High speed communication jack

• US 10,483,702 B2
• Filed: 11/15/2018
• Issued: 11/19/2019
• Est. Priority Date: 02/13/2012
• Status: Active Grant

• Current Assignee: Sentinel Connector Systems, Inc.
• Original Assignee: Sentinel Connector Systems, Inc.
• Inventors: Robinson, Brett D.
• Primary Examiner(s): Gushi, Ross N
• Application Number:
  US16/192,139
• Publication Number:
  US 20190089105A1
• Time in Patent Office: 369 Days
• CPC Class Codes: H01R 13/646 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match non-coaxed protective earth or shield arrangements H01R13/648; coaxed connectors specially adapted for high frequency H01R24/40
• CPC Class Codes: H01R 13/6474 by variation of conductive properties, e.g. by dimension variations
• CPC Class Codes: H01R 13/6581 Shield structure
• CPC Class Codes: H01R 13/6625 with capacitive component
• CPC Class Codes: H01R 13/6658 on printed circuit board H01R13/6666 - H01R13/6691 take precedence
• CPC Class Codes: H01R 13/7195 with planar filters with openings for contacts
• CPC Class Codes: H01R 2107/00 Four or more poles
• CPC Class Codes: H01R 24/64 for high frequency, e.g. RJ 45
• CPC Class Codes: H01R 43/205 with a panel or printed circuit board
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/0228 Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors balanced signal pairs H05K1/0245
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49218 with deforming

Abstract

A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.

Claims

1. A high speed communication jack comprising:

a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug;

a shielding case surrounding the housing;

a circuit board disposed in part between the shielding case and the housing, wherein the circuit board comprises

a substrate having a first side and a second side opposite the first side,

a plurality of pin vias extending through the substrate where each of the pin vias is configured to accommodate a pin on the housing,

a plurality of traces on the first side of the substrate where each trace extends from a corresponding one of the plurality of pin vias;

a shielding trace layer disposed on the first side of the substrate including a pair of shielding tabs disposed on opposite edges of the first side of the substrate and a shielding trace disposed on the first side of the substrate opposite the first plurality of pin vias where the shielding trace extends between and connects the shielding tabs,

a shielding plane on the second side of the substrate,

a plurality of return vias extending through the substrate with each of the return vias connecting the shielding trace layer and the shielding plane,

wherein, a height, width, length and spacing of at least two traces are adjusted such that an impedance of the at least two traces is substantially the same.

2. The high speed communication jack of claim 1, wherein each trace includes a first portion having a variable width and a second portion having a substantially contact width.

3. The high speed communication jack of claim 2, wherein the first portion is disposed non-coplanar with the second portion.

4. The high speed communication jack of claim 1, wherein the shielding plane engages the shielding case.

5. The high speed communication jack of claim 1, wherein a capacitor is formed by a coating surrounding a periphery of each pin via and the shielding layer.

6. The high speed communication jack of claim 5, wherein a distance between the shielding layer and the traces is adjusted such that the capacitor has a value of between approximately 0.1 pf and approximately 0.5 pf.

7. A circuit board for a high speed communication jack having a housing with a shielding case, the circuit board disposed between the housing and the shielding case comprising:

a substrate having a first side and a second side opposite the first side,

a plurality of pin vias extending through the substrate where each of the pin vias is configured to accommodate a pin on the housing,

a plurality of traces on the first side of the substrate where each trace extends from a corresponding one of the plurality of pin vias;

a shielding trace layer disposed on the first side of the substrate including a pair of shielding tabs disposed on opposite edges of the first side of the substrate and a shielding trace disposed on the first side of the substrate opposite the first plurality of pin vias where the shielding trace extends between and connects the shielding tabs,

a shielding plane on the second side of the substrate,

a plurality of return vias extending through the substrate with each of the return vias connecting the shielding trace layer and the shielding plane,

wherein, the substrate is non-coplanar and a height, width, length and spacing of at least two traces are adjusted such that an impedance of the at least two traces is substantially the same.

8. The circuit board of claim 7, wherein a capacitor is formed by a coating surrounding a periphery of each pin via and the shielding layer.

9. The circuit board of claim 8, wherein a distance between the shielding layer and the traces is adjusted such that the capacitor has a value of between approximately 0.1 pf and approximately 0.5 pf.

10. The circuit board of claim 7, wherein the substrate comprises a dielectric material having a dielectric constant greater than 3.0.