Method of manufacturing light emitting diodes having a supporting layer attached to temporary adhesive
First Claim
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1. A method for manufacturing at least one light emitting diode (LED), the method comprising:
- epitaxially growing at least one light emitting diode (LED) structure on a growth substrate, wherein the LED structure has a top surface away from the growth substrate;
forming at least one supporting layer on the LED structure, wherein the supporting layer is made of metal, alloy, or a transparent conductive material;
providing a carrier substrate with an adhesive layer thereon;
contacting the supporting layer to the adhesive layer to temporarily adhere the supporting layer to the carrier substrate through the adhesive layer, wherein the supporting layer has a Young'"'"'s modulus greater than that of the adhesive layer, and a shortest distance between the adhesive layer and the growth substrate is greater than a shortest distance between the top surface of the LED structure and the growth substrate;
removing the growth substrate from the LED structure, such that the LED structure fully covers and is joined with the supporting layer; and
picking up at least a portion of the LED structure with at least a portion of the supporting layer from the adhesive layer, such that the adhesive layer is exposed and remains on the carrier substrate.
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Abstract
A method for manufacturing at least one light emitting diode (LED) includes epitaxying at least one light emitting diode (LED) structure on a growth substrate; forming at least one supporting layer on the LED structure; temporarily adhering the supporting layer to a carrier substrate through an adhesive layer, in which the supporting layer has a Young'"'"'s modulus greater than that of the adhesive layer; and removing the growth substrate from the LED structure.
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Citations
15 Claims
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1. A method for manufacturing at least one light emitting diode (LED), the method comprising:
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epitaxially growing at least one light emitting diode (LED) structure on a growth substrate, wherein the LED structure has a top surface away from the growth substrate; forming at least one supporting layer on the LED structure, wherein the supporting layer is made of metal, alloy, or a transparent conductive material; providing a carrier substrate with an adhesive layer thereon; contacting the supporting layer to the adhesive layer to temporarily adhere the supporting layer to the carrier substrate through the adhesive layer, wherein the supporting layer has a Young'"'"'s modulus greater than that of the adhesive layer, and a shortest distance between the adhesive layer and the growth substrate is greater than a shortest distance between the top surface of the LED structure and the growth substrate; removing the growth substrate from the LED structure, such that the LED structure fully covers and is joined with the supporting layer; and picking up at least a portion of the LED structure with at least a portion of the supporting layer from the adhesive layer, such that the adhesive layer is exposed and remains on the carrier substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification