Semiconductor device and manufacturing method thereof
First Claim
1. A semiconductor device comprising:
- a semiconductor element;
a semiconductor substrate on which the semiconductor element is mounted, the substrate having a main surface;
a conductive layer formed on the substrate; and
a sealing resin covering the semiconductor element,wherein the substrate is formed with a recess receding from the main surface, the recess including a bottom surface and first and second sloped surfaces spaced apart from each other in a first direction perpendicular to a thickness direction of the substrate,the conductive layer includes first conduction paths on the first sloped surface, second conduction paths on the second sloped surface and bottom conduction paths on the bottom surface,the second sloped surface includes a plurality of regions that are line-symmetrical to the first conduction paths with respect to an imaginary line parallel to a second direction perpendicular to both the thickness direction of the substrate and the first direction, and the plurality of regions are without the second conduction paths,each of the bottom conduction paths includes a portion extending parallel to the second direction,said portion extending parallel to the second direction is in physical contact with an intersection between the bottom surface and the first or second sloped surface, andthe semiconductor element is a Hall-effect element.
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Accused Products
Abstract
A semiconductor device includes a semiconductor element, a semiconductor substrate on which the semiconductor element is mounted, a conductive layer formed on the substrate, and a sealing resin covering the semiconductor element. The substrate is formed with a recess receding from a main surface of the substrate and including a bottom surface and first and second sloped surfaces spaced apart from each other in a first direction perpendicular to the thickness direction of the substrate. The conductive layer includes first conduction paths on the first sloped surface, second conduction paths on the second sloped surface and bottom conduction paths on the bottom surface. The second sloped surface includes exposed regions line-symmetrical to the first conduction paths with respect to a line perpendicular to both the thickness direction of the substrate and the first direction, and the second conduction paths are not disposed at the exposed regions.
14 Citations
37 Claims
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1. A semiconductor device comprising:
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a semiconductor element; a semiconductor substrate on which the semiconductor element is mounted, the substrate having a main surface; a conductive layer formed on the substrate; and a sealing resin covering the semiconductor element, wherein the substrate is formed with a recess receding from the main surface, the recess including a bottom surface and first and second sloped surfaces spaced apart from each other in a first direction perpendicular to a thickness direction of the substrate, the conductive layer includes first conduction paths on the first sloped surface, second conduction paths on the second sloped surface and bottom conduction paths on the bottom surface, the second sloped surface includes a plurality of regions that are line-symmetrical to the first conduction paths with respect to an imaginary line parallel to a second direction perpendicular to both the thickness direction of the substrate and the first direction, and the plurality of regions are without the second conduction paths, each of the bottom conduction paths includes a portion extending parallel to the second direction, said portion extending parallel to the second direction is in physical contact with an intersection between the bottom surface and the first or second sloped surface, and the semiconductor element is a Hall-effect element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method of manufacturing a semiconductor device, the method comprising:
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forming at least one groove in a semiconductor substrate having a main surface in a manner such that the groove recedes from the main surface and has a bottom surface and first and second sloped surfaces spaced apart from each other in a first direction perpendicular to a thickness direction of the substrate, and that the groove extends in a second direction perpendicular to both the thickness direction of the substrate and the first direction; forming a conductive layer on the substrate including the groove; mounting semiconductor elements on the bottom surface and with intervals between the semiconductor elements, the semiconductor elements being accommodated in the groove; forming a sealing resin for covering the semiconductor elements; and cutting the substrate along the first direction and the second direction thereby dividing the substrate into individual pieces each including one of the semiconductor elements, wherein the forming of the conductive layer includes patterning by photolithography for forming the conductive layer on the substrate with the groove in a manner such that the photolithography forms first exposure regions at the first sloped surface and second exposure regions at the second sloped surface, and that none of the second exposure regions is line-symmetrical to any one of the first exposure regions with respect to an imaginary line parallel to the second direction, the patterning includes forming at least one bottom exposure region on the bottom surface, the bottom exposure region including an extension extending parallel to the second direction, and the bottom exposure region being connected to one of the first and the second exposure regions, and the extension of the bottom exposure region is in contact with an intersection between the bottom surface and one of the sloped surfaces. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37)
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Specification