×

Method for decorating substrates and decorated substrate

  • US 10,479,072 B2
  • Filed: 10/01/2014
  • Issued: 11/19/2019
  • Est. Priority Date: 10/15/2013
  • Status: Active Grant
First Claim
Patent Images

1. A method for decorating substrates, comprising the following steps:

  • printing at least one first decorative pattern (2) with a first printing ink composition (3) onto the substrate (1), the substrate being a glass vessel,printing at least one second decorative pattern (4) with a second printing ink composition (5) onto the substrate (1), at least sectionally in a region adjacent to the first pattern (2), temporarily before, after, or during the printing of the first pattern,wherein the second printing ink composition (5) when radiation-cured, has a lower glass transition temperature than the first printing ink composition (3) when radiation-cured, and wherein a hot stamping method (10) is used to apply a decorative coating to the second pattern (4), for which purpose hot stamping foil comprising a decorative coating material is pressed with exposure to heat and pressure, by means of a stamping tool (12) against the printed substrate (1), at least sectionally in the region of the first and second patterns (4), so that the decorative coating adheres to the second pattern (4), but not to the first pattern (2),wherein the first and the second printing ink compositions (3, 5) are radiation-curable and wherein the first and second printing ink compositions (3, 5) are radiation-cured before the hot stamping method, and wherein the second printing ink composition (5) comprises a base composition having at least one radical photoinitiator and no cationic photoinitiator, andwherein the base composition comprises at least one epoxy resin based on bisphenol A, which is in solution in a UV-curing monomer, and also a resin having functional groups which free functional hydroxy, epoxide, acid, acid anhydride and/or acrylate groups, and further a wax, and wherein on irradiation of the second printing ink composition (5), the epoxy resin based on bisphenol A is not crosslinked with the UV-curable monomer, but is instead merely physically embedded, and wherein a weight fraction of a heat-activatable pressure-sensitive adhesive in the second printing ink composition (5) is between 10% and 25%.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×