Condensation reaction-type die bonding agent, LED light emitting device and method for manufacturing same
First Claim
1. A condensation reaction-type die bonding agent for bonding an LED device provided on its surface with device electrodes having connection surfaces covered by gold, said die bonding agent comprising:
- (A) a polysilsesquioxane solid in state at room temperature having trisiloxy units (TA) expressed by R1SiO3/2 where, R1 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having hydroxyl groups;
(B) a polysilsesquioxane liquid in state at room temperature having 65 mol % to 100 mol % trisiloxy units (TB) expressed by R2SiO3/2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having —
OR2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group; and
(C) a condensation reaction catalyst.
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Abstract
A condensation reaction-type die bonding agent has little liability of poor electrical connection at the electrodes. A condensation reaction-type die bonding agent for bonding an LED device provided on its surface with device electrodes having connection surfaces covered by gold, where the die bonding agent includes (A) a polysilsesquioxane solid in state at room temperature having trisiloxy units (TA) expressed by R1SiO3/2 where, R1 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having hydroxyl groups, (B) a polysilsesquioxane liquid in state at room temperature having trisiloxy units (TB) expressed by R2SiO3/2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having —OR2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and (C) a condensation reaction catalyst.
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Citations
10 Claims
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1. A condensation reaction-type die bonding agent for bonding an LED device provided on its surface with device electrodes having connection surfaces covered by gold, said die bonding agent comprising:
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(A) a polysilsesquioxane solid in state at room temperature having trisiloxy units (TA) expressed by R1SiO3/2 where, R1 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having hydroxyl groups; (B) a polysilsesquioxane liquid in state at room temperature having 65 mol % to 100 mol % trisiloxy units (TB) expressed by R2SiO3/2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having —
OR2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group; and(C) a condensation reaction catalyst. - View Dependent Claims (2, 3, 4)
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5. A method for manufacturing an LED light emitting device comprising the steps of:
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using a die bonding agent to bond an LED device provided on its surface with device electrodes having connection surfaces covered by gold to a surface of a mounting substrate having substrate electrodes; connecting said substrate electrodes and said connection surfaces of said device electrodes by conductive interconnect members; and sealing said LED device by a sealing member, wherein said die bonding agent is a condensation reaction type bonding agent comprising; (A) a polysilsesquioxane solid in state at room temperature having trisiloxy units (TA) expressed by R1SiO3/2 where, R1 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having hydroxyl groups, (B) a polysilsesquioxane liquid in state at room temperature having 65 mol % to 100 mol % trisiloxy units (TB) expressed by R2SiO3/2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having —
OR2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and(C) a condensation reaction catalyst. - View Dependent Claims (6, 7)
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8. An LED light emitting device comprising:
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a mounting substrate having substrate electrodes; an LED device provided on its surface with device electrodes having connection surfaces covered with gold; a bonding member for bonding a front surface of said mounting substrate and a back surface of said LED device; conductive interconnect members with one ends connected to said substrate electrodes and with other ends connected to the connection surfaces of said device electrodes; and a sealing member for sealing said LED device, wherein said bonding member is obtained by a condensation reaction of (A) a polysilsesquioxane solid in state at room temperature having trisiloxy units (TA) expressed by R1SiO3/2 where, R1 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having hydroxyl groups, (B) a polysilsesquioxane liquid in state at room temperature having 65 mol % to 100 mol % trisiloxy units (TB) expressed by R2SiO3/2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having OR2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and (C) a condensation reaction catalyst. - View Dependent Claims (9, 10)
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Specification