LED filament
First Claim
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1. An LED filament, comprising:
- a linear array of LED chips operably interconnected to emit light upon energization;
a conductive electrode;
a plurality of electrical conductors to electrically connect the linear array of LED chips and the conductive electrode; and
a light conversion coating to cover the linear array of LED chips and the plurality of electrical conductors, wherein;
the light conversion coating includes a top layer and a base layer conformally interconnected to form a unitary enclosure;
the top layer and the base layer jointly configure an uneven interface;
the linear array of LED chips is sandwiched between the top layer and the base layer; and
a first LED chip in the linear array of LED chips is guided by the uneven interface to a different angle in relation to a second LED chip in the linear array of the LED chips.
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Abstract
An LED filament configured to emit omnidirectional light includes a linear array of LED chips operably interconnected to emit light upon energization and a conductive electrode. The linear array of LED chips is electrically connected with the conductive electrode. A light conversion coating encloses the linear array of the LED chip and the conductive electrode. The light conversion layer includes a top layer and a base layer conformally interconnected to form a unitary enclosure. The top layer is coated on a first side of the linear array of LED chips and the conductive electrode. The base layer is coated on a second side of the linear array of LED chips and the conductive electrode.
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Citations
18 Claims
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1. An LED filament, comprising:
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a linear array of LED chips operably interconnected to emit light upon energization; a conductive electrode; a plurality of electrical conductors to electrically connect the linear array of LED chips and the conductive electrode; and a light conversion coating to cover the linear array of LED chips and the plurality of electrical conductors, wherein; the light conversion coating includes a top layer and a base layer conformally interconnected to form a unitary enclosure; the top layer and the base layer jointly configure an uneven interface; the linear array of LED chips is sandwiched between the top layer and the base layer; and a first LED chip in the linear array of LED chips is guided by the uneven interface to a different angle in relation to a second LED chip in the linear array of the LED chips. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification