System and method for physically detecting counterfeit electronics

• US 10,475,754 B2
• Filed: 03/02/2012
• Issued: 11/12/2019
• Est. Priority Date: 03/02/2011
• Status: Active Grant

• Current Assignee: Nokomis Inc.
• Original Assignee: Nokomis Inc.
• Inventors: Keller, III, Walter J., Freeman, Stephen Dorn, Galyardt, Jason
• Primary Examiner(s): Rivera Vargas, Manuel A
• Assistant Examiner(s): Perez Bermudez, Yaritza H
• Application Number:
  US13/410,797
• Publication Number:
  US 20120226463A1
• Time in Patent Office: 2,811 Days
• CPC Class Codes: G01R 31/2837 Characterising or performance testing, e.g. of frequency response transient response G01R27/28
• CPC Class Codes: G01R 31/2839 using signal generators, power supplies or circuit analysers G01R31/2879 takes precedence; multimeters G01R15/12, network analysers G01R27/28
• CPC Class Codes: G06F 21/73 by creating or determining hardware identification, e.g. serial numbers
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 23/576 using active circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate

Abstract

A system for inspecting or screening electrically powered device includes a signal generator inputting a preselected signal into the electrically powered device. There is also an antenna array positioned at a pre-determined distance above the electrically powered device. Apparatus collects RF energy emitted by the electrically powered device in response to input of said preselected signal. The signature of the collected RF energy is compared with an RF energy signature of a genuine part. The comparison determines one of a genuine or a counterfeit condition of the electrically powered device.

Claims

1. A system for inspecting or screening a discrete semiconductor or an integrated circuit for counterfeits, said system comprising:

(a) a high precision signal source configured to generate a high precision oscillator signal for driving at least one of a signal input and a clock input of the discrete semiconductor or the integrated circuit, said high precision signal source is being selected from a group consisting of a temperature compensated Crystal Oscillator (TCXO), a microcomputer compensated Crystal Oscillator (MXCO), an Oven Controlled Crystal Oscillator (OCXO), a small atomic frequency standard oscillator and a Rubidium oscillator (RbXO);

(b) a receiver coupled to an antenna and configured to collect electromagnetic energy in a radio frequency (RF) spectrum emitted by the discrete semiconductor or the integrated circuit in a response to said at least one of said signal input and said clock input being driven by said high precision signal source; and

(c) a processor executing at least one algorithm to determine, based on a comparison of emission signature characteristics of said collected electromagnetic energy in the RF spectrum against baseline RF emission signature characteristics, one of a genuine or a counterfeit condition of the discrete semiconductor or the at least one of the integrated circuit.

2. An apparatus for detecting at least one of a counterfeited integrated circuit and a counterfeited device employing the integrated circuit, said apparatus comprising:

(a) a high precision signal source configured to generate a high precision oscillator signal for driving at least one of a signal input and a clock input of a powered at least one of the integrated circuit and the device employing the integrated circuit, said high precision oscillator signal having a frequency thereof being consistent with input requirements of the at least one of the integrated circuit and the device employing the integrated circuit;

(b) an RF collection means, comprising a receiver and an antenna, positioned in a proximity to the at least one of the integrated circuit and the device employing the integrated circuit, said RF collection means configured to receive emissions radiated by the at least one of the integrated circuit and the device employing the integrated circuit driven with said high precision oscillator signal; and

(c) a processor coupled to said RF collection means, said processor configured to process a signature of said radiated emission and compare said radiated emission signature against at least one emission signature predetermined for the at least one of the integrated circuit and the device employing the integrated circuit, whereby a resulting match of said comparison defines at least one of a genuine integrated circuit and a genuine device employing the integrated circuit.

3. The apparatus of claim 2, wherein said apparatus includes an antenna array and wherein said RF collection means is coupled to said antenna array.

4. The apparatus of claim 2, wherein said RF collection means has a sensitivity of better than −

152 dBm.

5. The apparatus of claim 2, wherein said high precision signal source is being selected from a group consisting of a temperature compensated Crystal Oscillator (TCXO), a microcomputer compensated Crystal Oscillator (MXCO), an Oven Controlled Crystal Oscillator (OCXO), a small atomic frequency standard oscillator and a Rubidium oscillator (RbXO).

6. The apparatus of claim 2, wherein said high precision signal source is a small atomic standard oscillator generating a high precision oscillator signal with precision exceeding 10⁻

8.

