Optical module

• US 10,459,165 B2
• Filed: 01/10/2018
• Issued: 10/29/2019
• Est. Priority Date: 07/18/2017
• Status: Active Grant

• Current Assignee: Electronics and Telecommunications Research Institute
• Original Assignee: Electronics and Telecommunications Research Institute
• Inventors: Kwon, Won Bae, Lee, Jong Jin, Kang, Eun Kyu, Kim, Jeong Eun, Jung, Soo Yong
• Primary Examiner(s): Wong, Eric
• Application Number:
  US15/866,697
• Publication Number:
  US 20190025517A1
• Time in Patent Office: 657 Days
• Field of Search: 385 2, 385 39, 385 49, 385 89
• CPC Class Codes: G02B 6/26 Optical coupling means G02B6/36, G02B6/42 take precedence
• CPC Class Codes: G02B 6/3608 Fibre wiring boards, i.e. where fibres are embedded or attached in a pattern on or to a substrate, e.g. flexible sheets optical ribbon cables in support members G02B6/4401
• CPC Class Codes: G02B 6/3636 the mechanical coupling means being grooves G02B6/3652 takes precedence
• CPC Class Codes: G02B 6/4202 for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
• CPC Class Codes: G02B 6/4204 the coupling comprising intermediate optical elements, e.g. lenses, holograms encapsulated active devices H01S5/02208, H01L33/52
• CPC Class Codes: G02B 6/4245 Mounting of the opto-electronic elements
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres
• CPC Class Codes: G02B 6/4281 the printed circuit boards being flexible in general H05K1/147
• CPC Class Codes: G02F 1/0356 controlled by a high-frequency electromagnetic wave component in an electric waveguide structure
• CPC Class Codes: G02F 1/2255 controlled by a high-frequency electromagnetic component in an electric waveguide structure
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H05K 1/025 Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance H05K1/024 and H05K1/0243 take precedence; for semiconductor devices H01L23/66
• CPC Class Codes: H05K 1/05 Insulated conductive substrates, e.g. insulated metal substrate
• CPC Class Codes: H05K 2201/09154 Bevelled, chamferred or tapered edge
• CPC Class Codes: H05K 2201/10015 Non-printed capacitor
• CPC Class Codes: H05K 2201/10121 Optical component, e.g. opto-electronic component

Abstract

The present invention relates to an optical module, and more specifically, to an optical module which allows an optical coupling loss of an optical signal to be minimized and a frequency bandwidth thereof to be maximized. The optical module according to an embodiment of the present invention includes: a circuit substrate; an electronic element mounted on one surface of the circuit substrate; an optical element mounted on another surface perpendicular to the one surface of the circuit substrate; a capacitor mounted between the electronic element and the optical element; and an optical waveguide array on which an optical waveguide is disposed.

Claims

1. An optical module comprising:

a circuit substrate;

an electronic element mounted on one surface of the circuit substrate;

an optical element mounted on another surface perpendicular to the one surface of the circuit substrate;

a capacitor mounted on an inclined surface of the circuit substrate, the capacitor is mounted between the electronic element and the optical element; and

an optical waveguide array on which an optical waveguide is disposed,

wherein the optical waveguide is disposed to face the optical element.

2. The optical module of claim 1, wherein:

an inclined surface is formed between the one surface and the another surface; and

the capacitor is mounted on the inclined surface.

3. The optical module of claim 1, wherein the capacitor is connected in parallel to the electronic element and the optical element.

4. The optical module of claim 3, wherein:

the electronic element and the capacitor are connected via a first wire; and

the capacitor and the optical element are connected via a second wire.

5. The optical module of claim 1, wherein, the optical module is formed as a multi-channel optical module;

a number of electronic elements, a number of optical elements, and a number of capacitors corresponding to the number of channels are mounted on the circuit substrate; and

a number of optical waveguides corresponding to the number of the channels are provided on the optical waveguide array.

6. The optical module of claim 1, wherein, the optical waveguide array is coupled to the circuit substrate, the optical waveguide and the optical element are closely disposed to face each other.

7. The optical module of claim 1, wherein:

the circuit substrate is formed of a metal material; and

the circuit substrate formed of the metal material is used as a common ground of the electronic element, the optical element, and the capacitor.

8. The optical module of claim 1, wherein:

metal pads are formed on surfaces of the circuit substrate on which the electronic element, the optical element, and the capacitor are mounted; and

grounds of the electronic element, the optical element, and the capacitor are connected to the corresponding metal pads.

9. The optical module of claim 1, wherein a capacitance value of the capacitor is set according to an inductance component based on a length of the wire to perform impedance matching.

10. The optical module of claim 1, wherein capacitance is increased in proportion to an increase in inductance.

11. The optical module of claim 5, wherein the electronic elements, the optical elements, the capacitors, and the optical waveguides are each identical to their respective electronic element, optical element, capacitor, and optical waveguide of a single channel optical module.