×

Methods and systems for microelectronic packaging

  • US 10,481,336 B2
  • Filed: 08/17/2015
  • Issued: 11/19/2019
  • Est. Priority Date: 08/15/2014
  • Status: Active Grant
First Claim
Patent Images

1. A device comprising:

  • a substrate;

    an optical waveguide structure comprising;

    an optical waveguide formed upon a substrate;

    a first suspended optical waveguide section coupled at a first end to the optical waveguide and at a second distal end to a first end of a non-suspended optical waveguide section;

    the non-suspended optical waveguide section disposed upon an arm of a first microelectromechanical systems (MEMS) micro-positioner; and

    a second suspended waveguide coupled at a first end to a second distal end of the non-suspended optical waveguide section;

    the first MEMS micro-positioner comprising a first portion for providing motion of the arm coupled to a first end of the arm;

    whereinthe optical waveguide structure is continuous from the first suspended optical waveguide section to the second suspended optical waveguide section.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×