Methods, systems and devices relating to distortion correction in imaging devices

• US 10,469,777 B2
• Filed: 03/22/2016
• Issued: 11/05/2019
• Est. Priority Date: 03/23/2015
• Status: Active Grant

• Current Assignee: TechInsights, Inc. (M3, Inc.)
• Original Assignee: TechInsights, Inc. (M3, Inc.)
• Inventors: Pawlowicz, Christopher, Sorkin, Alexander, Martincevic, Vladimir
• Primary Examiner(s): Vu, Ngoc Yen T
• Application Number:
  US15/560,935
• Publication Number:
  US 20180054575A1
• Time in Patent Office: 1,323 Days
• CPC Class Codes: G01N 2223/418 electron microscope
• CPC Class Codes: G01N 23/2251 using incident electron beams, e.g. scanning electron microscopy [SEM]
• CPC Class Codes: G06T 2207/10061 from scanning electron microscope
• CPC Class Codes: G06T 2207/20068 Projection on vertical or horizontal image axis
• CPC Class Codes: G06T 2207/30141 Printed circuit board [PCB]
• CPC Class Codes: G06T 7/73 using feature-based methods
• CPC Class Codes: H01J 2237/226 Image reconstruction
• CPC Class Codes: H01J 2237/2817 Pattern inspection
• CPC Class Codes: H01J 37/222 Image processing arrangements associated with the tube
• CPC Class Codes: H01J 37/26 Electron or ion microscopes; Electron or ion diffraction tubes
• CPC Class Codes: H01J 37/28 with scanning beams H01J37/268, H01J37/292, H01J37/2955 take precedence
• CPC Class Codes: H01J 37/3045 Object or beam position registration
• CPC Class Codes: H04N 25/60 Noise processing, e.g. detecting, correcting, reducing or removing noise

Abstract

Devices, systems and methods relating to a distortion-correcting imaging for collecting image-related data of a substrate are disclosed, comprising: a beam emitter for directing an emission at an intended location on the substrate, and a signal detector for determining a signal intensity value associated with the emission; wherein the signal intensity value is associated with a corrected substrate location, said corrected substrate location determined from the intended substrate location and a correction factor, said correction factor being a function of said intended substrate location.

Claims

1. An imaging device for imaging at least a portion of at least one layer of a substrate, the device comprising:

a beam emitter for directing an emission at the substrate so as to produce a detectable signal representative of the substrate at a plurality of intended substrate locations on the portion of the substrate; and

a signal detector for detecting an imaging characteristic of said detectable signal for each of the intended locations;

one or more motivators for changing a direction of said emission relative to a position of the substrate to detect said imaging characteristic at each of the plurality of intended substrate locations on the portion of the substrate;

wherein the imaging device, for each intended location, automatically associates said imaging characteristic therefor with a corrected substrate location for use in generating a plurality of distortion-corrected images each with a given image resolution, wherein said corrected substrate location is determined from said intended location and a correction factor that is a function of said intended location and said given image resolution corresponding to said given intended location; and

wherein the imaging device is configured to align the plurality of distortion-corrected images to form a mosaiced image of the portion of at least one layer of the substrate, said distortion-corrected images comprises at least two different image resolutions.

2. The device of claim 1, wherein said imaging characteristic comprises an intensity of said detectable signal.

3. The device of claim 1, wherein said correction factor is predetermined for at least one operating characteristic of said imaging device.

4. The device of claim 3, wherein said at least one operating characteristic comprises a current imaging resolution of the device.

5. The device of claim 1, wherein each of the one or more motivators comprises a beam motivator for changing a direction of said emission relative to a position of the substrate to detect said imaging characteristic at one or more different intended substrate locations.

6. The device of claim 1, wherein each of the one or more motivators comprises a detector motivator for changing a relative position of said signal detector to the substrate to detect said imaging characteristic for one or more different intended substrate locations.

7. The device of claim 6, wherein each of the one or more motivators comprises a stage motivator for changing a position of a stage holding the substrate relative to the beam emitter and the signal detector.

