Two-dimensional structure to form an embedded three-dimensional structure

• US 10,490,348 B2
• Filed: 06/24/2016
• Issued: 11/26/2019
• Est. Priority Date: 06/24/2016
• Status: Active Grant

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Qualcomm, Inc.
• Inventors: Velez, Mario Francisco, Kim, Daeik Daniel, Mudakatte, Niranjan Sunil, Berdy, David Francis, Yun, Changhan Hobie, Kim, Jonghae, Zuo, Chengjie, Ma, Yunfei, Mikulka, Robert Paul
• Primary Examiner(s): Enad, Elvin G
• Assistant Examiner(s): Baisa, Joselito
• Application Number:
  US15/192,802
• Publication Number:
  US 20170372831A1
• Time in Patent Office: 1,250 Days
• Field of Search: 336200, 257774, 438639, 438672
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 2017/002 Details of via holes for interconnecting the layers
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H01L 2224/023 Redistribution layers [RDL] for bonding areas
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/24195 the item being a discrete passive component
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/96 the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/1206 Inductor
• CPC Class Codes: H01L 2924/18162 of a chip with build-up interconnect
• CPC Class Codes: H01L 2924/19042 being an inductor
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate

Abstract

Disclosed is an apparatus including a plurality of vias each having a defined shape, wherein each of the plurality of vias includes a first two-dimensional conductive layer plated on a first side of a substrate, the first two-dimensional conductive layer having the defined shape, a second two-dimensional conductive layer plated on a second side of the substrate, the second two-dimensional conductive layer having the defined shape, and a via conductively coupling the first two-dimensional conductive layer to the second two-dimensional conductive layer. The apparatus further includes a plurality of interconnects configured to conductively couple the plurality of vias, wherein the first two-dimensional conductive layer and the second two-dimensional conductive layer of each of the plurality of vias are perpendicular to the plurality of interconnects.

Claims

1. An apparatus, comprising:

a plurality of vias each having a defined shape, wherein each of the plurality of vias comprises;

a first two-dimensional conductive layer plated on a first side of a substrate, the first two-dimensional conductive layer having the defined shape,

a second two-dimensional conductive layer plated on a second side of the substrate, the second two-dimensional conductive layer having the defined shape, and

a via conductively coupling the first two-dimensional conductive layer to the second two-dimensional conductive layer; and

a plurality of interconnects configured to conductively couple the plurality of vias, wherein the first two-dimensional conductive layer and the second two-dimensional conductive layer of each of the plurality of vias are perpendicular to the plurality of interconnects.

2. The apparatus of claim 1, wherein the apparatus comprises an inductor device.

3. The apparatus of claim 2, wherein the defined shape is a curved shape.

4. The apparatus of claim 3, further comprising a magnetic core of the inductor device within an aperture defined by the curved shape of the plurality of vias.

5. The apparatus of claim 2, wherein the defined shape is an “

I”

shape.

6. The apparatus of claim 1, wherein the defined shape is a “

C”

shape.

7. The apparatus of claim 1, wherein the defined shape is a semicircle shape.

8. The apparatus of claim 1, wherein the apparatus comprises an embedded three-dimensional (3D) coil.

9. The apparatus of claim 1, wherein the via directly couples the first two-dimensional conductive layer to the second two-dimensional conductive layer.

10. The apparatus of claim 1, wherein the via substantially matches the defined shape.

11. The apparatus of claim 10, wherein the defined shape is one of a “

C”

shape or a semicircle shape.

12. The apparatus of claim 1, wherein the first two-dimensional conductive layer and the second two-dimensional conductive layer are parallel to each other.

13. The apparatus of claim 12, wherein a first portion of the first two-dimensional conductive layer is coplanar with a second portion of the second two-dimensional conductive layer.

14. The apparatus of claim 13, wherein the first portion and the second portion are separated by the via.

15. An apparatus, comprising:

a plurality of vias each having a defined shape, wherein each of the plurality of vias comprises;

a first two-dimensional conductive means plated on a first side of a substrate, the first two-dimensional conductive means having the defined shape,

a second two-dimensional conductive means plated on a second side of the substrate, the second two-dimensional conductive means having the defined shape, and

means for conductively coupling the first two-dimensional conductive means to the second two-dimensional conductive means; and

a plurality of interconnects configured to conductively couple the plurality of vias, wherein the first two-dimensional conductive means and the second two-dimensional conductive means of each of the plurality of vias are perpendicular to the plurality of interconnects.

16. The apparatus of claim 15, wherein the apparatus comprises an inductor device.

17. The apparatus of claim 16, wherein the defined shape is a curved shape.

18. The apparatus of claim 17, further comprising a magnetic core of the inductor device within an aperture defined by the curved shape of the plurality of vias.

19. The apparatus of claim 16, wherein the defined shape is an “

I”

shape.

20. The apparatus of claim 15, wherein the defined shape is a “

C”

shape.

21. The apparatus of claim 15, wherein the apparatus comprises an embedded three-dimensional (3D) coil.