Fingerprint recognition module and manufacturing method therefor

• US 10,499,523 B2
• Filed: 11/16/2017
• Issued: 12/03/2019
• Est. Priority Date: 05/19/2017
• Status: Active Grant

• Current Assignee: Primax Electronics Limited
• Original Assignee: Primax Electronics Limited
• Inventors: Hsu, Chih-Hao
• Primary Examiner(s): Johns, Andrew W
• Application Number:
  US15/814,962
• Publication Number:
  US 20180338381A1
• Time in Patent Office: 747 Days
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing
• CPC Class Codes: G06V 40/1318 using electro-optical elements or layers, e.g. electroluminescent sensing
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 2203/1327 Moulding over PCB locally or completely applying non-metallic protective coatings for encapsulating mounted components H05K3/284
• CPC Class Codes: H05K 3/0097 Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards H05K3/0052 takes precedence
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 5/065 sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding

Abstract

The present invention provides a fingerprint recognition module, including: a substrate, a fingerprint sensing die fixed on the substrate, an encapsulation layer covering the fingerprint sensing die and the substrate, the encapsulation layer having a composition plane, and an imprint layer, where the imprint layer is formed on the composition plane.

Claims

1. A fingerprint recognition module, comprising:

a substrate;

a fingerprint sensing die, wherein the fingerprint sensing die is fixed on the substrate;

an encapsulation layer, wherein the encapsulation layer covers the fingerprint sensing die and the substrate, and the encapsulation layer has a composition plane, wherein the composition plane is formed by means of a plane grinding step; and

an imprint layer, wherein

the imprint layer is formed on the composition plane.

2. The fingerprint recognition module according to claim 1, wherein the imprint layer has a high-gloss surface and the high-gloss surface does not have a die mark.

3. The fingerprint recognition module according to claim 1, wherein the encapsulation layer is made of an epoxy molding compound (EMC) material.

4. The fingerprint recognition module according to claim 1, wherein a thickness of the encapsulation layer ranges from 0.25 mm to 0.85 mm.

5. The fingerprint recognition module according to claim 1, wherein a thickness of the imprint layer ranges from 28 μ

m to 44 μ

m.

6. The fingerprint recognition module according to claim 1, wherein the imprint layer comprises:

a light-curable ink layer, a heat-curable ink layer, a hybrid ink layer, an ultraviolet-curable resin layer, or a fingerprint-resistant coating layer.

7. The fingerprint recognition module according to claim 1, wherein the substrate has a plurality of weld legs.

8. A manufacturing method for a fingerprint recognition module, comprising the following steps:

(a). providing a fingerprint sensing die connecting board, wherein the fingerprint sensing die connecting board has a substrate, an encapsulation layer, and a plurality of fingerprint sensing dies;

(b). forming a composition plane on a surface of the encapsulation layer, wherein in step (b), the composition plane is formed by means of a plane grinding step;

(c). forming an imprint layer on the composition plane of the encapsulation layer; and

(d). cutting the fingerprint sensing die connecting board to form a fingerprint recognition module.

9. A fingerprint recognition module, comprising:

a substrate;

a fingerprint sensing die, wherein the fingerprint sensing die is fixed on the substrate;

an encapsulation layer, wherein the encapsulation layer covers the fingerprint sensing die and the substrate, and the encapsulation layer has a composition plane, wherein a surface of the encapsulation layer has at least one concave part and at least one convex part, and a filling material is filled in the at least one concave part to form the composition plane; and

an imprint layer, wherein

the imprint layer is formed on the composition plane.

10. The fingerprint recognition module according to claim 9, wherein a material of the filling material is the same as a material of the encapsulation layer.

11. A manufacturing method for a fingerprint recognition module, comprising the following steps:

(a). providing a fingerprint sensing die connecting board, wherein the fingerprint sensing die connecting board has a substrate, an encapsulation layer, and a plurality of fingerprint sensing dies;

(b). forming a composition plane on a surface of the encapsulation layer, wherein a surface of the encapsulation layer has at least one concave part and at least one convex part, and a filling material is filled in the at least one concave part to form the composition plane;

(c). forming an imprint layer on the composition plane of the encapsulation layer; and

(d). cutting the fingerprint sensing die connecting board to form a fingerprint recognition module.