8. The device of claim 1, wherein said signal detector determines a corresponding characteristic for each of a plurality of different corresponding intended substrate locations, and wherein the imaging device automatically associates each said corresponding characteristic with a corresponding corrected substrate location for use in generating said distortion-corrected image, wherein each said corresponding corrected substrate location is determined from each of said corresponding intended locations and said correction factor that is a function of said corresponding intended locations.

9. The device of claim 1, wherein a given image pixel value for a given image pixel location corresponding to a given intended substrate location is based on respective proportions of said imaging characteristic associated with any one or more said corrected substrate location overlapping at least a portion of said given image pixel location.

10. The device of claim 1, wherein the device is selected from the following group:

an optical imaging device, a FIB, a SEM, a TEM, an X-Ray device, an MRI, an ion beam device, a CT scan, and a CAT scan.

11. The device of claim 1, wherein mosaiced images of portions of at least two layers of a substrate are formed, and the device is further configured to vertically align corresponding locations of said portions sharing common features that pass through all such at least two layers.

12. A method of correcting image distortion in an imaging device, the imaging device comprising a beam emitter for directing an emission at a substrate so as to produce a detectable signal representative of the substrate at an intended location and location-dependent beam resolution, and a signal detector for determining an imaging characteristic value representative of the detectable signal, the method comprising:

causing the emission to impinge the substrate;

measuring the imaging characteristic of the detectable signal associated with the intended location and location-dependent image resolution;

determining a corrected substrate location associated with the imaging characteristic for use in generating a plurality of distortion-corrected images, the corrected substrate location determined from the intended location and a designated correction factor predetermined as a function of said intended substrate location, each of said distortion-corrected image with an image resolution associated with the corresponding location-dependent beam resolution;

associating said measured imaging characteristic of the detectable signal with said corrected location;

repeating said measuring, determining and associating for at least one other intended substrate location; and

aligning the plurality of distortion-corrected images to form a mosaiced image of the portion of at least one layer of the substrate, said distortion-corrected images comprising at least two different image resolutions.

13. The method of claim 12, wherein said imaging characteristic comprises an intensity of said detectable signal.

14. The method of claim 12, wherein said correction factor is further predetermined for a given set of operating characteristics of said imaging device.

15. The method of claim 12, further comprising associating a given image pixel value with a given image pixel location corresponding to the intended location on the substrate, said given image pixel value being based on respective proportions of said imaging characteristic associated with any one or more said corrected substrate location overlapping at least a portion of said given image pixel location.

16. The method of claim 12, wherein the method further comprises:

mosaicing images of portions of at least two layers of the substrate; and

vertically aligning corresponding locations of said portions on the at least two layers sharing common features that pass through all such at least two layers.

17. The method of claim 16, wherein the method further comprises:

repeating said collecting, generating image pixel values, and generating images for each of at least two layers of the substrate; and

vertically aligning corresponding locations of said images on the at least two layers sharing common features that pass through all such at least two layers.

18. A method of generating an image of a substrate from an imaging device, the imaging device comprising a beam source for directing an emission with a respective location-dependent beam resolution at an intended location on a substrate and a signal detector for determining a signal characteristic value associated with the emission, the method comprising:

collecting a plurality of signal characteristic values by the signal detector, each of said signal characteristic values indicative of a substrate characteristic at an actual location;

determining, for each given signal characteristic value, said actual location associated therewith by correcting said intended substrate location using a correction factor, said correction factor being a function of said intended substrate location; and

generating image pixel values for the image, wherein a given image pixel value at a given image pixel location is based on;

the respective location-dependent beam resolution for the given image pixel location, and respective proportions of at least one said given signal characteristic value whose corrected substrate location corresponds to a portion of said given image pixel location; and

generating an image from a plurality of said image pixel values, said image pixel values comprising at least two different location-dependent beam resolutions.

19. The method of claim 18, wherein the correction factor is associated with at least one operating characteristic of the imaging device.