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Method of producing optoelectronic components and surface-mounted optoelectronic component

  • US 10,490,707 B2
  • Filed: 05/06/2016
  • Issued: 11/26/2019
  • Est. Priority Date: 05/13/2015
  • Status: Active Grant
First Claim
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1. A method of producing optoelectronic components comprising:

  • A) providing a carrier and a multitude of separated, unconnected optoelectronic semiconductor chips, wherein each semiconductor chip comprises contact elements for external electrical contacting arranged on a contact side of the semiconductor chip;

    B) applying the semiconductor chips laterally next to one another on to the carrier, wherein the contact sides are made to face the carrier during application;

    C) applying an electrically-conductive layer at least on to subregions of the sides of the semiconductor chips not covered by the carrier, wherein the electrically-conductive layer is of contiguous design;

    D) applying a protective layer at least on to subregions of side surfaces of the semiconductor chips running transversely to the contact surface;

    E) electrophoretically depositing a converter layer on to the electrically-conductive layer, wherein the converter layer is configured to convert at least part of radiation emitted by the semiconductor chips into radiation of a different wavelength range during the intended operation; and

    F) removing the electrically-conductive layer from regions between the converter layer and the semiconductor chips, whereina connecting layer is applied on to the carrier and, during application in step B), the contact elements are pressed into the connecting layer deep enough that the contact elements are protected from being covered by the electrically-conductive layer in step C), ora protective frame is applied on to the carrier for each semiconductor chip and, during application in step B), the semiconductor chips are placed on the carrier such that the contact elements are at least partially enclosed by the corresponding protective frame, and in step C), the protective frame prevents the contact elements from being covered by the electrically-conductive layer.

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