Method and system for surface modification of substrate for ion beam target

• US 10,462,893 B2
• Filed: 06/05/2017
• Issued: 10/29/2019
• Est. Priority Date: 06/05/2017
• Status: Active Grant

• Current Assignee: Neutron Therapeutics Inc.
• Original Assignee: Neutron Therapeutics Inc.
• Inventors: Park, Jr., William H., Lambert, Mark, Gillespie, Joseph, Smick, Noah, Sakase, Takao
• Primary Examiner(s): Davis, Sharon M
• Application Number:
  US15/613,961
• Publication Number:
  US 20180352643A1
• Time in Patent Office: 876 Days
• CPC Class Codes: A61N 2005/109 Neutrons
• CPC Class Codes: G21G 4/02 Neutron sources
• CPC Class Codes: H05H 6/00 Targets for producing nuclear reactions supports for targets or objects to be irradiated G21K5/08 ; preparation of tritium C01B4/00; targets, e.g. pellets for fusion reactions by laser or charged particles beam injection H05H1/22

Abstract

Design and making methods of a neutrons generating target are described. In some embodiments, a surface of a target substrate can be modified to form one or more surface features. In some embodiments, a neutron source layer can be disposed on the surface of the target substrate. In some embodiments, the neutron source layer and the target substrate can be heated to an elevated temperature to form a bond between the two. In some embodiments, the surface modification of the target substrate can reduce blistering and material exfoliation in the target. The target can be used in boron neutron capture therapy.

Claims

1. A method for making a neutron generating target, the method comprising:

modifying a surface of a target substrate to form one or more surface features; and

disposing a neutron source layer on the surface of the target substrate,

wherein the one or more surface features have a height that is less than a thickness of the neutron source layer.

2. The method of claim 1, wherein the modifying a surface of a target substrate comprises a material removal process or a material addition process.

3. The method of claim 2, wherein the material removal process comprises abrasive blasting, etching, or polishing.

4. The method of claim 2, wherein the material addition process comprises vacuum deposition, plating, or printing.

5. The method of claim 1, wherein the disposing a neutron source layer on the surface of the target substrate comprises pressing the neutron source layer on the surface of the target substrate, or depositing the neutron source layer on the surface of the target substrate by evaporation.

6. The method of claim 1, further comprising heating the neutron source layer and the target substrate to an elevated temperature for a duration of time to form a bond between the neutron source layer and the target substrate.

7. The method of claim 6, wherein the elevated temperature is between about 100 degrees Celsius and about 500 degrees Celsius.

8. The method of claim 6, wherein the duration of time is between about 0.1 hours and about 10 hours.

9. The method of claim 1, wherein the target substrate comprises at least one of copper, aluminum, titanium, molybdenum, and stainless steel.

10. The method of claim 1, wherein the neutron source layer comprises at least one of lithium, beryllium, and carbon.

11. The method of claim 1, further comprising modifying a top surface of the neutron source layer to form one or more additional surface features.

12. A neutron generating target comprising:

a target substrate having an uneven surface wherein the uneven surface comprises one or more surface features; and

a neutron source layer disposed on the surface of the target substrate and bonded to the target substrate

wherein the one or more surface features have a height that is less than a thickness of the neutron source layer.

13. The target of claim 12, wherein the one or more surface features are recessed into the target substrate.

14. The target of claim 13, wherein the one or more surface features have a depth of between about 1 micron and about 50 microns.

15. The target of claim 12, wherein the one or more surface features protrude from the target substrate.

16. The target of claim 15, wherein the one or more surface features have a height of between about 1 micron and about 50 microns.

17. The target of claim 12, wherein the one or more surface features comprise a plurality of surface features with an average pitch of between about 1 micron and about 50 microns.

18. The target of claim 12, wherein the target substrate comprises at least one of copper, aluminum, titanium, molybdenum, and stainless steel.

19. The target of claim 12, wherein the neutron source layer comprises at least one of lithium, beryllium, and carbon.

20. The target of claim 12, wherein the neutron source layer has a thickness of between about 10 microns and about 500 microns.