Power module

• US 10,468,315 B2
• Filed: 11/01/2016
• Issued: 11/05/2019
• Est. Priority Date: 11/12/2015
• Status: Active Grant

• Current Assignee: Mitsubishi Electric Corporation
• Original Assignee: Mitsubishi Electric Corporation
• Inventors: Harada, Kozo, Harada, Hiroyuki, Hatanaka, Yasumichi, Nishimura, Takashi, Taya, Masaki
• Primary Examiner(s): Gumedzoe, Peniel M
• Application Number:
  US15/773,746
• Publication Number:
  US 20180323120A1
• Time in Patent Office: 1,099 Days
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/20 gaseous at the normal operating temperature of the device
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/28 Encapsulations, e.g. encapsulating layers, coatings, e.g. for protectionH01L23/552 takes precedence; insulating layers for contacts or interconnections H01L23/5329
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/07 the devices being of a type provided for in group H01L29/00
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/163 Connection portion, e.g. seal
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19107 : off-chip wires

Abstract

The power module includes: an insulating substrate having an upper surface on which a semiconductor element is mounted; a base plate joined to a lower surface of the insulating substrate; a case member surrounding the insulating substrate and adhered to the base plate; a sealing resin provided in a region surrounded by the base plate and the case member, so as to seal the insulating substrate; and a holding plate projecting from an inner wall of the case member to above an outer peripheral portion of the insulating substrate, the holding plate being fixed to the inner wall, the holding plate being in contact with the sealing resin.

Claims

1. A power module comprising:

an insulating substrate having an upper surface on which a semiconductor element is mounted;

a base plate joined to a lower surface of the insulating substrate;

a case member surrounding the insulating substrate and adhered to the base plate;

a sealing resin provided in a region surrounded by the base plate and the case member, so as to seal the insulating substrate; and

a holding plate projecting from an inner wall of the case member to above an outer peripheral portion of the insulating substrate, the holding plate being fixed to the inner wall,

wherein an upper surface of the holding plate is sealed in the sealing resin, and

wherein adhesion between the holding plate and the sealing resin is lower than adhesion between the sealing resin and each of the insulating substrate and the semiconductor element.

2. The power module according to claim 1, wherein a releasing layer that is configured to release the sealing resin, is provided on a surface of the holding plate facing the insulating substrate.

3. The power module according to claim 1, wherein the holding plate includes a projection portion at a tip of a surface of the holding plate facing the insulating substrate.

4. The power module according to claim 1, wherein the holding plate includes a material with which adhesion between the holding plate and the sealing resin is lower than adhesion between the sealing resin and each of the insulating substrate and the semiconductor element.

5. The power module according to claim 1, wherein

the case member is provided with a terminal, and

the holding plate is fixed to the inner wall near the terminal.

6. The power module according to claim 1, wherein the holding plate is fixed to an entire periphery of the inner wall.