×

Semiconductor manufacturing device with embedded fluid conduits

  • US 10,486,232 B2
  • Filed: 04/21/2015
  • Issued: 11/26/2019
  • Est. Priority Date: 04/21/2015
  • Status: Active Grant
First Claim
Patent Images

1. A method comprising:

  • forming a conduit embedded between an interior surface and an exterior surface of a sidewall of a tubular component of an ion source using an additive manufacturing process, wherein the additive manufacturing process includes forming the conduit and the component simultaneously by depositing a series of horizontal layers of a material stacked into a desired configuration of the component, wherein the conduit includes a set of raised features formed on an inner surface of the conduit, and wherein the conduit has a pentagonal cross-section defined by a bottom surface, a set of sidewalls, and a substantially triangular-shaped top portion; and

    connecting the conduit with an inlet and outlet located within a base section of the tubular component, wherein the inlet, the outlet, and the conduit operate to deliver a cooling fluid through the tubular component.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×