses, holograms encapsulated active devices H01S5/02208, H01L33/52
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres
• CPC Class Codes: G02B 6/428 containing printed circuit boards [PCB]
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/053 Tails
• CPC Class Codes: H05K 2201/10446 Mounted on an edge

Abstract

The glass waveguide assembly includes a substrate with glass optical waveguides formed in the body of the glass substrate without adding or removing any glass from the substrate body. The glass optical waveguides run generally from a front-end section to a back-end section. A protective coating is formed over at least a portion of the top surface of the glass substrate where the glass optical waveguides reside. Optical connectors are formed at or adjacent the back end at corresponding connector regions. Each connector includes an end portion of at least one of the glass optical waveguides. In some configurations, the glass waveguide assembly includes a bend section that facilitates forming an optical interconnection in a photonic system between an optical-electrical printed circuit board and photonic integrated circuit.

Claims

1. A glass waveguide assembly, comprising:

a glass substrate comprising a body with a front-end section having a front end, a back-end section having a back end, a top surface extending parallel to an X-Y plane of the glass substrate, a bottom surface extending parallel to an X-Y plane of the glass substrate;

a waveguide array comprising a plurality of glass optical waveguides formed within a glass matrix of the body of the glass substrate, the glass optical waveguides running from the front-end section to the back-end section of the glass substrate and comprising respective optical end faces at the back end section of the glass substrate;

slots cut out of the back end of the glass substrate from the top surface of the glass substrate to the bottom surface of the glass substrate along an X-Z plane of the glass substrate to create waveguide sections in respective connector regions of the glass waveguide assembly, the slots separating the connector regions of the glass waveguide assembly along a direction X in the X-Z plane of the glass substrate;

a multi-fiber optical connector formed at or adjacent the back end of the glass substrate in each of the connector regions, each multi-fiber optical connector terminating the plurality of glass optical waveguides of the waveguide array at the respective optical end faces of the glass optical waveguides at the back end section of the glass substrate to provide optical communication to the plurality of glass optical waveguides formed within the glass matrix of the body of the glass substrate.

2. The glass waveguide assembly according to claim 1, wherein the multi-fiber optical connectors comprise connector portions that are displaced from the connector regions of the glass waveguide assembly along the direction X and reside in the slots of the glass substrate.

3. The glass waveguide assembly according to claim 2, wherein the body has a substantially constant thickness in the range between 20 microns and 500 microns and a length measured between the front end and the back end in the range of between 2 centimeters and 10 centimeters.

4. The glass waveguide assembly according to claim 2, wherein the connector portions residing in the slots of the glass substrate comprise alignment features to dictate alignment of optical fibers with the multi-fiber optical connectors.

5. The glass waveguide assembly according to claim 2, wherein the multi-fiber optical connectors comprise a connector housing defining a U-shaped interior section and a cover member sized to fit within the U-shaped interior section so that it is flush with a top surface of the connector housing with one of the waveguide section connector regions of the glass substrate positioned in the U-shaped interior section and covered by the cover member.

6. The glass waveguide assembly according to claim 1, wherein the body is flexible to form a bend section having a bend radius in the range from 5 millimeters to 30 millimeters.

7. The glass waveguide assembly according to claim 6, wherein the bend section causes the front-end section and the back-end section of the glass substrate to reside in parallel planes separated by a distance of no greater than 4 millimeters.

8. The glass waveguide assembly according to claim 1, wherein the waveguide sections are independently flexible.

9. The glass waveguide assembly according to claim 1, further comprising a protective coating formed over at least a portion of the top surface of the glass substrate adjacent to the at least one glass optical waveguide and a protective coating covering the bottom surface of the glass substrate at least up to the at least one connector region.

10. The glass waveguide assembly according to claim 9, wherein the protective coating does not cover the at least one connector region.

11. The glass waveguide assembly according to claim 1, wherein the glass substrate comprises an ion-exchangeable material.

