Method and apparatus for chemical mechanical polishing process

• US 10,460,926 B2
• Filed: 04/27/2018
• Issued: 10/29/2019
• Est. Priority Date: 11/17/2017
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Peng, Chih-I, Yeh, Hsiu-Ming, Liu, Yi-Chang
• Primary Examiner(s): Alanko, Anita K
• Application Number:
  US15/964,632
• Publication Number:
  US 20190157071A1
• Time in Patent Office: 550 Days
• CPC Class Codes: B24B 37/10 for single side lapping
• CPC Class Codes: H01L 21/02057 Cleaning during device manufacture
• CPC Class Codes: H01L 21/02074 the processing being a planarization of conductive layers
• CPC Class Codes: H01L 21/30625 With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/67173 in-line arrangement
• CPC Class Codes: H01L 21/67219 comprising at least one polishing chamber polishing apparatuses B24B
• CPC Class Codes: H01L 21/67259 Position monitoring, e.g. misposition detection or presence detection
• CPC Class Codes: H01L 21/67748 horizontal transfer of a single workpiece

Abstract

A method for processing a semiconductor wafer is provided. The method includes transferring the semiconductor wafer from an interface tool to a Chemical Mechanical Polishing (CMP) tool. The method further includes polishing the semiconductor wafer with the CMP tool. The method also includes transferring the semiconductor wafer back to the interface tool from the CMP tool. In addition, the method includes converting a mixture to a mist spray and discharging the mist spray over the semiconductor wafer in the interface tool after the semiconductor wafer is polished by the CMP tool.

Claims

1. A method for processing a semiconductor wafer, comprising:

transferring the semiconductor wafer from an interface tool to a chemical mechanical polishing (CMP) tool;

polishing the semiconductor wafer with the CMP tool;

transferring the semiconductor wafer back to the interface tool from the CMP tool; and

converting a mixture into a mist spray and discharging the mist spray over the semiconductor wafer in the interface tool after the semiconductor wafer is polished by the CMP tool.

2. The method as claimed in claim 1, further comprising:

discharging another mist spray over the semiconductor wafer in the interface tool before the semiconductor wafer is polished by the CMP tool;

wherein the mist spray discharged over the semiconductor wafer before the semiconductor wafer is polished is different from the mist spray discharged over the semiconductor wafer after the semiconductor wafer is polished.

3. The method as claimed in claim 1, wherein the mist spray comprises NH4OH solution or benzotriazole (BTA) solution.

4. The method as claimed in claim 1, further comprising:

unloading the semiconductor wafer polished by the CMP tool from a polishing head of the CMP tool on a wafer stage of the interface tool;

wherein the mist spray is discharged over the semiconductor wafer while the semiconductor wafer is supported by the wafer stage.

5. The method as claimed in claim 1, wherein the mist spray is discharged through a number of spray nozzles, and the method further comprises:

controlling the mist spray discharged from one of the spray nozzles has a different flow rate than the mist spray discharged from another of the spray nozzles.

6. The method as claimed in claim 1, wherein the mist spray is discharged through a number of spray nozzles, and the method further comprises:

discharging the mist spray from two of the spray nozzles at different angles relative to the semiconductor wafer.

7. The method as claimed in claim 1, further comprising adjusting a pH value of the mixture according to material which is exposed after the semiconductor wafer is polished.

8. The method as claimed in claim 1, further comprising:

detecting the presence of the semiconductor wafer in the interface tool;

wherein the mist spray is discharged over the semiconductor wafer after a predetermined period of time following the detection of the presence of the semiconductor wafer on the wafer stage.

9. A method for cleaning a semiconductor wafer after a chemical mechanical polishing (CMP) process, comprising:

unloading a semiconductor wafer from a polishing head, which is configured for holding the semiconductor wafer during the CMP process, to a wafer stage;

converting a mixture into a mist spray and discharging the mist spray over the semiconductor wafer supported by the wafer stage;

transferring the semiconductor wafer from the wafer stage to a cleaning tool; and

cleaning the semiconductor wafer in the cleaning tool.

10. The method as claimed in claim 9, further comprising:

discharging another mist spray over a boundary of the semiconductor wafer and the polishing head before the semiconductor wafer is unloaded from the polishing head to the wafer stage.

11. The method as claimed in claim 9, wherein the mist spray comprises NH₄OH solution or benzotriazole (BTA) solution.

12. The method as claimed in claim 9, wherein the mist spray is discharged through a number of spray nozzles, and the method further comprises:

controlling the mist spray discharged from one of the spray nozzles so that it has a different flow rate than the mist spray discharged from another of the spray nozzles.

13. The method as claimed in claim 9, wherein the mist spray is discharged through a number of spray nozzles, and the method further comprises:

discharging the mist spray from two of the spray nozzles at different angles relative to the semiconductor wafer.

14. The method as claimed in claim 9, further comprising:

pausing the discharge of the mist spray over the semiconductor wafer after a time period elapses; and

resuming the discharge of the mist spray after an idle time.

15. The method as claimed in claim 9, further comprising:

detecting the presence of the semiconductor wafer on the wafer stage;

wherein the mist spray is discharged over the semiconductor wafer after a predetermined period of time following the detection of the presence of the semiconductor wafer on the wafer stage.

16. A method for processing a semiconductor wafer, comprising:

placing the semiconductor wafer in an interface tool;

transferring the semiconductor wafer from the interface tool to a chemical mechanical polishing (CMP) tool;

polishing the semiconductor wafer with the CMP tool;

transferring the semiconductor wafer back to the interface tool from the CMP tool;

converting a mixture into a mist spray and discharging the mist spray over the semiconductor wafer in the interface tool after the semiconductor wafer is polished by the CMP tool;

transferring the semiconductor wafer from the interface tool to a cleaning tool; and

cleaning the semiconductor wafer in the cleaning tool.

17. The method as claimed in claim 16, wherein the mist spray is discharged through a number of spray nozzles, and the method further comprises:

independently controlling a flow rate of the mist spray discharged from each spray nozzles.

18. The method as claimed in claim 16, wherein the mist spray is discharged through a number of spray nozzles, and the method further comprises:

discharging the mist spray from two of the spray nozzles at different angles relative to the semiconductor wafer.

19. The method as claimed in claim 16, further comprising adjusting a pH value of the mixture according to material which is exposed after the semiconductor wafer is polished.

20. The method as claimed in claim 16, the mist spray comprises NH₄OH solution or benzotriazole (BTA) solution.