Printed three-dimensional (3D) functional part and method of making

• US 10,462,907 B2
• Filed: 06/24/2014
• Issued: 10/29/2019
• Est. Priority Date: 06/24/2013
• Status: Active Grant

• Current Assignee: President and Fellows of Harvard College (Harvard Corporation)
• Original Assignee: President and Fellows of Harvard College (Harvard Corporation)
• Inventors: Lewis, Jennifer A., Bell, Michael A., Busbee, Travis A., Minardi, II, John E.
• Primary Examiner(s): Lee, Pete T
• Application Number:
  US14/900,860
• Publication Number:
  US 20160198576A1
• Time in Patent Office: 1,953 Days
• CPC Class Codes: B29C 64/106 using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
• CPC Class Codes: B29C 64/118 using filamentary material being melted, e.g. fused deposition modelling [FDM]
• CPC Class Codes: B29C 70/72 Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components B29C70/742 takes precedence
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: H01L 21/4803 Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks H01L21/4846 takes precedence; printed circuit boards H05K1/00
• CPC Class Codes: H01L 21/4867 Applying pastes or inks, e.g. screen printing H01L21/486 takes precedence
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2224/24145 the bodies being stacked
• CPC Class Codes: H01L 2224/27312 Continuous flow, e.g. using a microsyringe, a pump, a nozzle or extrusion
• CPC Class Codes: H01L 2224/75702 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/76 Apparatus for connecting with build-up interconnects
• CPC Class Codes: H01L 2224/76155 Jetting means, e.g. ink jet
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/27 : Manufacturing methods
• CPC Class Codes: H01L 24/743 : Apparatus for manufacturing layer connectors
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/82 : by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/92 : Specific sequence of method steps
• CPC Class Codes: H01L 25/065 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01M 2004/022 : Electrodes made of one single microscopic fiber
• CPC Class Codes: H01M 4/0411 : by extrusion
• CPC Class Codes: H04R 25/658 : Manufacture of housing parts
• CPC Class Codes: H05K 1/0284 : Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/185 : Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 1/186 : manufactured by mounting on or connecting to patterned circuits before or during embedding
• CPC Class Codes: H05K 3/1241 : by ink-jet printing or drawing by dispensing
• CPC Class Codes: H05K 3/125 : by ink-jet printing
• CPC Class Codes: H05K 7/02 : Arrangements of circuit components or wiring on supporting structure
• CPC Class Codes: Y02E 60/10 : Energy storage using batteries

Abstract

A printed 3D functional part includes a 3D structure comprising a structural material, and at least one functional electronic device is at least partially embedded in the 3D structure. The functional electronic device has a base secured against an interior surface of the 3D structure. One or more conductive filaments are at least partially embedded in the 3D structure and electrically connected to the at least one functional electronic device.

Claims

1. A printed three-dimensional (3D) functional part comprising:

a 3D structure comprising a structural material;

at least one functional electronic device at least partially embedded in the 3D structure and having a base secured against an interior surface thereof; and

one or more conductive filaments at least partially embedded in the 3D structure and electrically connected to the at least one functional electronic device, wherein each of the one or more conductive filaments comprises a percolating network of conductive particles, and wherein at least one of the one or more conductive filaments is unsupported by the 3D structure along only a portion of a length thereof.

2. The printed 3D functional part of claim 1, wherein the at least one functional electronic device is selected from the group consisting of electromechanical components, electrochemical components, active electronic components, passive electronic components, and integrated circuits.

3. The printed 3D functional part of claim 1, comprising a plurality of the functional electronic devices, each of the functional electronic devices having a base secured against the interior surface of the 3D structure.

4. The printed 3D functional part of claim 1, wherein at least one of the one or more conductive filaments follows a nonplanar pathway between connection points.

5. The printed 3D functional part of claim 1, wherein each of the one or more conductive filaments comprises a diameter or width of about 500 microns or less.

6. The printed 3D functional part of claim 1, wherein each of the one or more conductive filaments is an extruded filament.

7. The printed 3D functional part of claim 1, wherein each of the one or more conductive filaments has a substantially cylindrical shape.

8. The printed 3D functional part of claim 1, wherein a transverse cross-sectional shape of each of the one or more conductive filaments is a curved shape without corners.

9. The printed 3D functional part of claim 1, wherein the one or more conductive filaments comprise a conductive material selected from the group consisting of:

silver, copper, lead, tin, lithium, cobalt, gold, platinum, palladium, titanium, molybdenum, tungsten, tantalum, rhenium, zirconium, vanadium, chromium, niobium, iron, nickel, zinc, aluminum, magnesium, and carbon.

10. The printed 3D functional part of claim 9, wherein the conductive particles comprise silver flakes.

11. The printed 3D functional part of claim 1, wherein each of the one or more conductive filaments exhibits a conductivity of at least about 2.5% a bulk conductivity of the conductive material.

12. The printed 3D functional part of claim 1, wherein the structural material comprises a polymer.

13. The printed 3D functional part of claim 12, wherein the polymer is selected from the group consisting of consisting of acrylonitrile butadiene styrene (ABS), polylactic acid (PLA), poly(methyl methacrylate) (PMMA), epoxy, polydimethylsiloxane (PDMS), polyimide (Nylon), polyimide (PI), polyethylene (PE), polypropylene (PP), polystyrene (PS), polytetrafluorethylene (PTFE), polyvinylchloride (PVC), polyurethane PU), polycarbonate (PC), photocurable resins, epoxies, and hydrogels.

14. The printed 3D functional part of claim 1, wherein the structural material comprises a ceramic.

15. The printed 3D functional part of claim 14, wherein the ceramic is selected from the group consisting of oxides, carbides, borides, nitrides, and silicides.

16. The printed 3D functional part of claim 1, wherein the structural material comprises a composite.

17. The printed 3D functional part of claim 16, wherein the composite comprises filler particles comprising a ceramic or glass incorporated in a polymeric matrix.

18. The printed 3D functional part of claim 3, wherein the base of at least one of the functional electronic devices is oriented at a non-zero angle with respect to the bases of other of the functional electronic devices.

19. The printed 3D functional part of claim 1 comprising a hearing aid or a cell phone housing.

20. A printed three-dimensional (3D) functional part comprising:

a 3D structure comprising a structural material;

at least one functional electronic device at least partially embedded in the 3D structure and having a base secured against an interior surface thereof; and

one or more conductive filaments at least partially embedded in the 3D structure and electrically connected to the at least one functional electronic device, wherein at least one of the one or more conductive filaments is unsupported by the 3D structure along only a portion of a length thereof.

21. The printed three-dimensional (3D) functional part of claim 20, wherein the one or more conductive filaments comprise from about 70 wt. % to about 99.9 wt. % conductive particles.