Impedance compensation structure for broadband near-field magnetic-field probe and its construction method

• US 10,461,386 B2
• Filed: 04/08/2017
• Issued: 10/29/2019
• Est. Priority Date: 04/08/2016
• Status: Active Grant

• Current Assignee: Beihang University
• Original Assignee: Beihang University
• Inventors: Yan, Zhaowen, Wang, Jianwei, Zhang, Wei, Su, Donglin
• Primary Examiner(s): Nguyen, Tung X
• Assistant Examiner(s): Pothen, Feba
• Application Number:
  US15/482,735
• Publication Number:
  US 20170215274A1
• Time in Patent Office: 934 Days
• CPC Class Codes: G01R 29/0878 Sensors; antennas; probes; detectors wave guide measuring sections G01R1/24
• CPC Class Codes: G01R 31/001 Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing measuring electromagnetic fields G01R29/08; circuits for generating HV pulses in dielectric strength testing G01R31/14
• CPC Class Codes: G06F 30/00 Computer-aided design [CAD]
• CPC Class Codes: G06F 30/20 Design optimisation, verification or simulation optimisation, verification or simulation of circuit designs G06F30/30
• CPC Class Codes: G06F 30/36 Circuit design at the analogue level
• CPC Class Codes: G06F 30/367 Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods
• CPC Class Codes: H01P 3/08 Microstrips; Strip lines
• CPC Class Codes: H05K 1/0222 for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
• CPC Class Codes: H05K 1/0251 related to vias or transitions between vias and transmission lines

Abstract

An impedance compensation structure for a broadband near-field magnetic-field probe, includes: a signal via; and a plurality of grounding vias provided around the signal via to form a coaxial via array; wherein the grounding via and the signal via have an identical size, all distances of each of the plurality of the grounding vias to the signal via are equal, and the plurality of the grounding vias forms a circle centered at the signal via; wherein each of the plurality of the grounding vias is connected with a magnetic field probe top layer shield plane and a magnetic field probe bottom layer shield plane; each of the plurality of the grounding vias keeps in a conducting state from a direct current to a high frequency, in such a manner that impedance matching of the broadband near-field magnetic-field probe is achieved.

Claims

1. An impedance compensation structure for a broadband near-field magnetic-field probe, comprising:

a signal via; and

a plurality of grounding vias provided around the signal via to form a coaxial via array;

wherein the plurality of grounding vias and the signal via have an identical size, all distances between each of the plurality of the grounding vias and the signal via are equal, and the plurality of the grounding vias forms a circle centered at the signal via;

wherein each of the plurality of the grounding vias is connected with a magnetic field probe top layer shield plane and a magnetic field probe bottom layer shield plane;

each of the plurality of the grounding vias keeps in a conducting state from a direct current to a high frequency, in such a manner that impedance matching of the broadband near-field magnetic-field probe is achieved;

by regulating distances between each of the plurality of the grounding vias and the signal via and amounts of the plurality of the grounding vias to accomplish impedance changes caused by the signal via, so as to ensure impedance of the magnetic-field probe is continuous;

wherein one of the plurality of the grounding vias and the signal via are a pair of through holes;

wherein the plurality of the grounding vias is connected with the magnetic field probe top layer shield plane and the magnetic field probe bottom layer shield plane;

both the magnetic field probe top layer shield plane and the magnetic field probe bottom layer shield plane are connected with the with an external power source to ground;

each of the plurality of the grounding vias forms a capacitance with the signal via, wherein a value of a pair of through hole capacitance is calculated according to formula of;

2. The impedance compensation structure for the broadband near-field magnetic-field probe, as recited in claim 1, wherein the plurality of the grounding vias provides a current return path for signals, an inductance circuit is formed between the plurality of the grounding vias and the signal via;

wherein a value of a pair of through-hole inductance is calculated according to formula of;

3. The impedance compensation structure for the broadband near-field magnetic-field probe, as recited in claim 1, wherein the plurality of the grounding vias provides a current return path for signals, an inductance circuit is formed between the plurality of the grounding vias and the signal via;

wherein a value of a pair of through-hole inductance is calculated according to formula of;

