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Method for forming thermally stable organosilicon polymer film

  • US 10,483,099 B1
  • Filed: 07/26/2018
  • Issued: 11/19/2019
  • Est. Priority Date: 07/26/2018
  • Status: Active Grant
First Claim
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1. A method of forming a thermally stable organosilicon polymer, comprising:

  • (i) depositing an organosilicon polymer whose backbone is primarily or partly composed of silicon atoms on a substrate using a silicon-containing precursor in a reaction space; and

    (ii) exposing the organosilicon polymer deposited in step (i) to a hydrogen plasma in the absence of the precursor in the reaction space in a manner increasing Si—

    H bonds and decreasing C—

    H bonds in the organosilicon polymer without depositing an organosilicon polymer.

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