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Dual-interface IC card module

  • US 10,461,057 B2
  • Filed: 09/30/2016
  • Issued: 10/29/2019
  • Est. Priority Date: 09/30/2015
  • Status: Active Grant
First Claim
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1. A dual-interface integrated circuit card module, the module comprising:

  • a substrate having first and second opposing surfaces;

    a contact pad on the first surface of the substrate;

    an integrated circuit on the second surface of the substrate, the integrated circuit having electrical connections to the contact pad through the substrate; and

    a pair of antenna pads for providing electrical contact, disposed in recesses in the second surface of the substrate and electrically connected to corresponding antenna connections on the integrated circuit,wherein the recesses pass through the substrate, the antenna pads being attached to a back surface of the contact pad with a non-conductive material, the non-conductive material in contact with the antenna pads and the contact pad, and the non-conductive material providing an insulating layer between the antenna pads and the contact pad.

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