Method of manufacturing a LED-based emissive display device

• US 10,468,452 B2
• Filed: 05/09/2018
• Issued: 11/05/2019
• Est. Priority Date: 05/11/2017
• Status: Active Grant

• Current Assignee: Commissariat a L'Energie Atomique (AES Corporation)
• Original Assignee: Commissariat a L'Energie Atomique (AES Corporation)
• Inventors: Robin, Ivan-Christophe, Bono, Hubert
• Primary Examiner(s): Garber, Charles D
• Assistant Examiner(s): Sabur, Alia
• Application Number:
  US15/975,492
• Publication Number:
  US 20180331153A1
• Time in Patent Office: 545 Days
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/124 with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits wiring structures per se H01L23/52
• CPC Class Codes: H01L 27/1259 Multistep manufacturing methods
• CPC Class Codes: H01L 27/15 including semiconductor components having potential barriers, specially adapted for light emission
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/005 Processes
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/382 the electrode extending partially in or entirely through the semiconductor body
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A method of manufacturing elementary chips of a LED-based emissive display device, each chip including an inorganic semiconductor LED, a circuit for controlling the LED, and a plurality of areas of connection to an external device arranged on a connection surface of the chip.

Claims

1. A method of manufacturing elementary chips of a LED-based emissive display device, each chip comprising an inorganic semiconductor LED, a circuit for controlling the LED, and a plurality of areas of connection to an external device arranged on a connection surface of the chip, the method comprising the steps of:

a) forming the control circuits of the chips inside and on top of a semiconductor substrate so that each control circuit comprises a contact pad on the side of a first surface of the substrate;

b) transferring onto the first surface of the substrate a LED stack comprising at least first and second semiconductor layers of opposite conductivity types, so that the second layer of the stack is electrically connected to the contact pads of the control circuits;

c) forming in each chip a peripheral trench surrounding, in top view, the control circuit and the LED of the chip, the peripheral trench extending vertically in the substrate along the entire height of the control circuit, crossing the second semiconductor layer of the LED stack, and at least partially penetrating into the first semiconductor layer of the LED stack;

d) forming in each trench a ring-shaped metallization in contact with the first semiconductor layer of the LED stack along the entire length of the trench; and

e) cutting the substrate and the LED stack along cutting paths located, in top view, outside of the peripheral trenches of the chips to individualize the chips.

2. The method of claim 1, wherein, in each chip:

the surface of the ring-shaped metallization opposite to the first semiconductor layer of the LED stack emerges onto a second surface of the substrate opposite to the first surface and defines a first connection area of the chip; and

at least one second electric connection area connected to the control circuit of the chip is formed on the second surface of the substrate.

3. The method of claim 2, wherein the trenches are formed from the second surface of the substrate, after the forming of said at least one second electric connection area.

4. The method of claim 3, wherein the trenches thoroughly cross the substrate and the second semiconductor layer of the LED stack and are interrupted in the first semiconductor layer of the LED stack.

5. The method of claim 4, comprising, between step c) and step d), a step of conformal deposition of an insulating layer on the lateral walls and on the bottom of the trenches, and a step of removing said insulating layer from the bottom of the trenches to free the access to the first semiconductor layer of the LED stack.

6. The method of claim 2, wherein the trenches are formed from the surface of the LED stack opposite to the substrate, before the forming of said at least one second electric connection area.

7. The method of claim 6, wherein the trenches thoroughly cross the LED stack and penetrate into the substrate down to depth greater than or equal to the thickness of the control circuit.

8. The method of claim 7, comprising, between step c) and step d), a step of conformal deposition of an insulating layer on the lateral walls and on the bottom of the trenches, and a step of removing said insulating layer from an upper portion of the lateral walls of the trenches to free the access to the first semiconductor layer of the LED stack.

9. The method of claim 1, further comprising, before step a), a step of depositing a first metal layer continuously extending over substantially the entire first surface of the substrate and a step of depositing a second metal layer continuously extending over substantially the entire surface of the second semiconductor layer of the LED stack opposite to the first semiconductor layer of said stack.

10. The method of claim 9, wherein, at step b), the affixing of the LED stack onto the substrate is performed by direct bonding of the first metal layer to the second metal layer.

11. A method of manufacturing a LED-based emissive display device, comprising the steps of:

forming a plurality of elementary chips by the method of claim 1;

forming a transfer substrate comprising, for each chip, on a connection surface of the transfer substrate, a plurality of connection areas intended to be respectively connected to the connection areas of the chip; and

affixing the chips onto the transfer substrate to electrically connect the chip connection areas to the corresponding connection areas of the transfer substrate.

12. The method of claim 11, wherein, at the end of step e), the chips are arranged on a support substrate with a pitch between chips smaller than the pitch between chips of the final display device;

and

only part of the chips of the support substrate are affixed to the transfer substrate at the pitch of the final display device and are selectively detached from the support substrate.