Ruggedized wafer level MEMS force sensor with a tolerance trench

• US 10,466,119 B2
• Filed: 06/10/2016
• Issued: 11/05/2019
• Est. Priority Date: 06/10/2015
• Status: Active Grant

• Current Assignee: NextInput Inc. (Qorvo, Inc.)
• Original Assignee: NextInput Inc. (Qorvo, Inc.)
• Inventors: Campbell, Ian, Diestelhorst, Ryan, Benjamin, Dan, Nasiri, Steven S.
• Primary Examiner(s): Patel, Harshad R
• Assistant Examiner(s): Plumb, Nigel H
• Application Number:
  US15/178,976
• Publication Number:
  US 20160363490A1
• Time in Patent Office: 1,243 Days
• CPC Class Codes: G01L 1/18 using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
• CPC Class Codes: G01L 1/26 Auxiliary measures taken, or devices used, in connection with the measurement of force, e.g. for preventing influence of transverse components of force, for preventing overload

Abstract

An example MEMS force sensor is described herein. The MEMS force sensor can include a cap for receiving an applied force and a sensor bonded to the cap. A trench and a cavity can be formed in the sensor. The trench can be formed along at least a portion of a peripheral edge of the sensor. The cavity can define an outer wall and a flexible sensing element, and the outer wall can be arranged between the trench and the cavity. The cavity can be sealed between the cap and the sensor. The sensor can also include a sensor element formed on the flexible sensing element. The sensor element can change an electrical characteristic in response to deflection of the flexible sensing element.

Claims

1. A microelectromechanical (MEMS) force sensor, comprising:

a cap for receiving an applied force;

a sensor bonded to the cap, the sensor comprising;

a trench formed in the sensor along at least a portion of a peripheral edge of the sensor, and a cavity formed in the sensor, the cavity defining an outer wall and at least one flexible sensing element, the outer wall being arranged between the trench and the cavity, and the cavity being sealed between the cap and the sensor; and

a sensor device formed on the at least one flexible sensing element, wherein the sensor device is configured to change an electrical characteristic in response to deflection of the at least one flexible sensing element.

2. The MEMS force sensor of claim 1, wherein a thickness of at least a portion of the outer wall is determined by a size of the trench.

3. The MEMS force sensor of claim 2, wherein the thickness of the portion of the outer wall is configured to provide a predetermined level of force-measurement sensitivity.

4. The MEMS force sensor of claim 1, wherein the trench is configured to isolate the portion of the outer wall from a dicing blade.

5. The MEMS force sensor of claim 1, wherein the trench and the cavity are etched from the sensor, and wherein a depth of the trench and a depth of the cavity are approximately equal.

6. The MEMS force sensor of claim 1, wherein the sensor and the cap are bonded along at least a portion of the outer wall.

7. The MEMS force sensor of claim 1, wherein the cavity further defines at least one boss that extends from the outer wall inwardly toward a center of the sensor.

8. The MEMS force sensor of claim 7, wherein the sensor and the cap are bonded along at least a portion of the at least one boss.

9. The MEMS force sensor of claim 1, further comprising a gap formed in at least one of the cap or the sensor, wherein a depth of the gap is configured to limit an amount of the deflection of the at least one flexible sensing element.

10. The MEMS force sensor of claim 9, wherein the sensor comprises a center and the peripheral edge, and wherein the gap overlaps with the center of the sensor.

11. The MEMS force sensor of claim 1, wherein the cavity comprises a volume entirely enclosed between the cap and the sensor.

12. The MEMS force sensor of claim 1, wherein the cavity further defines a plurality of flexible sensing elements.