Fingerprint sensing chip packaging method and fingerprint sensing chip package
First Claim
1. A fingerprint sensing chip packaging method, comprising:
- providing a cover plate;
providing a fingerprint sensing chip, wherein a fingerprint sensing region and contact pads arranged at periphery of the fingerprint sensing region are arranged on a front surface of the fingerprint sensing chip, electrically connecting the contact pads to a back surface of the fingerprint sensing chip, and forming, on the back surface of the fingerprint sensing chip, a first conductive structure electrically connected to the contact pads;
laminating the front surface of the fingerprint sensing chip with a back surface of the cover plate;
providing a flexible printed circuit, wherein a second conductive structure is arranged on a back surface of the flexible printed circuit, and an opening is arranged in the flexible printed circuit;
laminating a front surface of the flexible printed circuit with the back surface of the cover plate, wherein the fingerprint sensing chip is arranged in the opening; and
electrically connecting the first conductive structure to the second conductive structure.
1 Assignment
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Accused Products
Abstract
A fingerprint sensing chip packaging method and package are provided. The method includes: providing a cover plate, providing a fingerprint sensing chip, where a fingerprint sensing region and contact pads at periphery of the region are arranged on a front surface of the chip, electrically connecting the contact pads to a back surface of the chip, forming a first conductive structure electrically connected to the contact pads on the back surface of the chip, laminating the front surface of the chip with a back surface of the cover plate, providing a flexible printed circuit, where a second conductive structure is arranged on a back surface of the circuit and an opening is arranged in the circuit, laminating a front surface of the circuit with the back surface of the cover plate, and electrically connecting the first conductive structure to the second conductive structure.
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Citations
18 Claims
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1. A fingerprint sensing chip packaging method, comprising:
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providing a cover plate; providing a fingerprint sensing chip, wherein a fingerprint sensing region and contact pads arranged at periphery of the fingerprint sensing region are arranged on a front surface of the fingerprint sensing chip, electrically connecting the contact pads to a back surface of the fingerprint sensing chip, and forming, on the back surface of the fingerprint sensing chip, a first conductive structure electrically connected to the contact pads; laminating the front surface of the fingerprint sensing chip with a back surface of the cover plate; providing a flexible printed circuit, wherein a second conductive structure is arranged on a back surface of the flexible printed circuit, and an opening is arranged in the flexible printed circuit; laminating a front surface of the flexible printed circuit with the back surface of the cover plate, wherein the fingerprint sensing chip is arranged in the opening; and electrically connecting the first conductive structure to the second conductive structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A fingerprint sensing chip package, comprising:
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a cover plate; a fingerprint sensing chip, wherein a fingerprint sensing region and contact pads arranged at periphery of the fingerprint sensing region are arranged on a front surface of the fingerprint sensing chip, the contact pads are electrically connected to a back surface of the fingerprint sensing chip, a first conductive structure electrically connected to the contact pads is formed on the back surface of the fingerprint sensing chip, and the front surface of the fingerprint sensing chip is laminated with a back surface of the cover plate; and a flexible printed circuit, wherein a second conductive structure is arranged on a back surface of the flexible printed circuit, an opening is arranged in the flexible printed circuit, a front surface of the flexible printed circuit is laminated with the back surface of the cover plate, the fingerprint sensing chip is arranged in the opening, and the first conductive structure is electrically connected to the second conductive structure. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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Specification