×

Formation of fine pitch traces using ultra-thin PAA modified fully additive process

  • US 10,468,342 B2
  • Filed: 02/02/2018
  • Issued: 11/05/2019
  • Est. Priority Date: 02/02/2018
  • Status: Active Grant
First Claim
Patent Images

1. A chip on film comprising:

  • a flexible dielectric substrate having a first polyamic acid (PAA) anchoring layer on its top surface;

    at least one first copper trace on a first Ni—

    P seed layer on said first PAA layer and having a surface finishing layer on a top surface of said at least one first copper trace; and

    at least one die mounted on said dielectric substrate to said at least one first copper trace.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×