7. A method for differentiating between a counterfeit and a genuine semiconductor based device, said method comprising the steps of:

(a) generating, with a high precision signal source, a high precision oscillator signal, said high precision signal source is being selected from a group consisting of a temperature compensated Crystal Oscillator (TCXO), a microcomputer compensated Crystal Oscillator (MXCO), an Oven Controlled Crystal Oscillator (OCXO), a small atomic frequency standard oscillator and a Rubidium oscillator (RbXO);

(b) injecting said high precision oscillator signal into a semiconductor based device through at least one of a clock input and a signal input;

(c) collecting, with an RF collection means, comprising a receiver and an antenna, emissions given off by said semiconductor based device in a response to said high precision oscillator signal injected in step (b);

(d) comparing characteristics of said RF emissions, collected in step (c), against baseline RF characteristics of a genuine semiconductor based device; and

(e) determining, based on said comparison, said semiconductor based device as said one of said counterfeit and said genuine semiconductor based device.

8. The method of claim 7, further including the step of repeating steps (a) through (c) with different frequency settings on said high precision oscillator signal injected into said semiconductor based device and the step of comparing RF data collections of at least two measured responses to improve counterfeit inspection.

9. The method of claim 7, further including the step of repeating steps (a) through (c) with different frequency amplitude settings on said high precision oscillator signal injected into said semiconductor based device and the step of comparing RF data collections of at least two measured responses to improve counterfeit inspection.

10. The method of claim 7, further including the step of repeating steps (a) through (c) with different relative phases between two or more high precision oscillator signals injected into said semiconductor based device and the step of comparing RF data collections of at least two measured responses to improve counterfeit inspection.

11. The method of claim 7, further including the step of repeating steps (a) through (c) with different frequency settings on the high precision oscillator signal injected into at least two inputs on the semiconductor based device and comparing RF collection data for each high precision oscillator signal injected individually to expected signature and injection into all inputs simultaneously.

12. The method of claim 7, wherein said step of determining said genuine semiconductor based device includes the step of analyzing at least one of frequency locations of emissions components, phases of emissions, cross-modulation and inter-modulation components generated by the internal circuitry, shape of any individual emission, quality factors of any individual emissions or timing characteristics of emissions.

13. The method of claim 7, wherein said step (d) includes the step of using at least one automated algorithm.

14. The method of claim 7, further including the step of establishing said baseline RF characteristics representative of said genuine semiconductor based device.

15. The method of claim 14 wherein said step of establishing said baseline RF characteristics includes the step of large scale comparison of spectral emissions and the step of reducing said large scale comparison to a single scalar value.

16. The method of claim 14, wherein said step of establishing said baseline RF characteristics includes the step of obtaining local spectral power density statistics.

17. The method of claim 16, wherein said step of obtaining local spectral power density statistics includes the step of sampling a plurality of semiconductor based devices and discriminating said plurality of semiconductor based devices based on localized statistical feature measured on each of emissions common between sampled semiconductor based devices.

18. The method of claim 17, wherein said statistical feature includes at least one of Emission Frequency Location, Emission Peak Magnitude, Emission Phase Noise, Emission Symmetry, Skewness, and Emission Local Noise Floor.

19. The method of claim 7, wherein said step of comparing said characteristics of said RF emissions includes the step of obtaining discrete wavelet transform coefficient statistics.

20. The method of claim 7, wherein said step of comparing said characteristics of said RF emissions includes the step of obtaining relative phase measurement.

21. The method of claim 7, wherein said step of comparing said characteristics of said RF emissions includes the step of performing clustering analysis.

22. The method of claim 21, wherein said step of performing said clustering analysis includes the step of using a Hierarchical Agglomerative Clustering (HAC) algorithm.

23. The method of claim 21, wherein said step of performing said clustering analysis includes the step of using at least one of a clustering algorithm and a Hierarchical Agglomerative Clustering (HAC) algorithm.

24. The method of claim 7, wherein said step of comparing said characteristics of said RF emissions includes the step of at least one of obtaining relative phase measurement and comparing phase measurement to anticipated phase measurements.

25. The method of claim 7, further including the step of repeating steps (a) through (c) with identical settings on said high precision oscillator signal injected into said semiconductor based device and the step of combining, through averaging or other mathematical transform, RF data collections of at least two measured responses to improve counterfeit inspection.

