LED packaging material and manufacturing method of the same

• US 10,461,228 B2
• Filed: 05/30/2019
• Issued: 10/29/2019
• Est. Priority Date: 05/12/2017
• Status: Active Grant

• Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: Wang, Haijun
• Primary Examiner(s): Choi, Calvin Y
• Application Number:
  US16/425,958
• Publication Number:
  US 20190280172A1
• Time in Patent Office: 152 Days
• Field of Search: None
• CPC Class Codes: C08K 3/04 Carbon
• CPC Class Codes: C08K 9/04 Ingredients treated with organic substances treated with macromolecular compounds C08K9/08
• CPC Class Codes: C08L 101/00 Compositions of unspecified macromolecular compounds
• CPC Class Codes: C08L 2201/08 Stabilised against heat, light or radiation or oxydation
• CPC Class Codes: C08L 2203/206 use in coating or encapsulating of electronic parts
• CPC Class Codes: H01L 33/005 Processes
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

A light-emitting diode (LED) packaging material is formed by compounding graphene with silane or epoxy resin, to improve the defects of manufacturing an LED packaging material only of silane or epoxy resin. The addition of graphene helps improve the performance of the LED packaging material. Also provided is a manufacturing method of a LED packaging material.

Claims

1. A method for manufacturing a light-emitting diode (LED) packaging material, comprising the following steps:

mixing graphene with a curing agent at a predetermined ratio to form a first mixed solution including a mixture of graphene and the curing agent;

providing epoxy resin and an accelerating agent with a predetermined ratio, and adding the epoxy resin and the accelerating agent into the first mixed solution of graphene and the curing agent to form a second mixed solution, which comprises the mixture of graphene and the curing agent that is added with epoxy resin and the accelerating agent; and

subjecting the second mixed solution to an ultrasonic process to form a material of a fully-mixed combination of graphene and epoxy resin,

wherein the first mixed solution is formed by mixing graphene and the curing agent before epoxy resin is added in the first mixed solution.

2. The method according to claim 1, wherein the curing agent is selected from a group consisting of one or more of methyltetrahydrophthalic anhydride, divinyltriamine, aminoethylpiperazine, 1,2-diaminocyclohexane, tetraethylenepentamine, bis methylaminopropylamine, dihexyltriamine, methylenebis-phenylenediamine;

wherein graphene is subjected to surface modification to add hydroxyl groups and/or carboxyl groups to a surface of graphene;

wherein the accelerating agent promots mutual dispersion or mutual dissolution among ingredients of the second mixed solution so as to enhance mixture of graphene and epoxy resin included in the second mixed solution.

3. The method according to claim 1, wherein in the second mixed solution formed of the curing agent, graphene, epoxy resin and the accelerating agent, a weight percentage of each of ingredient components of the second mixed solution is as follows:

the curing agent is 10%-40%;

graphene is 0.05%4%;

epoxy resin is 40%-60%; and

the accelerating agent is 0.5%-2%.

4. The method according to claim 1, wherein an operation of mixing graphene and the curing agent comprises operating an ultrasonic disperser to perform an ultrasonic process to the mixture of graphene and the curing agent, wherein a power of the ultrasonic 500 W-900 W and a duration is 3-5 hours.

5. The method according to claim 1, wherein the second mixed solution that comprises the mixture of graphene and the curing agent added that is added with epoxy resin and the accelerating agent is subjected to stirring with a glass rod to have ingredient components of the second mixed solution uniformly distributed before the ultrasonic process is carried out on the second mixed solution.

6. The method according to claim 1, wherein after the ultrasonic process carried out on the second mixed solution, an operation is carried out by subjecting the second mixed solution to baking at 60-80°

C. for 1 hour in a vacuum oven in order to remove air bubbles in the second mixed solution.

7. The method according to claim 3, wherein after the ultrasonic process carried out on the second mixed solution, an operation is carried out by subjecting the second mixed solution to baking at 60-80°

C. for 1 hour in a vacuum oven in order to remove air bubbles in the second mixed solution.

8. The method according to claim 5, wherein after the ultrasonic process carried out on the second mixed solution, an operation is carried out by subjecting the second mixed solution to baking at 60-80°

C. for 1 hour in a vacuum oven in order to remove air bubbles in the second mixed solution.