×

Boltless substrate support assembly

  • US 10,460,978 B2
  • Filed: 03/08/2017
  • Issued: 10/29/2019
  • Est. Priority Date: 03/08/2017
  • Status: Active Grant
First Claim
Patent Images

1. A substrate support, comprising:

  • a conductive baseplate arranged to support a ceramic layer, the conductive baseplate including a first cavity extending along an axis perpendicular to a horizontal plane defined by the conductive baseplate; and

    a coupling assembly arranged within the first cavity, the coupling assembly comprisinga gear arranged within the first cavity and configured to rotate about the axis, anda pin arranged within the first cavity, the pin extending along the axis through the gear and into a second cavity below the conductive baseplate, wherein rotation of the gear causes the pin to move upward or downward relative to the conductive baseplate, and wherein the pin is retained within the second cavity when the gear is rotated to cause the pin to move downward into the second cavity, and wherein the pin does not extend to an upper surface of the conductive baseplate.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×