High frequency ultrasonic transducer and matching layer comprising cyanoacrylate

• US 10,478,859 B2
• Filed: 11/07/2016
• Issued: 11/19/2019
• Est. Priority Date: 03/02/2006
• Status: Active Grant

• Current Assignee: FUJIFILM SonoSite, Inc. (Fujifilm Holdings Corporation)
• Original Assignee: FUJIFILM SonoSite, Inc. (Fujifilm Holdings Corporation)
• Inventors: Chaggares, Nicholas Christopher, Mehi, James, Hirson, Desmond
• Primary Examiner(s): Martin, J. San
• Application Number:
  US15/345,479
• Publication Number:
  US 20170144195A1
• Time in Patent Office: 1,107 Days
• CPC Class Codes: A61B 8/4209 by using holders, e.g. positioning frames
• CPC Class Codes: B06B 1/06 operating with piezoelectric effect or with electrostriction piezoelectric or electrostrictive devices per se H10N30/00
• CPC Class Codes: B06B 1/067 which is used as, or combined with, an impedance matching layer
• CPC Class Codes: B06B 3/00 Methods or apparatus specially adapted for transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: G10K 11/02 Mechanical acoustic impedances; Impedance matching, e.g. by horns; Acoustic resonators
• CPC Class Codes: G10K 11/30 using refraction, e.g. acoustic lenses
• CPC Class Codes: G10K 9/122 using piezoelectric driving means G10K9/121 takes precedence
• CPC Class Codes: H10N 30/50 having a stacked or multilayer structure
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 428/31855 Of addition polymer from unsaturated monomers

Abstract

In one aspect, matching layers for an ultrasonic transducer stack having a matching layer comprising a matrix material loaded with a plurality of micron-sized and nano-sized particles. In another aspect, the matrix material is loaded with a plurality of heavy and light particles. In another aspect, an ultrasound transducer stack comprises a piezoelectric layer and at least one matching layer. In one aspect, the matching layer comprises a composite material comprising a matrix material loaded with a plurality of micron-sized and nano-sized particles. In a further aspect, the composite material can also comprise a matrix material loaded with a plurality of heavy and light particles. In a further aspect, a matching layer can also comprise cyanoacrylate.

Claims

1. An ultrasonic transducer stack, comprising:

a plurality of layers comprising;

a piezoelectric layer;

at least one matching layer that comprises a first matching layer, which comprises cyanoacrylate; and

a lens layer comprising TPX,

wherein each layer of the plurality of layers has a top surface and an opposed bottom surface, wherein the first matching layer is connected to and underlies the bottom surface of the lens layer, and wherein the piezoelectric layer underlies the bottom surface of the matching layer.

2. The ultrasonic transducer stack of claim 1, wherein the first matching layer is about a ¼

acoustic wavelength matching layer.

3. The ultrasonic transducer stack of claim 2, wherein the acoustic impedance of the first matching layer is between about 2.0 MegaRayles (MR) to about 3.5 MegaRayles (MR).

4. The ultrasonic transducer stack of claim 2, wherein the acoustic impedance of the first matching layer is between about 2.5 MegaRayles (MR) to about 2.8 MegaRayles (MR).

5. The ultrasonic transducer stack of claim 2, wherein the acoustic impedance of the lens layer is about 1.8 MegaRayles (MR).

6. The ultrasonic transducer stack of claim 1, wherein the acoustic impedance of the lens is substantially the same as the acoustic impedance of water.

7. The ultrasonic transducer stack of claim 1, wherein the piezoelectric layer can generate ultrasound at a frequency of at least about 20 megahertz (MHz).

8. The ultrasonic transducer stack of claim 7, wherein the piezoelectric layer can generate ultrasound at a frequency of about 20 MHz, 25 MHz, 30 MHz, 35 MHz, 40 MHz, 45 MHz, 50 MHz, 55 MHz, 60 MHz, or higher for transmission through the first matching layer and then through the lens layer.

9. The ultrasonic transducer stack of claim 1, further comprising a second matching layer located between the top surface of the piezoelectric layer and the bottom surface of the first matching layer.

10. The ultrasonic transducer stack of claim 9, wherein the top surface of the second matching layer is bonded to the bottom surface of the first matching layer using a bonding material.

11. The ultrasonic transducer stack of claim 10, wherein the bonding material forms a bondline layer between the first matching layer and the second matching layer.

12. The ultrasonic transducer stack of claim 11, wherein the bondline layer has an elevational thickness of less than about 5 microns.

13. The ultrasonic transducer stack of claim 11, wherein the bondline layer has an elevational thickness of between about 1 micron to about 5 microns.

14. The ultrasonic transducer stack of claim 11, wherein the bondline layer has an elevational thickness of between about 1 micron to about 3 microns.