Integrated light-emitting diode arrays for displays
First Claim
1. A device comprising:
- a semiconductor substrate having a first side and a second side, the first and second sides being opposite sides of the semiconductor substrate;
an array of light-emitting pixels monolithically formed on the first side, each of the light-emitting pixels including at least one light-emitting element and at least one non-volatile memory coupled to the at least one light-emitting element, the at least one non-volatile memory including at least one transistor, the at least one light-emitting element comprising multiple layers epitaxially grown on a semiconductor surface of the semiconductor substrate on the first side;
control electronics formed on the second side; and
interconnects penetrating through the semiconductor substrate and conductively coupling the array of pixels on the first side to the control electronics on the second side, such that the pixels are controllable by the control electronics.
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Abstract
Integrated light-emitting diode (LED) arrays based devices or systems and methods of forming the integrated LED arrays based devices or systems are provided. In one aspect, an integrated active-matrix LED display includes a silicon substrate including a first side and a second side, an array of active-matrix LED pixels formed on the first side, each LED pixel including at least one LED and at least one non-volatile memory coupled to the at least one LED, display drivers formed on the first side and coupled to the LED pixels, integrated circuits formed on the second side, and conductive electrodes penetrating through the silicon substrate and coupling the display drivers to the integrated circuits. The integrated circuits transmit image/video data to the display drivers via the conductive electrodes, and the display drivers select particular LED pixels and control the particular LED pixels to emit light based on the image/video data.
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Citations
67 Claims
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1. A device comprising:
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a semiconductor substrate having a first side and a second side, the first and second sides being opposite sides of the semiconductor substrate; an array of light-emitting pixels monolithically formed on the first side, each of the light-emitting pixels including at least one light-emitting element and at least one non-volatile memory coupled to the at least one light-emitting element, the at least one non-volatile memory including at least one transistor, the at least one light-emitting element comprising multiple layers epitaxially grown on a semiconductor surface of the semiconductor substrate on the first side; control electronics formed on the second side; and interconnects penetrating through the semiconductor substrate and conductively coupling the array of pixels on the first side to the control electronics on the second side, such that the pixels are controllable by the control electronics. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. An integrated active-matrix light-emitting diode (LED) pixel display, comprising:
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a silicon semiconductor substrate having a first side and a second side, the first and second sides being opposite sides of the silicon semiconductor substrate; an array of active-matrix LED pixels monolithically formed on the first side, each LED pixel including at least one LED and at least one non-volatile memory coupled to the at least one LED, the at least one non-volatile memory including at least one transistor, the at least one LED comprising multiple layers epitaxially grown on a single crystal silicon semiconductor surface of the silicon semiconductor substrate on the first side; a plurality of display drivers formed on the first side and coupled to the LED pixels; one or more integrated circuits formed on the second side; and a plurality of conductive electrodes penetrating through the silicon semiconductor substrate and coupling the display drivers on the first side to the one or more integrated circuits on the second side, wherein the one or more integrated circuits are operable to transmit image or video data to the display drivers via the conductive electrodes, and the display drivers are operable to select one or more particular LED pixels and control the particular LED pixels to emit light based on the image or video data. - View Dependent Claims (27, 28, 29, 30, 31, 32)
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33. A method of forming integrated light-emitting pixel arrays for display, comprising:
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preparing a semiconductor substrate that has a first side and a second side, the first and second sides being opposite sides of the semiconductor substrate; monolithically forming light-emitting pixel arrays on the first side, each pixel comprising at least one light-emitting element and at least one non-volatile memory coupled to the at least one light-emitting element, the at least one non-volatile memory including at least one transistor, the at least one light-emitting element comprising multiple layers epitaxially grown on a semiconductor surface of the semiconductor substrate on the first side; forming conductive interconnects through the semiconductor substrate; and forming one or more integrated circuits on the second side, the interconnects conductively coupling the one or more integrated circuits to the light-emitting pixels such that the light-emitting pixels are operable by the one or more integrated circuits. - View Dependent Claims (34, 35, 36, 37, 38, 39, 40)
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41. A method of displaying an image on an integrated display system formed on a semiconductor substrate, the method comprising:
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receiving an instruction to display an image on the display system; analyzing, by a controller of the display system, the image to obtain image data, the controller being formed on a first side of the semiconductor substrate; transmitting, by the controller, the image data to one or more display drivers formed on a second side of the semiconductor substrate via conductive interconnects penetrating through the semiconductor substrate, the first and second sides being opposite sides of the semiconductor substrate; selecting, by the display drivers, one or more light-emitting pixels of an array of light-emitting pixels monolithically formed on the second side of the semiconductor substrate, each of the light-emitting pixels comprising at least one light-emitting element that includes multiple layers epitaxially grown on a semiconductor surface of the semiconductor substrate on the second side; and controlling, by the display drivers, the selected light-emitting pixels to emit light corresponding to the image data to display the image.
