Light-emitting device

• US 10,497,681 B2
• Filed: 03/19/2018
• Issued: 12/03/2019
• Est. Priority Date: 09/18/2015
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Genesis Photonics Inc.
• Inventors: Hung, Cheng-Wei, Chang, Jui-Fu, Hung, Chin-Hua, Lin, Yu-Feng
• Primary Examiner(s): Han, Jonathan
• Application Number:
  US15/924,461
• Publication Number:
  US 20180211942A1
• Time in Patent Office: 624 Days
• Field of Search: 257 81, 257 82, 257 91, 257 98, 257 99, 257100, 257116, 257117, 257432-437, 257749, 257E33056-E33059, 257E25032
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light-emitting device includes a substrate, a light-emitting component, a wavelength conversion component, an adhesive and a reflective layer. The light-emitting component is disposed on the substrate. The wavelength conversion component includes a high-density phosphor layer and a lower-density phosphor layer. The adhesive is formed between the light-emitting device and the high-density phosphor layer. The reflective layer is formed above the substrate and covers a lateral surface of the light-emitting component, a lateral surface of the adhesive and a lateral surface of the wavelength conversion component.

Claims

1. A light-emitting device, comprises:

a substrate;

a light-emitting component disposed on the substrate and electrically connected thereto;

a wavelength conversion layer, disposed on the light-emitting component and having a high-density phosphor layer and a low-density phosphor layer stacked vertically, wherein the high-density phosphor layer has a substantially uniform thickness;

an adhesive layer disposed between the light-emitting component and the substrate and covering an upper surface and a portion of a lateral surface of the light-emitting component, wherein the high-density phosphor layer is spaced from the upper surface of the light-emitting component by the adhesive layer; and

a reflective layer disposed above the substrate and at least surrounding the light-emitting component and the adhesive layer, wherein the reflective layer has an inclined reflective surface, the inclined reflective surface contacts a portion of the light-emitting component and is gradually away from the light-emitting component along a direction from the substrate toward the wavelength conversion layer.

2. The light-emitting device according to claim 1, wherein the high-density phosphor layer is disposed between the low-density phosphor layer and the light-emitting component.

3. The light-emitting device according to claim 1 wherein the inclined reflective surface is a convex surface facing the wavelength conversion layer, the adhesive layer and the light-emitting component.

4. The light-emitting device according to claim 1, wherein the reflective layer covers at least a portion of a lateral surface of the wavelength conversion layer.

5. The light-emitting device according to claim 1, wherein an area of a bottom surface of the wavelength conversion layer is larger than an area of the upper surface of the light-emitting component.

6. The light-emitting device according to claim 1, wherein the light-emitting device has a flat top surface comprising the reflective layer and the wavelength conversion layer surrounded by the reflective layer.

7. The light-emitting device according to claim 1, wherein the light-emitting device has a flat lateral surface comprising the reflective layer and the substrate.

8. A light-emitting device, comprises:

a substrate;

a light-emitting component disposed on the substrate and electrically connected thereto;

a wavelength conversion layer disposed on the light-emitting component and at least covering an upper surface of the light-emitting component, wherein the wavelength conversion layer has a substantially uniform thickness and is spaced from the upper surface of the light-emitting component by an adhesive layer adhering the wavelength conversion layer to the light-emitting component; and

a reflective layer disposed above the substrate and surrounding the light-emitting component and the wavelength conversion layer, wherein the reflective layer has a reflective surface, the reflective surface contacts at least a portion of the light-emitting component and a portion of the wavelength conversion layer.

9. The light-emitting device according to claim 8, wherein the wavelength conversion layer comprises a high-density phosphor layer and a low-density phosphor layer stacked vertically.

10. The light-emitting device according to claim 9, wherein the high-density phosphor layer is disposed between the low-density phosphor layer and the light-emitting component.

11. The light-emitting device according to claim 8, wherein the reflective layer covers at least a portion of a lateral surface of the wavelength conversion layer.

12. The light-emitting device according to claim 8, wherein an area of a bottom surface of the wavelength conversion layer is equal to an area of the upper surface of the light-emitting component.

13. The light-emitting device according to claim 8, wherein the light-emitting device has a flat lateral surface comprising the reflective layer and the substrate.

14. A light-emitting device, comprises:

a substrate;

a light-emitting component disposed on the substrate and electrically connected thereto;

a wavelength conversion layer disposed on the light-emitting component, wherein the wavelength conversion layer has a substantially uniform thickness;

an adhesive layer disposed between the light-emitting component and the substrate and covering an upper surface and at least a portion of the lateral surface of the light-emitting component, wherein the wavelength conversion layer is spaced from the upper surface of the light-emitting component by the adhesive layer; and

a reflective layer disposed above the substrate and surrounding the light-emitting component, the adhesive layer and the wavelength conversion layer, wherein the reflective layer has an inclined reflective surface, the inclined reflective surface contacts a portion of the light-emitting component and a portion of the wavelength conversion layer, and the inclined reflective surface is gradually away from the light-emitting component along a direction from the substrate toward the wavelength conversion layer;

wherein the light-emitting device has a flat lateral surface comprising the reflective layer and the substrate.

15. The light-emitting device according to claim 14, wherein the wavelength conversion layer comprises a high-density phosphor layer and a low-density phosphor layer stacked vertically.

16. The light-emitting device according to claim 15, wherein the high-density phosphor layer is disposed between the low-density phosphor layer and the light-emitting component.

17. The light-emitting device according to claim 14 wherein the inclined reflective surface is a convex surface facing the wavelength conversion layer, the adhesive layer and the light-emitting component.

18. The light-emitting device according to claim 14, wherein the reflective layer covers at least a portion of a lateral surface of the wavelength conversion layer.