Multi-part flexible encapsulation housing for electronic devices and methods of making the same
First Claim
1. A conformal integrated circuit (IC) device comprising:
- a flexible substrate;
an electronic circuitry attached to the flexible substrate; and
a flexible multi-part encapsulation housing at least substantially encasing therein the electronic circuitry and the flexible substrate, the multi-part encapsulation housing including a first encapsulation housing component attached to a second encapsulation housing component, the first encapsulation housing component having at least one first recessed region for seating therein the electronic circuitry, and the second encapsulation housing component having at least one second recessed region for seating therein the flexible substrate,wherein the electronic circuitry includes a plurality of device islands and a plurality of stretchable electrical interconnects electrically connecting two or more of the device islands.
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Accused Products
Abstract
Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal IC device is disclosed which includes a flexible substrate, electronic circuitry attached to the flexible substrate, and a flexible multi-part encapsulation housing encasing therein the electronic circuitry and flexible substrate. The multi-part housing includes first and second encapsulation housing components. The first encapsulation housing component has recessed regions for seating therein the electronic circuitry, while the second encapsulation housing component has recessed regions for seating therein the flexible substrate. First encapsulation housing component optionally includes a recessed region for seating therein the flexible substrate. Either housing component may include one or more projections that pass through holes in the substrate to engage complementary depressions in the other housing component to thereby align and interlock the encapsulation housing components with the flexible substrate and electronic circuitry.
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Citations
24 Claims
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1. A conformal integrated circuit (IC) device comprising:
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a flexible substrate; an electronic circuitry attached to the flexible substrate; and a flexible multi-part encapsulation housing at least substantially encasing therein the electronic circuitry and the flexible substrate, the multi-part encapsulation housing including a first encapsulation housing component attached to a second encapsulation housing component, the first encapsulation housing component having at least one first recessed region for seating therein the electronic circuitry, and the second encapsulation housing component having at least one second recessed region for seating therein the flexible substrate, wherein the electronic circuitry includes a plurality of device islands and a plurality of stretchable electrical interconnects electrically connecting two or more of the device islands. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. An encapsulated conformal electronics device comprising:
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a flexible printed circuit board (FPCB); a plurality of surface-mount technology (SMT) components configured as integrated circuit (IC) devices mounted on the FPCB; a plurality of stretchable electrical interconnects electrically connecting two or more of the SMT components; and a flexible bipartite encapsulation housing encasing therein the FPCB, the SMT components and the stretchable electrical interconnects, the flexible bipartite encapsulation housing including top and bottom housings segments, the top encapsulation housing segment having first prefabricated recessed regions for seating therein the SMT components and the stretchable electrical interconnects, and the bottom encapsulation housing segment having second prefabricated recessed regions for seating therein the FPCB. - View Dependent Claims (15)
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16. A method for encapsulating a conformal electronic device, the method comprising:
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molding a top flexible encapsulation housing component; molding a bottom flexible encapsulation housing component; placing the bottom flexible encapsulation housing component into an assembly fixture; dispensing a first shot of adhesive onto the bottom flexible encapsulation housing component; placing a flexible printed circuit board assembly (FPCBA) on top of the first shot of adhesive and the bottom flexible encapsulation housing component in the assembly fixture; dispensing a second shot of adhesive onto the FPCBA and the bottom flexible encapsulation housing component; and placing the top flexible encapsulation housing component on top of the FPCBA and the second shot of adhesive in the assembly fixture to create a stack and thereby encase the FPCBA between the top and bottom flexible encapsulation housing components, wherein the FPCBA comprises a flexible substrate and a plurality of device islands electrically connected via stretchable electrical interconnects, and wherein the top encapsulation housing component comprises a first recessed substrate region for seating therein the flexible substrate. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24)
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Specification