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Reflection frequency conversion device using active metamaterial surface and ECM system

  • US 10,498,042 B2
  • Filed: 11/14/2016
  • Issued: 12/03/2019
  • Est. Priority Date: 11/13/2015
  • Status: Active Grant
First Claim
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1. A reflection frequency conversion device using an active metamaterial surface comprising:

  • a plate-shaped active metamaterial surface which is configured to continuously convert a phase of a reflected wave by changing surface impedance characteristics in accordance with input voltage; and

    an arbitrary waveform generator which provides a voltage waveform in a form of linearly and periodically changing a voltage level with respect to time to the metamaterial surface, wherein the phase of the reflected wave is linearly and periodically changed with respect to the time through the voltage waveform,wherein a reflection frequency generated on the metamaterial surface is converted in accordance with a frequency of the voltage waveform provided from the arbitrary waveform generator,wherein a plurality of metamaterial unit structures are periodically disposed on the metamaterial surface,wherein each of the plurality of metamaterial unit structures is a high impedance surface (HIS) having at least one variable capacitor, and the capacitance of each of the at least one variable capacitor is changed in accordance with the voltage waveform to change the phase of the reflected wave,wherein in each of the plurality of metamaterial unit structures, a dielectric plate with a predetermined thickness is disposed between a conductive lower plate and upper plate,wherein the upper plate comprises a band-shaped first pattern plate with a hollow and a second pattern plate disposed in the hollow of the first pattern plate, wherein a band-shaped line pattern is formed by a separation interval located between the first pattern plate and the second pattern plate, thereby forming a capacitance component; and

    wherein each of the at least one variable capacitor is coupled between the first pattern plate and the second pattern plate and a center of the second pattern plate is connected to the lower plate via a via-pin thereby forming a grounding.

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