12. The glass waveguide assembly according to claim 1, wherein the glass substrate comprises a K³⁰ ion-exchanged glass.

13. The glass waveguide assembly according to claim 1, further comprising at least one conducting feature formed either on the top surface of the glass substrate or on a top surface of the protective coating.

14. The glass waveguide assembly according to claim 1, further comprising at least one of a hole, a perforation, a through hole and a polymer-filled via.

15. The glass waveguide assembly according to claim 1, further comprising at least one of a cut-out and a polymer-filled cut-out.

16. The glass waveguide assembly according to claim 1, wherein the multi-fiber optical connector has an MT configuration.

17. The glass waveguide assembly according to claim 1, wherein the multi-fiber optical connector comprises a ferrule having an interior that encloses the connector region.

18. The glass waveguide assembly according to claim 1, wherein the multi-fiber optical connector comprises a microlens array having at least one microlens element disposed immediately adjacent an end of the at least one glass optical waveguide.

19. An optical-electrical printed circuit board (OE-PCB), comprising:

the glass waveguide assembly according to claim 1; and

a printed circuit board (PCB) that operably supports the glass waveguide assembly.

20. The OE-PCB according to claim 19, wherein the PCB operably supports a photonic integrated circuit (PIC) that includes at least one PIC waveguide, and wherein the glass waveguide assembly is operably supported adjacent a top surface of the PCB in a fly-over configuration such that the front-end section of the glass waveguide assembly includes a bend and wherein at least one glass optical waveguide of the plurality of glass optical waveguides is optically coupled to the at least one PIC waveguide.

21. The OE-PCB according to claim 19, wherein the PCB operably supports a photonic integrated circuit (PIC) that includes at least one PIC waveguide, and wherein the back-end section of the glass waveguide assembly is embedded within the PCB and the front-end section of the glass waveguide assembly includes a bend section and is disposed relative to the PIC such that at least one glass optical waveguide of the plurality of glass optical waveguides is optically coupled to the at least one PIC waveguide.

22. The OE-PCB according to claim 19, wherein:

the PCB comprises conductive layers spaced apart by insulating and at least a portion of the glass waveguide assembly is embedded in the PCB, different conductive layers of the PCB being in electrical communication through at least one conductive via formed in the glass waveguide assembly; and

the PCB operably supports a photonic integrated circuit (PIC) through an interposer, the PIC comprising at least one PIC waveguide, wherein at least one glass optical waveguide of the plurality of glass optical waveguides is in optical communication with the at least one PIC waveguide.

23. The OE-PCB according to claim 22, wherein the entire glass waveguide assembly is embedded within the PCB and wherein at least one glass optical waveguide of the plurality of glass optical waveguides is in optical communication with the at least one PIC waveguide through at least one optical via that includes at least one light-turning structure.

24. The OC-PCB according to claim 22, wherein the multi-fiber optical connector resides at or immediately adjacent an end of the PCB.

25. The OE-PCB according to claim 19, wherein:

the PCB operably supports a photonic integrated circuit (PIC) that includes at least one photonic device;

the back-end section of the glass waveguide assembly is embedded within the PCB and the front-end section includes a bend section and is disposed relative to the PIC such that at least one glass optical waveguide of the glass waveguide assembly is optically coupled to the at least one photonic device.

26. The OE-PCB according to claim 19, wherein:

the PCB comprises conductive layers spaced apart by insulating layers;

at least a portion of the glass waveguide assembly is embedded in the PCB and includes at least one conductive via;

different conductive layers of the PCB are in electrical communication through the at least one conductive via; and

a photonic integrated circuit (PIC) is operably supported by the PCB through an interposer, the PIC comprising at least one photonic device, and wherein at least one glass optical waveguide of the plurality of glass optical waveguides is in optical communication with the at least one photonic device.

27. The OE-PCB according to claim 19, wherein the multi-fiber optical connector comprises a ferrule that defines an MT configuration.