Method and structures for heat dissipating interposers

• US 10,475,733 B2
• Filed: 10/10/2018
• Issued: 11/12/2019
• Est. Priority Date: 12/19/2012
• Status: Active Grant

• Current Assignee: Invensas Corporation
• Original Assignee: Adeia Semiconductor Technologies LLC (f/k/a Invensas Corporation) (Adeia Inc.)
• Inventors: Uzoh, Cyprian Emeka, Monadgemi, Pezhman, Caskey, Terrence, Ayatollahi, Fatima Lina, Haba, Belgacem, Woychik, Charles G., Newman, Michael
• Primary Examiner(s): Chen, Xiaoliang
• Application Number:
  US16/156,595
• Publication Number:
  US 20190139878A1
• Time in Patent Office: 398 Days
• Field of Search: 174252, 174257, 174262, 174264, 174265, 257762, 257764, 438 98, 438202, 438421
• CPC Class Codes: H01L 21/76829 characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
• CPC Class Codes: H01L 21/76898 formed through a semiconductor substrate
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/3736 Metallic materials H01L23/3732, H01L23/3733, H01L23/3735, H01L23/3737, H01L23/3738 take precedence
• CPC Class Codes: H01L 23/481 Internal lead connections, e.g. via connections, feedthrough structures
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/49866 characterised by the materials materials of the substrates H01L23/14, of the lead-frames H01L23/49579
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An interconnect element includes a semiconductor or insulating material layer that has a first thickness and defines a first surface; a thermally conductive layer; a plurality of conductive elements; and a dielectric coating. The thermally conductive layer includes a second thickness of at least 10 microns and defines a second surface of the interconnect element. The plurality of conductive elements extend from the first surface of the interconnect element to the second surface of the interconnect element. The dielectric coating is between at least a portion of each conductive element and the thermally conductive layer.

Claims

1. An assembly comprising:

an interconnect component comprising;

a thermally conductive carbon layer;

an insulating layer overlying the thermally conductive carbon layer;

a plurality of conductive vias extending through the conductive layer and the insulating layer, such that a first end of the plurality of conductive vias is disposed at an outermost surface of the insulating layer and an opposed second end of the plurality of conductive vias is disposed at an outermost surface of the thermally conductive carbon layer; and

a dielectric layer extending along a length of the plurality of conductive vias, such that the thermally conductive carbon layer and the insulating layer are spaced away from the plurality of conductive vias by the dielectric layer.

2. The interconnect component according to claim 1, wherein portions of the thermally conductive carbon layer include thermally conductive carbon segments separated by gaps within the thermally conductive carbon layer.

3. The interconnect component of claim 2, wherein the gaps extend entirely through the thermally conductive carbon layers such that the thermally conductive carbon segments are completely separated from one another.

4. The interconnect component of claim 2, wherein the gaps extend partially through the thermally conductive layer, such that at least portions of the thermally conductive carbon segments are connected together.

5. The interconnect component of claim 2, wherein the gaps are filled with a compliant material forming a plurality of respective spacers between the thermally conductive carbon segments so as to absorb variations in thermal expansion between the insulating layer and the thermally conductive layer.

6. The interconnect component of claim 2, wherein the plurality of spacers extend in a planar direction.

7. The interconnect component of claim 2, wherein the plurality of spacers extend in multiple lateral directions.

8. The interconnect component of claim 2, wherein the insulating layer is a dielectric layer.

9. The interconnect component according to claim 1, further comprising a redistribution layer overlying the interconnect component and electrically connected with the plurality of conductive vias.