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42. An integrated light-emitting diode (LED) display device, comprising:
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a silicon substrate having a first side and a second side, the first and second sides being opposite sides of the silicon substrate; an array of light-emitting pixels monolithically formed on the first side, each pixel including at least one light-emitting diode (LED) and at least one non-volatile memory, the at least one non-volatile memory comprising at least one transistor, the at least one LED comprising multiple layers epitaxially grown on a silicon surface of the silicon substrate on the first side; a plurality of scanning drivers and a plurality of data drivers formed on the first side, wherein each pixel is coupled to a corresponding scanning driver through at least one word line and to a corresponding data driver through at least one data line, the word lines and the data lines being conductive metal lines; one or more digital signal processors and one or more analog signal processors formed on the second side; and a plurality of conductive electrodes penetrating through the silicon substrate and between the first side and the second side, the conductive electrodes coupling the plurality of scanning drivers and the plurality of data drivers on the first side to the digital signal processors on the second side to form the integrated LED display device. - View Dependent Claims (43, 44, 45, 46, 47, 48, 49, 50, 51)
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52. A method of monolithically fabricating an integrate LED pixel display device, comprising:
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forming an array of single crystal silicon surfaces parallel to a (111) crystalline plane on a first side of a silicon substrate, the single crystal silicon surfaces being substantially parallel to each other; epitaxially growing an array of non-organic LEDs on the array of single crystal silicon surfaces of the silicon substrate on the first side; forming, for each LED pixel, at least one non-volatile memory adjacent to each of the LEDs in the LED pixel and on the first side of the silicon substrate, the at least one non-volatile memory comprising at least one transistor; forming a plurality of row scanning drivers and a plurality of column data drivers on the first side of the silicon substrate; forming row metal connection lines and column metal connection lines on the first side of the silicon substrate, wherein each of the LEDs is connected to a corresponding non-volatile memory that is connected to one of the scanning drivers through at least one row metal connection line and to one of the data drivers through at least one column line; forming conductive electrodes connecting the first side and a second side of the silicon substrate; forming control electronics on the second side of the silicon substrate; and forming an array of secondary light emitting elements on surfaces of the formed LEDs by using different color phosphor materials or different size quantum dots materials.
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53. A device comprising:
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a semiconductor substrate having a first side and a second side, the first and second sides being opposite sides of the semiconductor substrate; an array of light-emitting pixels monolithically formed on the first side, each pixel including at least one light-emitting element that includes multiple layers epitaxially grown on a semiconductor surface of the semiconductor substrate on the first side; one or more display drivers formed on the first side and coupled to the array of light-emitting pixels; control electronics formed on the second side; and interconnects penetrating through the semiconductor substrate and conductively coupling the control electronics on the second side to the one or more display drivers on the first side, the interconnects comprising conductive materials filled in through-holes of the semiconductor substrate and insulated from inner surfaces of the through-holes with isolation materials different from a material of the semiconductor substrate. - View Dependent Claims (54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67)
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Specification