Optical sensor packages employing cloaking layers

• US 10,475,937 B1
• Filed: 03/30/2018
• Issued: 11/12/2019
• Est. Priority Date: 03/30/2017
• Status: Active Grant

• Current Assignee: Maxim Integrated Products, Inc. (Analog Devices, Inc.)
• Original Assignee: Maxim Integrated Products, Inc. (Analog Devices, Inc.)
• Inventors: Jones, Joy T., Hanks, John, Samoilov, Arkadii V., Easson, Craig A.
• Primary Examiner(s): Nguyen, Dao H
• Application Number:
  US15/941,765
• Time in Patent Office: 592 Days
• Field of Search: 257 80, 257 81, 257 82, 257 84, 257433, 257774, 257E31095, 257E31096, 257E31117, 257E31121, 257E33076, 257E23145, 438 25, 438 26, 438 64, 438123, 2503381, 25023114, 250221, 250216
• CPC Class Codes: G01J 1/0204 Compact construction
• CPC Class Codes: G01J 1/0233 Handheld
• CPC Class Codes: G01J 1/0271 Housings; Attachments or accessories for photometers
• CPC Class Codes: G01J 1/0418 using attenuators
• CPC Class Codes: G01J 1/044 using shutters
• CPC Class Codes: G01J 3/526 for choosing a combination of different colours, e.g. to produce a pleasing effect for an observer
• CPC Class Codes: G01S 17/04 Systems determining the presence of a target
• CPC Class Codes: G01S 7/4813 Housing arrangements
• CPC Class Codes: G02F 1/0147 based on thermo-optic effects G02F1/132 takes precedence
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/1016 comprising transparent or semitransparent devices
• CPC Class Codes: H01L 31/125 Composite devices with photosensitive elements and electroluminescent elements within one single body
• CPC Class Codes: H01L 31/153 formed in, or on, a common substrate
• CPC Class Codes: H01L 31/173 formed in, or on, a common substrate
• CPC Class Codes: H01S 5/183 having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

Abstract

An optical sensor package includes a substrate, a wall disposed upon the substrate, and a cover layer disposed on the wall. The substrate, the wall, and the cover layer at least partially define a cavity. The optical sensor package also includes a sensor disposed upon the substrate within the cavity. A cloaking layer is disposed upon to the cover layer. The cloaking layer is transmissive to at least a portion of a light spectrum and is configured to at least partially conceal the sensor. In some examples, the optical sensor package also includes a light source disposed upon the substrate within another cavity at least partially defined by the wall and the cover layer.

Claims

1. An optical sensor package, comprising:

a substrate;

at least one wall disposed on the substrate;

at least one glass layer disposed on the at least one wall, where the substrate, the at least one wall, and the at least one glass layer define a first cavity and a second cavity;

at least one application specific integrated circuit disposed on the substrate and within the first cavity;

at least one light source disposed on the substrate and within the second cavity; and

a switchable layer disposed on the at least one glass layer, wherein the switchable layer comprises a thermochromic layer.

2. The optical sensor package as recited in claim 1, further comprising at least a second glass layer, wherein the switchable layer is disposed between the first glass layer and the second glass layer.

3. The optical sensor package as recited in claim 1, wherein the switchable layer comprises electrically switchable smart glass.

4. The optical sensor package as recited in claim 1, wherein the at least one application specific integrated circuit comprises an optical sensor selected from a photodiode or a thermopile.

5. The optical sensor package as recited in claim 1, further comprising:

at least one through-glass via disposed in the at least one glass layer, where the at least one through-glass via electrically connects the switchable layer with a redistribution layer disposed in the at least one wall.

6. The optical sensor package as recited in claim 1, wherein the at least one application specific integrated circuit comprises an optical sensor selected from a photodiode or a thermopile.

7. The optical sensor package as recited in claim 1, wherein the switchable layer comprises a thermochromic layer.

8. An optical sensor package, comprising:

a substrate;

at least one wall disposed on the substrate;

at least one optically transparent layer disposed over the at least one wall, where the substrate, the at least one wall, and the at least one optically transparent layer define a first cavity and a second cavity;

at least one application specific integrated circuit disposed on the substrate and within the first cavity;

at least one light source disposed on the substrate and within the second cavity;

at least one mirror layer disposed on the at least one optically transparent layer, where the at least one mirror layer obscures the optical sensor package;

a switchable layer disposed on the at least one optically transparent layer, wherein the switchable layer comprises a thermochromic layer.

9. The optical sensor package as recited in claim 8, wherein the at least one application specific integrated circuit comprises an optical sensor.

10. The optical sensor package as recited in claim 8, wherein the at least one mirror layer comprises aluminum.

11. The optical sensor package as recited in claim 8, wherein the at least one mirror layer comprises a first mirror layer disposed on a first side of the at least one optically transparent layer and a second mirror layer disposed on a second side of the at least one optically transparent layer.

12. The optical sensor package as recited in claim 8, wherein the at least one mirror layer is disposed on a side of the at least one optically transparent layer facing the substrate or on a side of the at least one optically transparent layer distal the substrate.

13. The optical sensor package as recited in claim 8, wherein the at least one mirror layer is partially disposed on the at least one optically transparent layer.

14. The optical sensor package as recited in claim 8, wherein the at least one optically transparent layer comprises a first optically transparent layer and a second optically transparent layer, where the at least one mirror layer is disposed between the first optically transparent layer and the second optically transparent layer.

15. An optical sensor package, comprising:

a substrate;

at least one wall disposed on the substrate;

at least one glass layer disposed on the at least one wall, where the substrate, the at least one wall, and the at least one glass layer define a first cavity and a second cavity;

at least one application specific integrated circuit disposed on the substrate and within the first cavity;

at least one light source disposed on the substrate and within the second cavity;

a switchable layer disposed on the at least one glass layer; and

at least one through-glass via disposed in the at least one glass layer, where the at least one through-glass via electrically connects the switchable layer with a redistribution layer disposed in the at least one wall.

16. The optical sensor package as recited in claim 15, further comprising at least a second glass layer, wherein the switchable layer is disposed between the first glass layer and the second glass layer.

17. The optical sensor package as recited in claim 15, wherein the switchable layer comprises electrically switchable smart glass.