Top port multi-part surface mount silicon condenser microphone
First Claim
1. An acoustic device comprising:
- a substantially planar support member comprising;
a rigid top layer comprising;
a first non-conductive laminate material layer;
a first conductive layer disposed on an upper surface of the first laminate material layer; and
a mounting region disposed along a periphery of an upper surface of the top layer,wherein the first conductive layer is patterned to form a first electrical interface comprising a plurality of electrically-conductive pads;
a rigid bottom layer comprising;
a second non-conductive laminate material layer; and
a second conductive layer disposed on a lower surface of the second laminate material layer,wherein the second conductive layer is pattered to form a second electrical interface comprising a plurality of electrically-conductive flat solder pads that are substantially flush with the lower surface of the second laminate material layer, andwherein the second electrical interface enables reflow solder attachment of the acoustic device; and
a plurality of electrical vias within the support member that electrically couple the plurality of conductive pads of the first electrical interface to the plurality of conductive flat solder pads of the second electrical interface;
a micro-electro-mechanical system (MEMS) microphone die mounted to the top layer of the support member and electrically coupled to at least one of the conductive pads of the first electrical interface; and
a single-piece shield member that includes an acoustic port,wherein the shield member is a rectangular box-shaped shell of solid material with one open side, the shield member having sidewall portions with a predetermined height to space a top portion of the shield member from the upper surface of the top layer of the support member, the sidewall portions having an attachment surface, the acoustic port disposed in the top portion of the shield member and passing completely through the shield member,wherein the attachment surface of the sidewall portions of the shield member is aligned with and attached to the mounting region of the support member, andwherein the open side of the shield member enables the shield member, in cooperation with the upper surface of the top layer of the support member, to form a protective enclosure for the MEMS microphone die to reduce electromagnetic interference.
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Accused Products
Abstract
A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device'"'"'s printed circuit board and for making electrical connections between the microphone package and the device'"'"'s circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.
9 Citations
20 Claims
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1. An acoustic device comprising:
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a substantially planar support member comprising; a rigid top layer comprising; a first non-conductive laminate material layer; a first conductive layer disposed on an upper surface of the first laminate material layer; and a mounting region disposed along a periphery of an upper surface of the top layer, wherein the first conductive layer is patterned to form a first electrical interface comprising a plurality of electrically-conductive pads; a rigid bottom layer comprising; a second non-conductive laminate material layer; and a second conductive layer disposed on a lower surface of the second laminate material layer, wherein the second conductive layer is pattered to form a second electrical interface comprising a plurality of electrically-conductive flat solder pads that are substantially flush with the lower surface of the second laminate material layer, and wherein the second electrical interface enables reflow solder attachment of the acoustic device; and a plurality of electrical vias within the support member that electrically couple the plurality of conductive pads of the first electrical interface to the plurality of conductive flat solder pads of the second electrical interface; a micro-electro-mechanical system (MEMS) microphone die mounted to the top layer of the support member and electrically coupled to at least one of the conductive pads of the first electrical interface; and a single-piece shield member that includes an acoustic port, wherein the shield member is a rectangular box-shaped shell of solid material with one open side, the shield member having sidewall portions with a predetermined height to space a top portion of the shield member from the upper surface of the top layer of the support member, the sidewall portions having an attachment surface, the acoustic port disposed in the top portion of the shield member and passing completely through the shield member, wherein the attachment surface of the sidewall portions of the shield member is aligned with and attached to the mounting region of the support member, and wherein the open side of the shield member enables the shield member, in cooperation with the upper surface of the top layer of the support member, to form a protective enclosure for the MEMS microphone die to reduce electromagnetic interference. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An acoustic device comprising:
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a substantially planar support member comprising; a rigid top layer comprising; a first non-conductive laminate material layer; a first conductive layer disposed on an upper surface of the first laminate material layer; and a mounting region disposed along a periphery of an upper surface of the top layer, wherein the first conductive layer is patterned to form a first electrical interface comprising a plurality of electrically-conductive soldering pads; a rigid bottom layer comprising; a second non-conductive laminate material layer; and a second conductive layer disposed on a lower surface of the second laminate material layer, wherein the second conductive layer is pattered to form a second electrical interface comprising a plurality of electrically-conductive flat solder pads that are substantially flush with the lower surface of the second laminate material layer, and wherein the second electrical interface enables reflow solder attachment of the acoustic device; and a plurality of electrical vias within the support member that electrically couple the plurality of conductive pads of the first interface to the plurality of conductive flat solder pads of the second electrical interface; and an acoustic port disposed in an interior region of the support member and passing completely through the support member, wherein one of the plurality of flat solder pads of the second electrical interface is a metal ring that completely surrounds the acoustic port in the support member; and a micro-electro-mechanical system (MEMS) microphone die mounted to the upper surface of the top layer of the support member and electrically coupled to at least one of the conductive pads of the first electrical interface, the MEMS microphone die being disposed directly over the acoustic port in the support member; and a single-piece shield member, wherein the shield member is a rectangular box-shaped shell of solid material with one open side, the shield member having sidewall portions with a predetermined height to space a top portion of the shield member from the upper surface of the top layer of the support member, the sidewall portions having an attachment surface, wherein the attachment surface of the sidewall portions of the shield member is aligned with and attached to the mounting region of the support member, and wherein the open side of the shield member enables the shield member, in cooperation with the upper surface of the top layer of the support member, to form a protective enclosure for the MEMS microphone die to reduce electromagnetic interference. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification