Electronic device and method for assembling the same
First Claim
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1. An electronic device comprising:
- a display substrate including a screen area and a peripheral area in which a first conductive pattern is formed, the peripheral area surrounding at least a portion of the screen area;
a connector on which a second conductive pattern is formed, the connector including a curved portion;
a conductive bonding layer disposed between the peripheral area of the display substrate and the connector, and electrically connecting the first conductive pattern and the second conductive pattern; and
a cutting part disposed through the display substrate, the conductive bonding layer, and the connector,wherein the cutting part includes a first portion surrounded by the peripheral area of the display substrate, and a second portion surrounded by the curved portion of the connector.
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Abstract
An electronic device is provided. The electronic device includes a display substrate and a connector connected to one side of the display substrate and having a dummy pattern. A cutting part is formed in the display substrate and the connector, and the cutting part is formed adjacent to the dummy pattern.
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Citations
19 Claims
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1. An electronic device comprising:
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a display substrate including a screen area and a peripheral area in which a first conductive pattern is formed, the peripheral area surrounding at least a portion of the screen area; a connector on which a second conductive pattern is formed, the connector including a curved portion; a conductive bonding layer disposed between the peripheral area of the display substrate and the connector, and electrically connecting the first conductive pattern and the second conductive pattern; and a cutting part disposed through the display substrate, the conductive bonding layer, and the connector, wherein the cutting part includes a first portion surrounded by the peripheral area of the display substrate, and a second portion surrounded by the curved portion of the connector. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An electronic device comprising:
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a display substrate; a connector connected to one side of the display substrate; and an opening extending from a portion of the display substrate to a portion of the connector, wherein the connector includes a dummy pattern extending along a periphery of the opening, and a via hole formed between the dummy pattern and the opening, wherein at least a portion of the via hole is connected to the opening, and wherein the connector is bent such that a portion of the opening formed in the connector and the display substrate is aligned with a remaining portion of the opening formed in the connector.
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13. An electronic device comprising:
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a housing comprising a first plate facing a first direction and a second plate facing a second direction opposite to the first direction; a display disposed within the housing and exposed through the first plate; and a component disposed adjacent to the display, when viewed from the top of the first plate, wherein the display comprises; a display substrate having;
a first surface disposed in parallel to the first plate and facing the first direction, a second surface facing the second direction, and a third surface facing a third direction that is substantially perpendicular to the first surface; anda connector having;
a first part disposed on the first surface, a second part disposed on the second surface, and a third part extending from the first part to the second part and covering at least a portion of the third surface,wherein a peripheral portion of the display substrate comprises a recess, wherein portions of the first part, the second part, and the third part of the connector are cut along the recess of the display substrate, when viewed from above the first plate, wherein the connector comprises; a first non-conductive layer facing the first direction; a second non-conductive layer facing the second direction; and a metal pad or pattern disposed along at least a portion of a periphery of the recess and inserted between the first non-conductive layer and the second non-conductive layer, in which the metal pad or pattern is electrically isolated, and wherein at least a portion of the component is disposed in the recess, when viewed from above the first plate. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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Specification