×

Film application method

  • US 10,486,408 B2
  • Filed: 06/08/2016
  • Issued: 11/26/2019
  • Est. Priority Date: 06/15/2015
  • Status: Active Grant
First Claim
Patent Images

1. A film application method that applies a functional film to a substrate, the method comprising the steps of:

  • (1) applying a first adhesive layer to the substrate, with a foreign-substance-removing unit including the first adhesive layer and a first film being overlaid onto a main unit including a second film, a second adhesive layer, and the functional film; and

    (2) while peeling off both the foreign-substance-removing unit and the second film, with one end of the functional film fixed to the substrate, by pulling ends of the foreign-substance-removing unit and the second film adjacent to the fixed end of the functional film through between the substrate and the functional film, applying the second adhesive layer exposed by removal of the second film to the surface of the substrate exposed by removal of the foreign-substance-removing unit,wherein in the step (1), the foreign-substance-removing unit and the main unit are combined with each other, andwherein in the step (2), the foreign-substance-removing unit and the main unit are separated by injection of a gas between the foreign-substance-removing unit and the main unit, and the ends of the foreign-substance-removing unit and the second film adjacent to a temporary fixing member are pulled out.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×