26. The method of claim 7, further including the step of repeating steps (a) through (c) with identical settings on said high precision oscillator signal injected into said semiconductor based device.

27. The method of claim 7, further including the step of repeating steps (a) through (c) with identical settings on said high precision oscillator signal injected into said semiconductor based device and the step of using wideband RF emissions to inform further inspection and comparison of RF emission signatures observed in narrow-band RF emission responses.

28. The method of claim 7, further comprising the step of repeating steps (a) through (c) with identical settings on said high precision oscillator signal injected into said semiconductor based device and the step of using narrow-band RF emissions to inform further inspection and comparison of RF emission signatures observed in wideband RF emission responses.

29. The method of claim 7, further comprising a step of providing a fixture, a step of positioning said semiconductor device within said fixture and a step of injecting said high precision oscillator signal into said semiconductor through said fixture.

30. An apparatus for at least one of inspecting and screening at least one semiconductor based device installed on a printed circuit board assembly, said apparatus comprising:

(a) a robotic arm;

(b) a controller configured to control a movement of said robotic arm over different locations of the printed circuit board assembly;

(c) a high precision signal source generating a high precision oscillator signal for injection into the printed circuit board assembly;

(d) an antenna array including a low noise amplifier integrated therewithin;

(e) a receiver connected to said antenna array, said receiver configured to receive emission radiated by said at least one semiconductor based device injected with said high precision oscillator signal; and

(f) at least one processor coupled to said receiver and configured to at least one of inspect and screen the at least one semiconductor based device based on comparison of a signature of said emission received at said receiver against baseline characteristics.

31. The apparatus of claim 30, further including an active illumination source configured to illuminate the at least one semiconductor based device that is at least one of inspected and screened with free field RF energy to further enhance said emission signature of the semiconductor based device.

32. The apparatus of claim 30, wherein said antenna array, said RF collection means and said computational means are mounted on a semiconducting die substrate and being mounted on a tip of said robotic arm.

33. The apparatus of claim 30, wherein said high precision oscillator signal is a multi-tone input injection configured for aiding in developing cross-modulated and intermodulated responses that translate into unique signatures for counterfeit versus genuine semiconductor based devices.

34. The apparatus of claim 30, wherein said at least one processor is further configured to detect a counterfeited semiconductor based device.

35. A system for inspecting or screening for counterfeits of an electrical or electronic device, said system comprising:

(a) a high precision oscillator signal source configured for inputting one and only one high precision oscillator signal into the electrical or electronic device through at least one of a signal input and a clock input, said high precision oscillator signal source is being selected from a group consisting of a temperature compensated Crystal Oscillator (TCXO), a microcomputer compensated Crystal Oscillator (MXCO), an Oven Controlled Crystal Oscillator (OCXO), a small atomic frequency standard oscillator and a Rubidium oscillator (RbXO);

(b) means for collecting RF energy emitted by the electrical or electronic device in a response to said high precision oscillator signal; and

(c) means for determining, based on a comparison of characteristics of said collected RF energy against baseline RF characteristics, a genuine or a counterfeit condition of the electrical or electronic device.

36. A method for differentiating between a counterfeit and genuine semiconductor based device, said method comprising the steps of:

(a) generating, with a high precision signal source, a high precision oscillator signal;

(b) injecting said high precision oscillator signal into a semiconductor through at least one of a clock input and a signal input;

(c) collecting, with an RF collection means, emissions given off by said semiconductor based device in response to said high precision oscillator signal injected in step (b);

(d) comparing characteristics of said RF emissions, collected in step (c), against baseline RF characteristics of a genuine semiconductor based device;

(e) determining, based on said comparison, said one of said counterfeit and genuine semiconductor based device; and

(f) repeating steps (a) through (c) with different frequency settings on said high precision oscillator signal injected into at least two inputs on the semiconductor based device and comparing RF collection data for each high precision oscillator signal injected individually to expected signature and injection into all inputs simultaneously.

