Display devices and methods for forming display devices

• US 10,483,434 B2
• Filed: 07/26/2017
• Issued: 11/19/2019
• Est. Priority Date: 01/03/2017
• Status: Active Grant

• Current Assignee: InnoLux Corporation
• Original Assignee: InnoLux Corporation
• Inventors: Liu, Tung-Kai, Hsieh, Tsau-Hua, Wang, Hui-Chieh, Kuo, Shu-Ming, Chao, Ming-I, Hu, Shun-Yuan
• Primary Examiner(s): Nguyen, Cuong Q
• Application Number:
  US15/659,947
• Publication Number:
  US 20180190876A1
• Time in Patent Office: 846 Days
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2933/0025 relating to coatings
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A display device is provided. The display device includes a thin-film transistor substrate, a conductive pad disposed on the thin-film transistor substrate, and an adhesion film disposed on the conductive pad. The adhesion film includes a plurality of conductive particles. The display device also includes a light-emitting component disposed on the adhesion film. The light-emitting component includes a connection feature. The display device also includes a protection layer partially surrounding the light-emitting component. The connection feature of the light-emitting component has a lower portion not surrounded by the protection layer. The adhesion film has a thickness of T, one of the plurality of conductive particles has a diameter of d, the lower portion of the connection feature has a thickness of t, and 0<t≤T−d.

Claims

1. A display device, comprising:

a thin-film transistor substrate;

a conductive pad disposed on the thin-film transistor substrate;

an adhesion film disposed on the conductive pad, the adhesion film comprising a plurality of conductive particles;

a light-emitting component disposed on the adhesion film, the light-emitting component comprising a first connection feature and a second connection feature; and

a protection layer partially surrounding the light-emitting component, wherein each of the first connection feature and the second connection feature has a lower portion not surrounded by the protection layer and the protection layer between the first connection feature and the second connection feature comprises an organic sub-layer and an inorganic sub-layer, and

wherein the adhesion film has a thickness of T, one of the plurality of conductive particles has a diameter of d, the lower portion of the connection feature has a thickness of t, and 0<

t≤

T−

d.

2. The display device as claimed in claim 1, wherein the connection feature comprises a first bump and a second bump, a distance G is between the first bump and the second bump, and d≤

G/2.

3. The display device as claimed in claim 2, wherein the protection layer fills a gap between the first bump and the second bump.

4. The display device as claimed in claim 1, wherein d≤

T≤

3d.

5. The display device as claimed in claim 1, wherein the lower portion of the connection feature comprises a first metal, the conductive pad comprises a second metal, the plurality of conductive particles comprises a third metal, and wherein the first metal comprises Sn, Ag, In, Cu, Au, Zn, Bi, Sb, or a combination thereof, the second metal comprises Sn, Ag, In, Cu, Au, Zn, Bi, Sb, or a combination thereof, and the third metal comprises Sn, Ag, In, Cu, Au, Ni, Pd, Cr, Al, Ti, or a combination thereof.

6. The display device as claimed in claim 1, wherein the lower portion of the connection feature comprises a first metal, the conductive pad comprises a second metal, the plurality of conductive particles comprises a third metal, and wherein the first metal comprises Sn, Ag, In, Cu, Au, Zn, Bi, Sb, Ni, Pd, Cr, Al, Ti, or a combination thereof, the second metal comprises Sn, Ag, In, Cu, Au, Zn, Bi, Sb, Ni, Pd, Cr, Al, Ti, or a combination thereof, and the third metal comprises Sn, Ag, In, Cu, Au, Zn, Bi, Sb, or a combination thereof.

7. The display device as claimed in claim 1, wherein the protection layer comprises an organic sub-layer and an inorganic sub-layer surrounding the organic sub-layer.

8. The display device as claimed in claim 7, wherein outermost sidewalls of the organic sub-layer is between outermost sidewalls of the light-emitting component.

9. The display device as claimed in claim 8, wherein outermost sidewalls of the inorganic sub-layer is between outermost sidewalls of the light-emitting component.

10. The display device as claimed in claim 7, wherein the protection layer further comprises another inorganic sub-layer, and the organic sub-layer is interposed between the inorganic sub-layer and the another inorganic sub-layer.

11. A light-emitting structure, comprising:

a light-emitting component comprising a first connection feature and a second connection feature; and

a protection layer partially surrounding the light-emitting component and filling a gap between the first connection feature and the second connection feature of the light-emitting component, wherein the protection layer between the first connection feature and the second connection feature comprises an organic sub-layer and an inorganic sub-layer.

12. The light-emitting structure as claimed in claim 11, wherein the inorganic sub-layer is the outermost layer of the protection layer.

13. The light-emitting structure as claimed in claim 11, wherein outermost sidewalls of the organic sub-layer is between outermost sidewalls of the light-emitting component.

14. The light-emitting structure as claimed in claim 13, wherein outermost sidewalls of the inorganic sub-layer is between outermost sidewalls of the light-emitting component.

15. The light-emitting structure as claimed in claim 11, wherein the protection layer further comprises another inorganic sub-layer, and the organic sub-layer is interposed between the inorganic sub-layer and the another inorganic sub-layer.

16. The light-emitting structure as claimed in claim 11, wherein a thickness of the organic sub-layer is 0.1 μ

m to 10 μ

m.

17. The light-emitting structure as claimed in claim 11, wherein a thickness of the inorganic sub-layer is 0.1 μ

m to 10 μ

m.

18. The light-emitting structure as claimed in claim 11, wherein a thickness of the organic sub-layer is different from a thickness of the inorganic sub-layer.