Microelectronics package with an integrated heat spreader having indentations
First Claim
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1. A microelectronics package comprising:
- a first die;
a second die;
a third die; and
an integrated heat spreader, the integrated heat spreader including a first surface, the first surface defining;
a first indentation located in between the first die and the second die, anda second indentation located in between the third die and the first die and the second die.
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Abstract
Described herein are microelectronics packages and methods for manufacturing the same. The microelectronics package may include a first die, a second die, and an integrated heat spreader. The integrated heat spreader may include a first surface. The first surface may define a first indentation located in between the first die and the second die.
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Citations
25 Claims
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1. A microelectronics package comprising:
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a first die; a second die; a third die; and an integrated heat spreader, the integrated heat spreader including a first surface, the first surface defining; a first indentation located in between the first die and the second die, and a second indentation located in between the third die and the first die and the second die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of manufacturing a microelectronics package, the method comprising:
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attaching a first die, a second die, and a third die to a substrate; forming a first indentation in a first surface of an integrated heat spreader; forming a second indentation in the integrated heat spreader; and attaching the integrated heat spreader to the first die, the second die, and the third die such that; the first indentation is located in between the first die and the second die, and the second indentation is located in between the third die and the first die and the second die. - View Dependent Claims (14, 15, 16)
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17. A microelectronics package comprising:
- a first die;
a second die;
a third die; and
an integrated heat spreader, the integrated heat spreader including a first surface, the first surface defining;a first indentation located in between the first die and the second die, a second indentation located in between the first die and the third die, and a third indentation located in between the second die and the third die. - View Dependent Claims (18, 19, 20, 21, 22)
- a first die;
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23. A method of manufacturing a microelectronics package, the method comprising:
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attaching a first die, a second die, and a third die to a substrate;
forming a first indentation in a first surface of an integrated heat spreader;
forming a second indentation and a third indentation in the integrated heat spreader; and
attaching the integrated heat spreader to the first die, the second die, and the third die such that;the first indentation is located in between the first die and the second die, the second indentation is located in between the first die and the third die, and the third indentation is located in between the second die and the third die. - View Dependent Claims (24, 25)
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Specification