4. The impedance compensation structure for the broadband near-field magnetic-field probe, as recited in claim 1, wherein the plurality of the grounding vias provides a current return path for signals, an inductance circuit is formed between the plurality of the grounding vias and the signal via;

wherein a value of a pair of through-hole inductance is calculated according to formula of;

5. The impedance compensation structure for the broadband near-field magnetic-field probe, as recited in claim 2, wherein a characteristic impedance between a pair of through hole is:

6. The impedance compensation structure for the broadband near-field magnetic-field probe, as recited in claim 3, wherein a characteristic impedance between a pair of through hole is:

7. The impedance compensation structure for the broadband near-field magnetic-field probe, as recited in claim 4, wherein a characteristic impedance between a pair of through hole is:

8. The impedance compensation structure for the broadband near-field magnetic-field probe, as recited in claim 2, wherein the plurality of the grounding vias around the coaxial array via are evenly distributed around the signal via;

electric charges are evenly distributed on the plurality of the grounding vias;

a capacitance of the coaxial via array is identical to a twin-lead;

the plurality of the grounding vias and the signal via form N pairs of in-parallel inductive circuits;

a value of an inductance of the coaxial via array is 1/N of the formula (2), and thus a characteristic impedance of the coaxial via array is;

9. The impedance compensation structure for the broadband near-field magnetic-field probe, as recited in claim 1, further comprising a miniature coaxial connector and a magnetic field probe body;

wherein the miniature coaxial connector is a SMA joint;

the magnetic field probe body is a four layered circuit board designed and manufactured based on PCB technique of printed circuit board;

the magnetic field probe body comprises the top layer shield plane, the bottom layer shield plane, a first middle layer, a strip line of a second middle layer, a signal via, a short-circuit hole, a coaxial via array around the short-circuit hole, a CB-CPW core conductor, and a barrier type via array on both sides of the CB-CPW core conductor;

the magnetic field probe body is in a T-shaped structure, wherein a convex end is a top end, and the other end is a bottom end;

the top end is for detection of a magnetic field signal, and the bottom end is for handhold and installation of a SMA joint;

the top layer shield plane has a top layer T-shaped gap on a top end thereof, and a bottom end of the top layer shield plane has a top layer rectangular gap;

wherein the T-shaped gap is for preventing the top layer shield plane from shielding the magnetic field signal;

the top layer rectangular gap is for preventing the CB-CPW core conductor from connecting with the top layer shield plane;

the bottom layer shield plane has a T-shaped gap having an identical shape with the T-shaped gap on the top layer shield plane, so as to present the bottom layer shield plane from shielding the magnetic field signal, and the bottom end of the magnetic field probe has not any gap;

a size of the T-shaped gap determines sensibility and spatial resolution of the magnetic field probe;

the magnetic field probe second middle layer

the strip line of the second middle layer is in an L shape, wherein one end of the strip line passes through the short-circuit hole to connect the top layer shield plane and the bottom layer shield plane on the T-shaped gap;

the strip line, the top layer T-shaped gap and the bottom layer T-shaped gap form an internal ring, so as to receive magnetic field from outside;

the internal ring is covered by the top layer shield plane and the bottom layer shield plane;

the CB-CPW core conductor is provided in the rectangular gap opened on the top layer shield plane, the top layer shield plane serves as a ground plane of the CB-CPW, the first middle layer serves as a metal back;

the CB-CPW core conductor serves as a feeder line, a first end of the CB-CPW core conductor is connected with the SMA joint and a second end of the CB-CPW core conductor is connected with the second end of the strip line by the signal via;

the grounding vias symmetrically distributed on both sides of the CB-CPW core conductor are connected with the top layer shield plane and the bottom layer shield plane to form the barrier type via array, so as to prevent the resonance of the magnetic field probe;

the grounding vias around the signal via are connected with the top layer shield plane and the bottom layer shield plane, distances between each of the plurality of the grounding vias and the signal via are equal and are at a range of 0.9-1.3 mm, so as to form the coaxial via array to achieve impedance matching of the broadband probe;

a length of the CB-CPW core conductor is at a range of 5-8 mm, a diameter of the signal via is at a range of 0.2 mm-0.3 mm;

horizontal distances between the signal via and periphery of both sides of the magnetic field probe are equal.

