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Methods, circuits and systems for a package structure having wireless lateral connections

  • US 10,497,655 B2
  • Filed: 02/06/2018
  • Issued: 12/03/2019
  • Est. Priority Date: 06/15/2012
  • Status: Active Grant
First Claim
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1. A packaged semiconductor device, comprisingan insulating material forming a side surface of the packaged semiconductor device;

  • an integrated-circuit chip embedded in the insulating material and including a communication circuit;

    a wiring system embedded in the insulating material and electrically coupling the integrated-circuit chip with a plurality of package contact elements; and

    a first communication pad formed in the side surface and being operatively coupled to the communication circuit so as to enable wireless signal exchange via the first communication pad.

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