Method for fabricating LED package

• US 10,461,231 B2
• Filed: 05/02/2018
• Issued: 10/29/2019
• Est. Priority Date: 02/27/2018
• Status: Active Grant

• Current Assignee: Lumens Co., Ltd.
• Original Assignee: Lumens Co., Ltd.
• Inventors: Min, Chunki, Cho, Sangkeun, Lim, Jaeyoon, Oh, Seunghyun, Cho, Yungeon
• Primary Examiner(s): Yushin, Nikolay K
• Application Number:
  US15/969,758
• Publication Number:
  US 20190267523A1
• Time in Patent Office: 545 Days
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

Disclosed is a method for fabricating the light emitting device packages. The method includes: mounting and arranging light emitting device units on a substrate; attaching wavelength converting members to the respective light emitting device units mounted and arranged on the substrate; filling a reflective material between the light emitting device units attached with the wavelength converting members to form a reflective member; and vertically cutting the reflective material such that the reflective material surrounds the individual light emitting device units attached with the wavelength converting members. Also disclosed are light emitting device packages fabricated by the method.

Claims

1. A method for fabricating light emitting device packages, comprising:

preparing light emitting device units formed by arranging a plurality of light emitting devices on a sheet, filling a light transmitting material between the light emitting devices arranged on the sheet to form a light-transmitting member, curing the light-transmitting material, obliquely cutting the light-transmitting material relative to the individual light emitting devices and separating the individual light emitting devices from the sheet;

mounting and arranging the light emitting device units on a substrate;

attaching wavelength converting members to the respective light emitting device units mounted and arranged on the substrate;

filling a reflective material between the light emitting device units attached with the wavelength converting members to form a reflective member; and

vertically cutting the reflective material such that the reflective material surrounds the individual light emitting device units attached with the wavelength converting members.

2. The method according to claim 1, wherein the oblique cutting is performed such that the cross sections of the obliquely cut areas of the light-transmitting material are straight planes.

3. The method according to claim 1, wherein the distances between the obliquely cut areas of the light-transmitting material and the side surfaces of the light emitting device in each of the light emitting device units decrease downward.

4. The method according to claim 1, wherein the oblique cutting is performed such that the cross sections of the obliquely cut areas of the light-transmitting material are downwardly convex planes.

5. The method according to claim 1, wherein the oblique cutting is performed such that the light-transmitting material forms downwardly convex planes over its entire region.

6. The method according to claim 1, wherein the outer circumference of the wavelength converting member is larger than that of the light emitting device in each of the light emitting device packages.

7. The method according to claim 1, wherein the reflective member is made of white silicone.

8. The method according to claim 1, wherein the oblique cutting is performed such that the light-transmitting material is inclined over its entire region.

9. The method according to claim 8, wherein the distances between the light-transmitting material and the side surfaces of the light emitting device in each of the light emitting device units decrease downward.

10. The method according to claim 9, wherein the oblique cutting is performed such that the lower ends of the light-transmitting material are spaced apart from the side surfaces of the light emitting devices.