10. A construction method for an impedance compensation structure for a broadband near-field magnetic-field probe, comprising steps of:

step (1);

establishing a magnetic field probe model in a CST microwave studio;

performing simulation design on the CST microwave studio comprising;

simulation algorithm setting, simulation background setting, simulation boundary condition setting, simulation frequency setting and check TDR simulation setting;

step (2);

according to characteristics of the magnetic field probe, setting an amount of grounding vias at 6;

wherein a radius of the grounding vias is at 0.125 mm which is a minimum permissible radius in machine drilling, a target impedance to be compensated is 50Ω

; and

a distance between a grounding via and each of a plurality of signal vias is calculated at 0.9 mm according to a formula

11. The construction method for the impedance compensation structure for the broadband near-field magnetic-field probe, as recited in claim 10, wherein in the step (1), the simulation algorithm is a time domain simulation;

simulation background is Normal, meaning is vacuum, simulation boundary condition is electric wall, simulation frequency is at a range of 0-20 GHz, TDR Analysis IS checked.

12. The construction method for the impedance compensation structure for the broadband near-field magnetic-field probe, as recited in claim 10, wherein the broadband near-field magnetic-field probe comprises a miniature coaxial connector and a magnetic field probe body;

wherein the miniature coaxial connector is a SMA joint;

the magnetic field probe body is a four layered circuit board designed and manufactured based on PCB technique of printed circuit board;

the magnetic field probe body comprises the top layer shield plane, the bottom layer shield plane, a first middle layer, a strip line of a second middle layer, a signal via, a short-circuit hole, a coaxial via array around the short-circuit hole, a CB-CPW core conductor, and a barrier type via array on both sides of the CB-CPW core conductor;

the magnetic field probe body is in a T-shaped structure, wherein a convex end is a top end, and the other end is a bottom end;

the top end is for detection of a magnetic field signal, and the bottom end is for handhold and installation of a SMA joint;

the top layer shield plane has a top layer T-shaped gap on a top end thereof, and a bottom end of the top layer shield plane has a top layer rectangular gap;

wherein the T-shaped gap is for preventing the top layer shield plane from shielding the magnetic field signal;

the top layer rectangular gap is for preventing the CB-CPW core conductor from connecting with the top layer shield plane;

the bottom layer shield plane has a T-shaped gap having an identical shape with the T-shaped gap on the top layer shield plane, so as to present the bottom layer shield plane from shielding the magnetic field signal, and the bottom end of the magnetic field probe has not any gap;

a size of the T-shaped gap determines sensibility and spatial resolution of the magnetic field probe;

the magnetic field probe second middle layer

the strip line of the second middle layer is in an L shape, wherein one end of the strip line passes through the short-circuit hole to connect the top layer shield plane and the bottom layer shield plane on the T-shaped gap;

the strip line, the top layer T-shaped gap and the bottom layer T-shaped gap form an internal ring, so as to receive magnetic field from outside;

the internal ring is covered by the top layer shield plane and the bottom layer shield plane;

the CB-CPW core conductor is provided in the rectangular gap opened on the top layer shield plane, the top layer shield plane serves as a ground plane of the CB-CPW, the first middle layer serves as a metal back;

the CB-CPW core conductor serves as a feeder line, a first end of the CB-CPW core conductor is connected with the SMA joint and a second end of the CB-CPW core conductor is connected with the second end of the strip line by the signal via;

the grounding vias symmetrically distributed on both sides of the CB-CPW core conductor are connected with the top layer shield plane and the bottom layer shield plane to form the barrier type via array, so as to prevent the resonance of the magnetic field probe;

the grounding vias around the signal via are connected with the top layer shield plane and the bottom layer shield plane, distances between each of the plurality of the grounding vias and the signal via are equal and are at a range of 0.9-1.3 mm, so as to form the coaxial via array to achieve impedance matching of the broadband probe;

a length of the CB-CPW core conductor is at a range of 5-8 mm, a diameter of the signal via is at a range of 0.2 mm-0.3 mm;

horizontal distances between the signal via and periphery of both sides of the magnetic field probe are equal.