Hermetically sealed feedthrough with co-fired filled via and conductive insert for an active implantable medical device

• US 10,500,402 B2
• Filed: 02/12/2018
• Issued: 12/10/2019
• Est. Priority Date: 01/16/2012
• Status: Active Grant

• Current Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Original Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Inventors: Stevenson, Robert A., Tang, Xiaohong, Thiebolt, William C., Frysz, Christine A., Seitz, Keith W., Brendel, Richard L., Marzano, Thomas, Woods, Jason, Frustaci, Dominick J., Winn, Steven W.
• Primary Examiner(s): Johnson, Edward M
• Application Number:
  US15/894,239
• Publication Number:
  US 20180178017A1
• Time in Patent Office: 666 Days
• Field of Search: 502 56
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/372 Arrangements in connection with the implantation of stimulators
• CPC Class Codes: A61N 1/37512 Pacemakers
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: B22F 1/10 Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
• CPC Class Codes: B22F 2998/10 Processes characterised by the sequence of their steps
• CPC Class Codes: B22F 3/10 Sintering only
• CPC Class Codes: C22C 29/12 based on oxides
• CPC Class Codes: H01G 2/103 Sealings, e.g. for lead-in wires; Covers
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors
• CPC Class Codes: H01R 43/00 Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors of trolley lines B60M1/28
• CPC Class Codes: Y10T 156/1052 with cutting, punching, tearing or severing

Abstract

A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.

Claims

1. A dielectric substrate configured for incorporation into a hermetically sealed feedthrough, the dielectric substrate comprising:

a) at least one dielectric via hole extending through the dielectric substrate to spaced apart dielectric substrate first and second end surfaces, the at least one dielectric via hole having a dielectric via hole open volume;

b) a platinum fill comprising at least 80% platinum particles mixed with at least one binder, wherein the platinum fill is disposed in the dielectric via hole to thereby occupy at least 80% of the dielectric via hole open volume,

c) wherein, in a pre-sintered state, the dielectric substrate has a dielectric green-state volume and the platinum fill has a platinum fill green-state volume, and

d) wherein, after having been sintered, the dielectric substrate having the at least one dielectric via hole provided with the platinum fill is characterized by the platinum fill having had the binder substantially volatilized to thereby provide a sintered platinum fill volume and a sintered dielectric substrate volume, and

e) wherein the platinum fill sintered volume is less than the platinum fill green-state volume, and the dielectric sintered volume is less than the dielectric green-state volume, and

f) wherein the dielectric difference between the dielectric sintered- and green-state volumes is from 14% to 20% greater than the platinum fill difference between the platinum fill sintered- and green-state volumes so that the dielectric substrate imparts a compressive force on the platinum fill to thereby provide a hermetically sealed and electrically conductive platinum pathway through the dielectric substrate between and to the dielectric substrate first and second end surfaces.

2. The dielectric substrate of claim 1, comprising alumina.

3. The dielectric substrate of claim 1, wherein the platinum fill in the green state has, by weight, a minimum of 90% platinum particles mixed with the at least one binder.

4. The dielectric substrate of claim 1, wherein the platinum fill in the green state has, by weight, a minimum of 95% platinum particles mixed with the at least one binder.

5. The dielectric substrate of claim 1, wherein the platinum fill disposed in the dielectric via hole occupies at least 90% of the dielectric via hole open volume.

6. The dielectric substrate of claim 1, wherein the platinum fill disposed in the dielectric via hole occupies about 99% of the dielectric via hole open volume.

7. The dielectric substrate of claim 1, wherein the dielectric difference between the dielectric sintered- and green-state volumes is about 16% greater than the platinum fill difference between the platinum fill sintered- and green-state volumes.

8. A hermetically sealed feedthrough, comprising:

a) an electrically conductive ferrule comprising a ferrule opening, wherein the ferrule is configured to be attachable to an opening in a housing of an active implantable medical device;

b) a dielectric substrate at least partially residing in the ferrule opening where a gold braze hermetically seals the dielectric substrate to the ferrule, wherein at least one dielectric via hole extending through the dielectric substrate to spaced apart dielectric substrate first and second end surfaces has a dielectric via hole open volume;

c) a platinum fill comprising at least 80% platinum particles mixed with at least one binder, wherein the platinum fill is disposed within the dielectric via hole to thereby occupy at least 80% of the dielectric via hole open volume,

d) wherein, in a pre-sintered state, the dielectric substrate has a dielectric green-state volume and the platinum fill has a platinum fill green-state volume, and

e) wherein, after having been sintered, the dielectric substrate having the at least one dielectric via hole provided with the platinum fill is characterized by the platinum fill having had the binder substantially volatilized to thereby provide a sintered platinum fill volume and a sintered dielectric substrate volume, and

f) wherein the platinum fill sintered volume is less than the platinum fill green-state volume, and the dielectric sintered volume is less than the dielectric green-state volume, and

g) wherein the dielectric difference between the dielectric sintered- and green-state volumes is from 14% to 20% greater than the platinum fill difference between the platinum fill sintered- and green-state volumes so that the dielectric substrate imparts a compressive force on the platinum fill to thereby provide a hermetically sealed and electrically conductive platinum pathway through the dielectric substrate between and to the dielectric substrate first and second end surfaces.

9. The feedthrough of claim 8, wherein the dielectric substrate comprises at least 96 percent alumina.

10. The feedthrough of claim 8, wherein the platinum fill in the green state has, by weight, a minimum of 90% platinum particles mixed with the at least one binder.

11. The feedthrough of claim 8, wherein the platinum fill in the green state has, by weight, a minimum of 95% platinum particles mixed with the at least one binder.

12. The feedthrough of claim 8, wherein the platinum fill disposed in the dielectric via hole occupies at least 90% of the dielectric via hole open volume.

13. The feedthrough of claim 8, wherein the platinum fill disposed in the dielectric via hole occupies about 99% of the dielectric via hole open volume.

14. The feedthrough of claim 8, wherein the dielectric difference between the dielectric sintered- and green-state volumes is about 16% greater than the platinum fill difference between the platinum fill sintered- and green-state volumes.

15. The feedthrough of claim 8, including a conductive insert at least partially disposed within the platinum fill.

16. The feedthrough of claim 15, wherein the conductive insert is a substantially pure platinum insert.

17. The feedthrough of claim 16, wherein the hermetically sealed and electrically conductive platinum pathway comprises a second hermetic seal between the platinum fill and the platinum insert.

18. The feedthrough of claim 8, wherein a feedthrough capacitor is disposed on the second side of the dielectric substrate, the feedthrough capacitor comprising a dielectric supporting at least one active electrode plate interleaved in a capacitive relationship with at least one ground electrode plate, and wherein the at least one active electrode plate is conductively connected to the platinum pathway and the at least one ground electric plate is conductively coupled to the ferrule.