Thermal management systems and methods for wafer processing systems
First Claim
1. A processing chamber comprising:
- a remote plasma region defined within the processing chamber;
a workpiece holder comprising;
a substantially cylindrical puck that is characterized by a cylindrical axis, a puck radius about the cylindrical axis, and a puck thickness,wherein the puck radius is at least four times the puck thickness,wherein at least a top surface of the cylindrical puck is substantially planar, andwherein the cylindrical puck defines one or more radial thermal breaks.
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Accused Products
Abstract
A workpiece holder includes a puck having a cylindrical axis, a radius about the cylindrical axis, and a thickness. At least a top surface of the puck is substantially planar, and the puck defines one or more thermal breaks. Each thermal break is a radial recess that intersects at least one of the top surface and a bottom surface of the cylindrical puck. The radial recess has a thermal break depth that extends through at least half of the puck thickness, and a thermal break radius that is at least one-half of the puck radius. A method of processing a wafer includes processing the wafer with a first process that provides a first center-to-edge process variation, and subsequently, processing the wafer with a second process that provides a second center-to-edge process variation that substantially compensates for the first center-to-edge process variation.
1985 Citations
20 Claims
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1. A processing chamber comprising:
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a remote plasma region defined within the processing chamber; a workpiece holder comprising; a substantially cylindrical puck that is characterized by a cylindrical axis, a puck radius about the cylindrical axis, and a puck thickness, wherein the puck radius is at least four times the puck thickness, wherein at least a top surface of the cylindrical puck is substantially planar, and wherein the cylindrical puck defines one or more radial thermal breaks. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A plasma processing system comprising:
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a plasma processing chamber comprising; workpiece holder that positions a workpiece for processing, the workpiece holder comprising; a substantially cylindrical puck that is characterized by a cylindrical axis and a substantially planar top surface, wherein the cylindrical puck defines two radial thermal breaks, a first one of the thermal breaks being characterized as a radial recess that intersects a bottom surface of the cylindrical puck at a first radius, and extends from the bottom surface through at least one-half of a thickness of the puck; and a second one of the thermal breaks being characterized as a radial recess that intersects the top surface at a second radius that is greater than the first radius, and extends from the top surface through at least one-half of the thickness of the puck. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification