Dual-interface IC card module
First Claim
1. A dual-interface integrated circuit card module, the module comprising:
- a substrate having first and second opposing surfaces;
a contact pad on the first surface of the substrate;
an integrated circuit on the second surface of the substrate, the integrated circuit having electrical connections to the contact pad through the substrate; and
a pair of antenna pads for providing electrical contact, disposed in recesses in the second surface of the substrate and electrically connected to corresponding antenna connections on the integrated circuit,wherein the recesses pass through the substrate, the antenna pads being attached to a back surface of the contact pad with a non-conductive material, the non-conductive material in contact with the antenna pads and the contact pad, and the non-conductive material providing an insulating layer between the antenna pads and the contact pad.
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Accused Products
Abstract
The disclosure relates to a dual-interface integrated circuit (IC) card module for use in a dual-interface IC card. Embodiments disclosed include a dual-interface integrated circuit card module (150), the module comprising: a substrate (104) having first and second opposing surfaces; a contact pad (102) on the first surface of the substrate; an integrated circuit (110) on the second surface of the substrate (104), the integrated circuit (110) having electrical connections to the contact pad (102) through the substrate (104); and a pair of antenna pads (108) disposed in recesses (103) in the second surface of the substrate (104) and electrically connected to corresponding antenna connections on the integrated circuit (110).
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Citations
15 Claims
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1. A dual-interface integrated circuit card module, the module comprising:
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a substrate having first and second opposing surfaces; a contact pad on the first surface of the substrate; an integrated circuit on the second surface of the substrate, the integrated circuit having electrical connections to the contact pad through the substrate; and a pair of antenna pads for providing electrical contact, disposed in recesses in the second surface of the substrate and electrically connected to corresponding antenna connections on the integrated circuit, wherein the recesses pass through the substrate, the antenna pads being attached to a back surface of the contact pad with a non-conductive material, the non-conductive material in contact with the antenna pads and the contact pad, and the non-conductive material providing an insulating layer between the antenna pads and the contact pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A dual-interface integrated circuit card module, the module comprising:
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a substrate having first and second opposing surfaces; a contact pad on the first surface of the substrate; an integrated circuit on the second surface of the substrate, the integrated circuit having electrical connections to the contact pad through the substrate; and a pair of antenna pads for providing electrical contact, disposed in recesses in the second surface of the substrate and electrically connected to corresponding antenna connections on the integrated circuit, wherein each antenna pad comprises a laminate with a metal contact layer, wherein the recesses pass through the substrate, the antenna pads being attached to a back surface of the contact pad, and wherein an insulating layer is positioned between and in contact with both the antenna pad and the contact pad. - View Dependent Claims (11, 12, 13, 14, 15)
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Specification