Wireless communication link using near field coupling

• US 10,476,556 B2
• Filed: 10/16/2018
• Issued: 11/12/2019
• Est. Priority Date: 12/11/2009
• Status: Active Grant

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Abdulla, Mostafa Naguib
• Primary Examiner(s): Talukder, Md K
• Application Number:
  US16/162,294
• Publication Number:
  US 20190052316A1
• Time in Patent Office: 392 Days
• CPC Class Codes: G11C 5/04 Supports for storage elements , e.g. memory modules; Mounting or fixing of storage elements on such supports
• CPC Class Codes: H01L 2223/6611 Wire connections
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48245 the item being metallic
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1434 Memory
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 7/005 with variable reactance for tuning the antenna
• CPC Class Codes: H04B 5/00 : Near-field transmission systems, e.g. inductive or capacitive transmission systems
• CPC Class Codes: H04B 5/26 : using coils
• CPC Class Codes: H04B 5/48 : Transceivers
• CPC Class Codes: H04B 5/72 : for local intradevice communication

Abstract

A memory device may include an array of closely spaced memory integrated circuits that communicate wirelessly over at least two frequencies using near field coupling.

Claims

1. An apparatus comprising:

a substrate having an upper surface, a lower surface parallel to the upper surface, and a plurality of side surfaces perpendicular to and extending between the upper surface and the lower surface; and

a plurality of loop antennas, each loop antenna of the plurality of loop antennas parallel to a respective side surface of the plurality of side surfaces and transversely oriented to the upper surface and the lower surface, each loop antenna of the plurality of loop antennas comprising;

a first portion of the loop antenna on the upper surface,

a second portion of the loop antenna on the lower surface, and

a via coupling the first portion of the loop antenna to the second portion of the loop antenna.

2. The apparatus of claim 1, wherein the upper surface of the substrate comprises an upper loop antenna.

3. The apparatus of claim 2, wherein the lower surface of the substrate comprises a lower loop antenna.

4. The apparatus of claim 3, wherein each loop antenna of the plurality of loop antennas is transversely oriented relative the upper loop antenna and the lower loop antenna.

5. The apparatus of claim 3, wherein each loop antenna of the plurality of loop antennas further comprises a third portion of the loop antenna on the upper surface.

6. The apparatus of claim 5, wherein each loop antenna of the plurality of loop antennas further comprises a second via configured to electrically couple the third portion of the loop antenna to the second portion of the loop antenna.

7. The apparatus of claim 6, wherein the first and third portions comprise conductive strips plated or printed on the upper surface.

8. The apparatus of claim 6, wherein the second portion comprises an internal conductive layer plated or printed on the lower surface.

9. The apparatus of claim 3, further comprising an integrated circuit chip located on the upper surface and configured to control the upper loop antenna, the lower loop antenna, and the plurality of loop antennas.

10. The apparatus of claim 9, wherein the integrated circuit chip is at least partially surrounded by the upper loop antenna.

11. An apparatus comprising:

a substrate having a plurality of orthogonal faces, including a top face and a bottom face positioned opposite the top face;

a plurality of loop antennas, wherein each loop antenna of the plurality of loop antennas is located proximate and parallel to one of the plurality of orthogonal faces, a loop antenna of the plurality of loop antennas comprising a first portion proximate the top face and a second portion proximate the bottom face, the first portion electrically coupled to the second portion, wherein each loop antenna of the plurality of loop antennas is transversely oriented relative the top face and the bottom face; and

an integrated circuit chip configured to control transmission of information from the plurality of loop antennas.

12. The apparatus of claim 11, further comprising a first loop antenna within the substrate and adjacent the top face.

13. The apparatus of claim 12, further comprising a second loop antenna within the substrate and adjacent the bottom face.

14. The apparatus of claim 13, wherein the first loop antenna and the second loop antenna are each perpendicular to each of the loop antennas.

15. The apparatus of claim 13, further comprising an array of memory integrated circuits, wherein each of the memory integrated circuits comprises the substrate, the plurality of loop antennas, and the integrated circuit chip.

16. The apparatus of claim 15, wherein a first memory integrated circuit of the array is communicatively coupled to a second memory integrated circuit of the array by near field communication.

17. The apparatus of claim 16, wherein a single loop antenna of the first memory integrated circuit is communicatively coupled to a single loop antenna of the second memory integrated circuit.

18. The apparatus of claim 17, wherein the single loop antenna of the first memory integrated circuit is parallel to the single loop antenna of the second memory integrated circuit.

19. The apparatus of claim 16, wherein the first memory integrated circuit is physically coupled to the second memory integrated circuit.

20. The apparatus of claim 13, wherein the integrated circuit chip is positioned proximate the top face and surrounded by the first loop antenna.