Semiconductor device
First Claim
1. A semiconductor device comprising:
- a cooling jacket having an inlet for coolant and an outlet for the coolant;
a base plate;
a first semiconductor element provided on the base plate;
a second semiconductor element provided on the base plate;
a first fin provided directly under the first semiconductor element on a back surface of the base plate and placed within the cooling jacket;
a second fin provided directly under the second semiconductor element on the back surface of the base plate and placed within the cooling jacket; and
a separator provided within the cooling jacket, the separator having a first surface facing a first portion of the back surface of the base plate at which the first fin is provided, and a second surface facing a second portion of the back surface of the base plate at which the second fin is provided, and the separator being configured to divide the coolant entering the cooling jacket through the inlet into portions that pass through a first space between the first surface and the first portion of the back surface of the base plate past the first fin, and through a second space between the second surface and the second portion of the back surface of the base plate past the second fin, to respectively cool the first fin and the second fin,wherein the separator is a separate structure from the cooling jacket.
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Accused Products
Abstract
A semiconductor device includes a cooling jacket having an inlet for coolant and an outlet for the coolant, a base plate, a first semiconductor element provided on the base plate, a second semiconductor element provided on the base plate, a first fin provided directly under the first semiconductor element on a back surface of the base plate and placed within the cooling jacket, a second fin provided directly under the second semiconductor element on the back surface of the base plate and placed within the cooling jacket, and a separator provided within the cooling jacket to divide the coolant entering the cooling jacket through the inlet into portions respectively cooling the first fin and the second fin.
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Citations
16 Claims
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1. A semiconductor device comprising:
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a cooling jacket having an inlet for coolant and an outlet for the coolant; a base plate; a first semiconductor element provided on the base plate; a second semiconductor element provided on the base plate; a first fin provided directly under the first semiconductor element on a back surface of the base plate and placed within the cooling jacket; a second fin provided directly under the second semiconductor element on the back surface of the base plate and placed within the cooling jacket; and a separator provided within the cooling jacket, the separator having a first surface facing a first portion of the back surface of the base plate at which the first fin is provided, and a second surface facing a second portion of the back surface of the base plate at which the second fin is provided, and the separator being configured to divide the coolant entering the cooling jacket through the inlet into portions that pass through a first space between the first surface and the first portion of the back surface of the base plate past the first fin, and through a second space between the second surface and the second portion of the back surface of the base plate past the second fin, to respectively cool the first fin and the second fin, wherein the separator is a separate structure from the cooling jacket. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A semiconductor device comprising:
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a cooling jacket having an inlet for coolant and an outlet for the coolant, the outlet comprising a first outlet and a second outlet; a base plate; a first semiconductor element provided on the base plate; a second semiconductor element provided on the base plate; a first fin provided directly under the first semiconductor element on a back surface of the base plate and placed within the cooling jacket; a second fin provided directly under the second semiconductor element on the back surface of the base plate and placed within the cooling jacket; a separator provided within the cooling jacket to divide the coolant entering the cooling jacket through the inlet into portions respectively cooling the first fin and the second fin, wherein the coolant cooling the first fin is discharged through the first outlet, the coolant cooling the second fin is discharged through the second outlet, and the separator is a separate structure from the cooling jacket and comprises; a first guide portion for leading the coolant entering through the inlet to a space between the first fin and the second fin; and a second guide portion for leading the coolant between the first fin and the second fin toward the first fin and the second fin; a first temperature measurement portion for measuring temperature of the first semiconductor element; a second temperature measurement portion for measuring temperature of the second semiconductor element; a first regulator for adjusting an amount of the coolant discharged through the first outlet; a second regulator for adjusting an amount of the coolant discharged through the second outlet; and a controller for controlling the first regulator and the second regulator, wherein the controller controls the first regulator to increase the amount of the coolant discharged through the first outlet if the temperature measured by the first temperature measurement portion is higher than the temperature measured by the second temperature measurement portion, and controls the second regulator to increase the amount of the coolant discharged through the second outlet if the temperature measured by the second temperature measurement portion is higher than the temperature measured by the first temperature measurement portion. - View Dependent Claims (14)
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15. A semiconductor device comprising:
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a cooling jacket having an inlet for coolant and an outlet for the coolant, the outlet comprising a first outlet and a second outlet; a base plate; a first semiconductor element provided on the base plate; a second semiconductor element provided on the base plate; a first fin provided directly under the first semiconductor element on a back surface of the base plate and placed within the cooling jacket; a second fin provided directly under the second semiconductor element on the back surface of the base plate and placed within the cooling jacket; a separator provided within the cooling jacket to divide the coolant entering the cooling jacket through the inlet into portions respectively cooling the first fin and the second fin, wherein the coolant cooling the first fin is discharged through the first outlet, the coolant cooling the second fin is discharged through the second outlet, and the separator is a separate structure from the cooling jacket and comprises; a first guide portion for leading the coolant entering through the inlet to a space between the first fin and the second fin; and a second guide portion for leading the coolant between the first fin and the second fin toward the first fin and the second fin; a first temperature measurement portion for measuring temperature of the first semiconductor element; a second temperature measurement portion for measuring temperature of the second semiconductor element; a regulator for adjusting an amount of the coolant discharged through the second outlet; and a controller for controlling the regulator, wherein the controller controls the regulator to reduce the amount of the coolant discharged through the second outlet if the temperature measured by the first temperature measurement portion is higher than the temperature measured by the second temperature measurement portion, and controls the regulator to increase the amount of the coolant discharged through the second outlet if the temperature measured by the second temperature measurement portion is higher than the temperature measured by the first temperature measurement portion. - View Dependent Claims (16)
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Specification