Semiconductor device and electronic device including the same

• US 10,468,748 B2
• Filed: 02/02/2018
• Issued: 11/05/2019
• Est. Priority Date: 01/29/2010
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Yamazaki, Shunpei, Koyama, Jun
• Primary Examiner(s): Azongha, Sardis F
• Application Number:
  US15/887,101
• Publication Number:
  US 20180183133A1
• Time in Patent Office: 641 Days
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H01L 27/1225 with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
• CPC Class Codes: H01Q 1/2258 used with computer equipment
• CPC Class Codes: H01Q 1/24 with receiving set
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 25/005 providing two patterns of opposite direction; back to back antennas H01Q25/004 takes precedence
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

A semiconductor device capable of inputting signals and power without the use of an FPC is provided. The semiconductor device includes a first substrate and a second substrate. A receiver antenna is provided on a surface side of the first substrate. The second substrate is provided with a transmitter antenna and an integrated circuit. The second substrate is attached on a back side of the first substrate. The receiver antenna and the transmitter antenna overlap with each other with the first substrate provided therebetween. Thus, the distance between the antennas can be kept constant, so that signals and power can be received highly efficiently.

Claims

1. A semiconductor device comprising:

a first substrate having a first region and a second region;

a second substrate having a first region and a second region, the first region of the second substrate being attached to the first region of the first substrate;

a third substrate overlapping with the second region of the first substrate;

a first receiver antenna and a second receiver antenna provided on the first region of the first substrate;

a pixel portion including a plurality of pixels provided on the second region of the first substrate; and

a first transmitter antenna and a second transmitter antenna provided on the first region of the second substrate,

wherein the third substrate does not overlap the second substrate,

wherein the second region of the second substrate is not overlapped with the first substrate, and

wherein each of the first substrate, the second substrate, and the third substrate is flexible.

2. The semiconductor device according to claim 1,

wherein the first receiver antenna and the first transmitter antenna overlap with each other with the first substrate positioned therebetween, and

wherein the second receiver antenna and the second transmitter antenna overlap with each other with the first substrate positioned therebetween.

3. The semiconductor device according to claim 1, wherein the first receiver antenna is configured to receive an image signal to be input to the pixel portion, and the first transmitter antenna is configured to transmit the image signal.

4. The semiconductor device according to claim 1, wherein the second receiver antenna and the second transmitter antenna are power antennas.

5. The semiconductor device according to claim 1, wherein the first region of the second substrate is attached to the first region of the first substrate with an adhesive.

6. The semiconductor device according to claim 1, further comprising a signal processing portion and a power source portion provided on the first region of the first substrate.

7. The semiconductor device according to claim 1, further comprising a integrated circuit provided on the first region of the second substrate.

8. The semiconductor device according to claim 1, wherein each of the plurality of pixels includes a liquid crystal element.

9. The semiconductor device according to claim 1, wherein each of the plurality of pixels includes a light emitting element.

10. The semiconductor device according to claim 1, wherein each of the plurality of pixels includes an electrophoretic element.

11. A semiconductor device comprising:

a first substrate having a first region and a second region;

a second substrate having a first region and a second region, the first region of the second substrate being provided under and attached to the first region of the first substrate;

a third substrate overlapping with the second region of the first substrate;

a first receiver antenna and a second receiver antenna provided on the first region of the first substrate;

a pixel portion including a plurality of pixels provided on the second region of the first substrate; and

a first transmitter antenna and a second transmitter antenna provided on the first region of the second substrate,

wherein the third substrate does not overlap the second substrate,

wherein the second region of the second substrate is not overlapped with the first substrate, and

wherein each of the first substrate, the second substrate, and the third substrate is flexible.

12. The semiconductor device according to claim 11,

wherein the first receiver antenna and the first transmitter antenna overlap with each other with the first substrate positioned therebetween, and

wherein the second receiver antenna and the second transmitter antenna overlap with each other with the first substrate positioned therebetween.

13. The semiconductor device according to claim 11, wherein the first receiver antenna is configured to receive an image signal to be input to the pixel portion, and the first transmitter antenna is configured to transmit the image signal.

14. The semiconductor device according to claim 11, wherein the second receiver antenna and the second transmitter antenna are power antennas.

15. The semiconductor device according to claim 11, wherein the first region of the second substrate is attached to the first region of the first substrate with an adhesive.

16. The semiconductor device according to claim 11, further comprising a signal processing portion and a power source portion provided on the first region of the first substrate.

17. The semiconductor device according to claim 11, further comprising a integrated circuit provided on the first region of the second substrate.

18. The semiconductor device according to claim 11, wherein each of the plurality of pixels includes a liquid crystal element.

19. The semiconductor device according to claim 11, wherein each of the plurality of pixels includes a light emitting element.

20. The semiconductor device according to claim 11, wherein each of the plurality of pixels includes an electrophoretic element.