37. A method for differentiating between a counterfeit and genuine semiconductor based device, said method comprising the steps of:

establishing baseline RF characteristics representative of said genuine semiconductor based device, said establishing said baseline RF characteristics representative of said genuine semiconductor based device comprising obtaining local spectral power density statistics by sampling a plurality of semiconductor based devices and discriminating said plurality of semiconductor based devices based on localized statistical feature measured on each of emissions common between sampled semiconductor based devices

generating, with a high precision signal source, a high precision oscillator signal;

injecting said high precision oscillator signal into a semiconductor through at least one of a clock input and a signal input;

collecting, with an RF collection means, emissions given off by said semiconductor based device in response to said high precision oscillator signal injected into said semiconductor

comparing characteristics of said collected RF emissions, against said baseline RF characteristics of a genuine semiconductor based device; and

determining, based on said comparison, said one of said counterfeit and genuine semiconductor based device.

38. An apparatus for at least one of inspecting and screening at least one semiconductor based device installed on a printed circuit board assembly, said apparatus comprising:

a robotic arm;

a controller configured to control a movement of said robotic arm over different locations of the printed circuit board assembly;

a high precision signal oscillator source generating a high precision oscillator signal for injection into the printed circuit board assembly;

an antenna array comprising a low noise amplifier;

a receiver connected to said antenna array, said receiver configured to receive emission radiated by said at least one semiconductor based device injected with said high precision oscillator signal;

at least one processor coupled to said receiver and configured to at least one of inspect and screen the at least one semiconductor based device; and

an active illumination source configured to illuminate the semiconductor based device that is at least one of inspected and screened with free field RF energy to enhance the emissions signature of the semiconductor based device.

39. A method for differentiating between a counterfeit and genuine semiconductor based device, said method comprising the steps of:

(a) generating, with a high precision signal source, a high precision oscillator signal;

(b) injecting said high precision oscillator signal into a semiconductor based device through at least one of a clock input and a signal input;

(c) collecting, with an RF collection means, emissions given off by said semiconductor based device in response to said high precision oscillator signal injected in step (b);

(d) comparing characteristics of said RF emissions, collected in step (c), against baseline RF characteristics of a genuine semiconductor based device, where a step of establishing said baseline RF characteristics comprises a step of obtaining local spectral power density statistics by sampling a plurality of semiconductor based devices and by discriminating said plurality of semiconductor based devices based on localized statistical feature measured on each of emissions common between sampled semiconductor based devices, said statistical feature comprising at least one of Emission Frequency Location, Emission Peak Magnitude, Emission Phase Noise, Emission Symmetry, Skewness, and Emission Local Noise Floor; and

(e) determining, based on said comparison, said semiconductor based device as one of said counterfeit and said genuine semiconductor based device.

40. A method for differentiating between a counterfeit and a genuine semiconductor based device, said method comprising the steps of:

(a) generating, with a high precision signal source, a high precision oscillator signal, said high precision signal source is being selected from a group consisting of a temperature compensated Crystal Oscillator (TCXO), a microcomputer compensated Crystal Oscillator (MXCO), an Oven Controlled Crystal Oscillator (OCXO), a small atomic frequency standard oscillator and a Rubidium oscillator (RbXO);

(b) injecting said high precision oscillator signal into a semiconductor based device through at least one of a clock input and a signal input;

(c) collecting, with an RF collection means, emissions given off by said semiconductor based device in response to said high precision oscillator signal injected in step (b);

(d) repeating the steps (a) through (c) with identical settings on said high precision oscillator signal injected into said semiconductor based device;

(e) comparing characteristics of said RF emissions, collected in step (c), against baseline RF characteristics of a genuine semiconductor based device; and

(f) determining, based on said comparison, said semiconductor based device as one of said counterfeit and said genuine semiconductor based device.

41. A method for differentiating between a counterfeit and a genuine semiconductor based device, said method comprising the steps of:

(a) generating, with a high precision signal source, a high precision oscillator signal;

(b) injecting said high precision oscillator signal into a semiconductor based device through at least one of a clock input and a signal input;

(c) collecting, with an RF collection means, emissions given off by said semiconductor based device in response to said high precision oscillator signal injected in step (b);

(d) repeating the steps (a) through (c) with identical settings on said high precision oscillator signal injected into said semiconductor based device;

(e) comparing characteristics of said RF emissions, collected in step (c), against baseline RF characteristics of the genuine semiconductor based device;

(f) determining, based on said comparison, said semiconductor based device as said one of said counterfeit and said genuine semiconductor based device; and

(g) using narrow-band RF emissions for further inspection and comparison of RF emission signatures observed in wideband RF emission responses.