LED filament

• US 10,487,987 B2
• Filed: 12/19/2016
• Issued: 11/26/2019
• Est. Priority Date: 08/17/2015
• Status: Active Grant

• Current Assignee: Zhejiang Super Lighting Electric Appliance Company Limited
• Original Assignee: Zhejiang Super Lighting Electric Appliance Company Limited
• Inventors: Jiang, Tao, Li, Liqin
• Primary Examiner(s): Gramling, Sean P
• Application Number:
  US15/384,311
• Publication Number:
  US 20170130906A1
• Time in Patent Office: 1,072 Days
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21K 9/238 Arrangement or mounting of circuit elements integrated in the light source
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21V 19/003 Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21V 3/061 the material being glass
• CPC Class Codes: F21V 3/062 the material being plastics
• CPC Class Codes: F21Y 2103/33 annular
• CPC Class Codes: F21Y 2103/37 U-shaped
• CPC Class Codes: F21Y 2107/00 Light sources with three-dimensionally disposed light-generating elements
• CPC Class Codes: F21Y 2107/50 on planar substrates or supports, but arranged in different planes or with differing orientation, e.g. on plate-shaped supports with steps on which light-generating elements are mounted
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An LED filament configured to emit omnidirectional light includes a linear array of LED chips operably interconnected to emit light upon energization and a conductive electrode. The linear array of LED chips is electrically connected with the conductive electrode. A light conversion coating encloses the linear array of the LED chip and the conductive electrode. The light conversion layer includes a top layer and a base layer conformally interconnected to form a unitary enclosure. The top layer is coated on a first side of the linear array of LED chips and the conductive electrode. The base layer is coated on a second side of the linear array of LED chips and the conductive electrode.

Claims

1. An LED filament, comprising:

a linear array of LED chips operably interconnected to emit light upon energization;

a conductive electrode;

a plurality of electrical conductors to electrically connect the linear array of LED chips and the conductive electrode; and

a light conversion coating to cover the linear array of LED chips and the plurality of electrical conductors, wherein;

the light conversion coating includes a top layer and a base layer conformally interconnected to form a unitary enclosure;

the top layer and the base layer jointly configure an uneven interface;

the linear array of LED chips is sandwiched between the top layer and the base layer; and

a first LED chip in the linear array of LED chips is guided by the uneven interface to a different angle in relation to a second LED chip in the linear array of the LED chips.

2. The LED filament in claim 1, wherein:

the plurality of electrical conductors includes a plurality of conductive wires and a plurality of conductive foils;

the top layer is coated on a first side of the linear array of LED chips and the conductive electrode;

the base layer is coated on a second side of the linear array of LED chips and the conductive electrode;

the top layer includes at least one of a phosphor glue layer and a phosphor film layer;

the top layer further includes, optionally, a transparent layer;

the base layer includes at least one of a phosphor glue layer and a phosphor film layer; and

the base layer further includes, optionally, a transparent layer.

3. The LED filament in claim 1, wherein the weight of the linear array of the LED chips is carried by the base layer.

4. The LED filament in claim 3, wherein an LED chip in the linear array of the LED chips is guided by the uneven interface to a different angle in relation to an adjacent LED chip in the linear array of the LED chips.

5. The LED filament in claim 3, wherein:

a first set of LED chips in the linear array of the LED chips are guided by the uneven interface to a first angle;

a second set of LED chips in the linear array of the LED chips are guided by the uneven interface to a second angle; and

the first angle is different from the second angle.

6. The LED filament in claim 2, further comprising:

a first portion of the LED filament for emitting light; and

a second portion of the LED filament for absorbing mechanical energy that could otherwise damage the LED filament when the LED filament is stretched or compressed, wherein;

the first portion of the LED filament includes the linear array of LED chips, the plurality of conductive wires and a first slice of the light conversion coating covering the linear array of LED chips and covering the plurality of conductive wires; and

the second portion of the LED filament includes the plurality of conductive foils and a second slice of the light conversion coating covering the plurality of conductive foils.

7. The LED filament in claim 6, wherein the first portion of the LED filament alternates with the second portion of the LED filament along an axial direction in relation to the LED filament.

8. The LED filament in claim 6, wherein the light conversion coating includes a posture maintainer such that the LED filament is capable of self-sustained plastic deformation.

9. The LED filament in claim 6, wherein the second slice of the light conversion coating includes a posture maintainer such that the LED filament is capable of self-sustained plastic deformation.

10. The LED filament in claim 9, wherein the posture maintainer includes a wire system embedded in the light conversion coating.

11. The LED filament in claim 10 wherein the wire system includes a set of straight wires extending longitudinally in the light conversion coating.

12. The LED filament in claim 9, wherein the posture maintainer includes an aperture system on a surface of the second slice of the light conversion coating where tight turns are planned for a posture the LED filament is expected to maintain.

13. The LED filament in claim 7, wherein the first portion of the LED filament is thickened.

14. The LED filament in claim 7, wherein the first portion of the LED filament includes a hardener.

15. The LED filament in claim 7, wherein a conductive wire defines an M-shape.

16. The LED filament in claim 7, wherein:

the light conversion coating includes an adhesive and a phosphor; and

a plurality of heat transfer paths is formed by adjacent and contacted phosphors.

17. The LED filament in claim 14, wherein:

the plurality of heat transfer paths defines spokes of a wheel; and

an LED chip defines a hub of the wheel.

18. The LED filament in claim 17, wherein the light conversion coating further includes an auxiliary wire extending longitudinally in the LED filament for improving toughness of the LED filament.