Efficiently micro-transfer printing micro-scale devices onto large-format substrates

• US 10,468,398 B2
• Filed: 12/20/2018
• Issued: 11/05/2019
• Est. Priority Date: 02/25/2016
• Status: Active Grant

• Current Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Original Assignee: X-Celeprint Limited
• Inventors: Bower, Christopher, Meitl, Matthew
• Primary Examiner(s): Everhart, Caridad
• Application Number:
  US16/227,343
• Publication Number:
  US 20190221552A1
• Time in Patent Office: 320 Days
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2221/68381 Details of chemical or physical process used for separating the auxiliary support from a device or wafer
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/82007 involving a permanent auxiliary member being left in the finished device, e.g. aids for holding or protecting a build-up interconnect during or after the bonding process
• CPC Class Codes: H01L 2224/951 Supplying the plurality of semiconductor or solid-state bodies
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/18162 of a chip with build-up interconnect
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A method of making a micro-transfer printed system includes providing a source wafer having a plurality of micro-transfer printable source devices arranged at a source spatial density; providing an intermediate wafer having a plurality of micro-transfer printable intermediate supports arranged at an intermediate spatial density less than or equal to the source spatial density; providing a destination substrate; micro-transfer printing the source devices from the source wafer to the intermediate supports of the intermediate wafer with a source stamp having a plurality of posts at a source transfer density to make an intermediate device on each intermediate support; and micro-transfer printing the intermediate devices from the intermediate wafer to the destination substrate at a destination spatial density less than the source spatial density with an intermediate stamp having a plurality of posts at an intermediate transfer density less than the source transfer density.

Claims

1. A compound micro-assembled device, comprising:

a destination substrate;

intermediate devices disposed on the destination substrate, each of the intermediate devices comprising an intermediate support smaller than the destination substrate;

source devices disposed on the intermediate support;

intermediate electrical connections disposed on the intermediate support, wherein the intermediate electrical connections electrically connect the source devices disposed on the intermediate support, wherein the intermediate electrical connections have an intermediate resolution; and

destination electrical connections disposed on the destination substrate that electrically connect the intermediate devices, the destination electrical connections having a destination resolution less than the intermediate resolution,

wherein the intermediate electrical connections have an intermediate resolution of less than or equal to 10 microns.

2. The compound micro-assembled device of claim 1, wherein the destination electrical connections have a destination resolution of greater than or equal to 5 microns.

3. The compound micro-assembled device of claim 1, wherein the destination electrical connections have a width or spacing of greater than or equal to 5 microns.

4. The compound micro-assembled device of claim 1, wherein the source devices have at least one of a width, length, and height from 2 to 5 μ

m, 5 to 10 μ

m, 10 to 20 μ

m, or 20 to 50 μ

m.

5. The compound micro-assembled device of claim 1, wherein the source devices have a substrate thickness of 2 to 5 μ

m, 5 to 10 μ

m, 10 to 20 μ

m, or 20 to 50 μ

m.

6. The compound micro-assembled device of claim 1, wherein the source devices have an aspect ratio greater than or equal to 2.

7. The compound micro-assembled device of claim 1, wherein the source devices have electrical contact pads disposed adjacent to the ends of the source devices along the length of the source devices.

8. The compound micro-assembled device of claim 1, wherein each source device is a micro-transfer printed source device comprising a broken tether.

9. The compound micro-assembled device of claim 1, wherein each of the intermediate devices is a micro-transfer printed intermediate device comprising a broken tether.

10. The compound micro-assembled device of claim 1, wherein each intermediate devices comprises a source device that is an integrated circuit control chiplet.

11. The compound micro-assembled device of claim 1, wherein one or more of the source devices comprises source connection posts, each of the source connection posts disposed in electrical contact with one of the intermediate electrical connections.

12. The compound micro-assembled device of claim 1, wherein one or more of the intermediate devices comprises intermediate connection posts, each of the intermediate connection posts disposed in electrical contact with one of the destination electrical connections.

13. The compound micro-assembled device of claim 1, wherein the destination electrical connections comprise row conductors and column conductors.

14. The compound micro-assembled device of claim 1, wherein the destination substrate comprises a polymer.

15. The compound micro-assembled device of claim 1, wherein one or more source devices is an integrated circuit.

16. The compound micro-assembled device of claim 1, wherein each of the one or more intermediate devices is a pixel.

17. The compound micro-assembled device of claim 1, wherein the destination substrate is a display substrate.

18. The compound micro-assembled device of claim 1, wherein the intermediate support is an intermediate substrate.

20. The compound micro-assembled device of claim 1, wherein the source devices comprise red light-emitting diodes that can emit red light, green light-emitting diodes that can emit green light, or blue light-emitting diodes that can emit blue light.

21. The compound micro-assembled device of claim 20, wherein each of the intermediate devices comprises a red light-emitting diode, a green light-emitting diode, and a blue light-emitting diode.

19. A compound micro-assembled device, comprising:

a destination substrate;

intermediate devices disposed on the destination substrate, each of the intermediate devices comprising an intermediate support smaller than the destination substrate;

source devices disposed on the intermediate support;

intermediate electrical connections disposed on the intermediate support, wherein the intermediate electrical connections electrically connect the source devices disposed on the intermediate support, wherein the intermediate electrical connections have an intermediate resolution; and

destination electrical connections disposed on the destination substrate that electrically connect the intermediate devices, the destination electrical connections having a destination resolution less than the intermediate resolution,

wherein the intermediate electrical connections have a width or spacing of less than or equal to 10 microns.