Method of manufacturing light emitting device

• US 10,505,089 B2
• Filed: 04/26/2019
• Issued: 12/10/2019
• Est. Priority Date: 01/30/2009
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Inobe, Mototaka, Yamada, Motokazu, Kamada, Kazuhiro
• Primary Examiner(s): Menz, Laura M
• Application Number:
  US16/395,321
• Publication Number:
  US 20190252583A1
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A method of manufacturing a light emitting device includes providing a substrate and establishing metallization on an upper surface of the substrate. A light emitting element is mounted on top of the metallization, and the metallization and light emitting element are electrically connected. Light reflective resin is provided at a position surrounding the light emitting element to reflect light from the light emitting element. The surfaces of metallization, a surface of the light emitting element, a conducting wire, and a top surface of the light reflective resin are covered continuously, with insulating material. An inside surrounded by the light reflective resin is filled with encapsulating material to encapsulate the light emitting element and the insulating material around the light emitting element.

Claims

1. A method of manufacturing a light emitting device, the method comprising:

providing a substrate;

establishing metallization on an upper surface of the substrate;

mounting a light emitting element on top of the metallization, and connecting electrically the metallization and light emitting element;

providing light reflective resin at a position surrounding the light emitting element to reflect light from the light emitting element;

covering continuously, with insulating material, the surfaces of metallization, a surface of the light emitting element, a conducting wire, and a top surface of the light reflective resin; and

filling an inside surrounded by the light reflective resin with encapsulating material to encapsulate the light emitting element and the insulating material around the light emitting element.

2. The method of claim 1,

wherein said providing the substrate comprises forming the substrate in approximately sheet form to establish an approximately planar surface of the substrate for mounting the light emitting element on, and

wherein said providing the light reflective resin comprises providing the light reflective resin on a same horizontal surface of the substrate where the light emitting element is mounted.

3. The method of claim 1,

wherein said providing the substrate comprises forming the substrate in a manner that defines

a first cavity;

a second cavity inside the first cavity with a bottom surface positioned below the first cavity; and

a mounting surface surrounded by the second cavity, the mounting surface being higher than the bottom surface of the second cavity,

wherein said establishing metallization comprises establishing metallization on the mounting surface of the substrate and the bottom surface of the second cavity,

wherein said mounting the light emitting element comprises mounting the light emitting element on top of the metallization established on the mounting surface of the substrate,

wherein said providing light reflective resin comprises providing light reflective resin in the second cavity to reflect light from the light emitting element, and

wherein said covering with insulating material comprises covering continuously, with insulating material, the top surface of the reflective resin in the second cavity, and the surface of metallization on the mounting surface in the first cavity.

4. The method of claim 1, wherein said light emitting element comprises nitride semiconductor made of In_XAl_YGa_1-X-YN (0≤

X, 0≤

Y, X+Y≤

1).

5. The method of claim 1, wherein the substrate includes:

a first member that is made of insulating substance; and

a second member which is made of insulating substance, the second member being dimensioned smaller than the first member and laminated on the first member.

6. The method of claim 4, wherein the substrate includes:

a first member that is made of insulating substance; and

a second member which is made of insulating substance, the second member being dimensioned smaller than the first member and laminated on the first member.