Display apparatus and manufacturing method thereof

• US 10,483,436 B2
• Filed: 08/02/2018
• Issued: 11/19/2019
• Est. Priority Date: 08/05/2016
• Status: Active Grant

• Current Assignee: InnoLux Corporation
• Original Assignee: InnoLux Corporation
• Inventors: Lee, Kuan-Feng, Hung, Ting-Kai, Wu, Yu-Hsien, Chang, Chia-Hsiung
• Primary Examiner(s): Ho, Tu-Tu V
• Application Number:
  US16/053,786
• Publication Number:
  US 20180351047A1
• Time in Patent Office: 474 Days
• Field of Search: 257 13
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2933/0025 relating to coatings
• CPC Class Codes: H01L 33/007 comprising nitride compounds
• CPC Class Codes: H01L 33/06 within the light emitting region, e.g. quantum confinement structure or tunnel barrier
• CPC Class Codes: H01L 33/22 Roughened surfaces, e.g. at the interface between epitaxial layers
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A display apparatus is provided. The display apparatus includes a substrate, a transistor, a metal layer, and a light-emitting diode. The transistor is disposed on the substrate. The metal layer is disposed on the transistor and electrically connected to the transistor, wherein a first distance is between the upper surface of the metal layer and the substrate in a direction perpendicular to the substrate. The light-emitting diode is disposed on the metal layer, wherein the light-emitting diode includes a light-emitting diode body and an electrode, the light-emitting diode body is electrically connected to the metal layer via the electrode, the light-emitting diode body has a first surface and a second surface opposite to the first surface, the first surface and the second surface are parallel to the substrate, and in the direction above, a second distance is between the first surface and the second surface, wherein the ratio of the second distance to the first distance is greater than or equal to 0.25 and less than or equal to 6.

Claims

1. A manufacturing method of a display apparatus, comprising:

forming a light-emitting diode body on a substrate, wherein a method of forming the light-emitting diode body comprises;

forming a first conductivity type semiconductor material layer, an active material layer, and a second conductivity type semiconductor material layer on the substrate in order;

forming a first patterned photoresist layer on the second conductivity type semiconductor material layer, wherein the first patterned photoresist layer is formed by a half tone process;

performing a reflow process on the first patterned photoresist layer; and

removing a portion of the first conductivity type semiconductor material layer, a portion of the active material layer, and a portion of the second conductivity type semiconductor material layer using the reflowed first patterned photoresist layer as a mask to form a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer; and

forming a reflective structure on a sidewall of the light-emitting diode body, wherein a method of forming the reflective structure comprises;

forming a first material layer and a second material layer on the light-emitting diode body in order;

performing a first etching process on the second material layer using a second patterned photoresist layer as a mask; and

performing a second etching process on the first material layer using the second patterned photoresist layer as a mask.

2. The manufacturing method of the display apparatus of claim 1, wherein a material of the first material layer is an insulating material, a material of the second material layer is a metal material, the first etching process is a wet etching process, and the second etching process is a dry etching process.

3. The manufacturing method of the display apparatus of claim 1, wherein a material of the first material layer and the second material layer is an insulating material, an refractive index of the first material layer is different from an refractive index of the second material layer, and the first etching process and the second etching process are dry etching processes, wherein in the dry etching processes, an etch rate of the first material layer is less than an etch rate of the second material layer.

4. The manufacturing method of the display apparatus of claim 1, further comprising, after the reflective structure is formed:

forming a conductive layer on the substrate, wherein the conductive layer covers the second patterned photoresist layer and the second conductivity type semiconductor layer; and

removing the second patterned photoresist layer and the conductive layer covering the second patterned photoresist layer and keeping the conductive layer covering the second conductivity type semiconductor layer, wherein the conductive layer covering the second conductivity type semiconductor layer is used as a first electrode.

5. The manufacturing method of the display apparatus of claim 4, further comprising, after the first electrode is formed, forming a second electrode on the first conductivity type semiconductor layer.

6. A manufacturing method of a display apparatus, comprising:

forming a light-emitting diode body on a substrate, wherein a method of forming the light-emitting diode body comprises;

forming a first conductivity type semiconductor material layer, an active material layer, and a second conductivity type semiconductor material layer on the substrate in order;

forming a first patterned photoresist layer on the second conductivity type semiconductor material layer, wherein the first patterned photoresist layer is formed by a half tone process;

performing a reflow process on the first patterned photoresist layer; and

removing a portion of the first conductivity type semiconductor material layer, a portion of the active material layer, and a portion of the second conductivity type semiconductor material layer using the reflowed first patterned photoresist layer as a mask to form a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer; and

forming a reflective structure on a sidewall of the light-emitting diode body,

wherein the manufacturing method further comprises forming a first electrode on the second conductivity type semiconductor material layer before the light-emitting diode body is formed, wherein the first patterned photoresist layer covers the first electrode.

7. The manufacturing method of the display apparatus of claim 6, further comprising, after the light-emitting diode body is formed, forming a second electrode on the substrate, wherein the second electrode is in contact with the first conductivity type semiconductor layer.

8. The manufacturing method of the display apparatus of claim 7, wherein a method of forming the reflective structure comprises:

forming a first insulating material layer and a second insulating material layer on the substrate in order after the second electrode is formed, wherein an refractive index of the first insulating material layer is different from an refractive index of the second insulating material layer; and

removing a portion of the first insulating material layer and a portion of the second insulating material layer using a patterned organic layer as a mask to form the reflective structure and a plurality of openings exposing the first electrode and the second electrode.

9. The manufacturing method of the display apparatus of claim 7, wherein a method of forming the reflective structure comprises:

forming an insulating material layer on the substrate after the second electrode is formed;

removing a portion of the insulating material layer using a patterned photoresist layer as a mask to form an insulating layer and an opening exposing the first electrode; and

forming a conductive layer covering the insulating layer and filled in the opening to be in contact with the first electrode.

10. The manufacturing method of the display apparatus of claim 6, wherein a method of forming the reflective structure comprises:

forming an insulating material layer on the substrate;

removing a portion of the insulating material layer using a patterned photoresist layer as a mask to form an insulating layer and an opening exposing the first electrode; and

forming a second electrode and a conductive layer, wherein the second electrode covers the insulating layer and is in contact with the first conductivity type semiconductor layer, and the conductive layer is filled in the opening to be in contact with the first electrode.